Wei LEI

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top magnets for decreased non-uniformity in PVD
- Patent number 12,112,890
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Borui Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser dicing glass wafers using advanced laser sources
- Patent number 12,091,349
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser dicing system for filamenting and singulating optical devices
- Patent number 11,964,343
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Mahendran Chidambaram
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser scribing trench opening control in wafer dicing using hybrid...
- Patent number 11,854,888
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,742,330
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of micro-via formation for advanced packaging
- Patent number 11,705,365
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation system for package fabrication
- Patent number 11,676,832
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 11,621,194
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufacturing with a polygon scanner
- Patent number 11,518,100
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Wei-Sheng Lei
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods and apparatus for controlling contact resistance in cobalt-...
- Patent number 11,424,132
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Takashi Kuratomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for selective deposition of tungsten atop a dielectric laye...
- Patent number 11,417,568
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Wei Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation for package fabrication
- Patent number 11,400,545
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using hybrid laser scribing and plasma etch approach w...
- Patent number 11,355,394
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of titanium films
- Patent number 11,286,556
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,257,790
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- Kurtis Leschkies
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser drilling blind vias
- Patent number 11,232,951
- Issue date Jan 25, 2022
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 11,217,536
- Issue date Jan 4, 2022
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-absorbing mask for hybrid laser scribing and plasma etch wafe...
- Patent number 11,158,540
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,910,271
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,714,390
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,661,383
- Issue date May 26, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,566,238
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a multiple pass laser scribing p...
- Patent number 10,535,561
- Issue date Jan 14, 2020
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,363,629
- Issue date Jul 30, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,163,713
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ternary tungsten boride nitride films and methods for forming same
- Patent number 9,969,622
- Issue date May 15, 2018
- Lam Research Corporation
- Wei Lei
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 9,972,575
- Issue date May 15, 2018
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a rotating beam laser scribing p...
- Patent number 9,852,997
- Issue date Dec 26, 2017
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer coating
- Patent number 9,768,014
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
- Publication number 20240371771
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...
- Publication number 20240355673
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Wei LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LASER DICING SYSTEM FOR FILAMENTING AND SINGULATING OPTICAL DEVICES
- Publication number 20240227081
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Mahendran CHIDAMBARAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interlayer for Resistivity Reduction in Metal Deposition Applications
- Publication number 20240194527
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
- Publication number 20240145300
- Publication date May 2, 2024
- Sahil PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY
- Publication number 20240088071
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
- Publication number 20240079273
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20240021582
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
- Publication number 20240014072
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...
- Publication number 20230343644
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
- Publication number 20230343643
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER
- Publication number 20230326791
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Zhimin QI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20230282498
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET INKS FOR DEPOSITION AND REMOVAL IN A LASER DICING PROCESS
- Publication number 20230273355
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Yingdong LUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20230207393
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR TUNGSTEN GAP FILL
- Publication number 20230134230
- Publication date May 4, 2023
- Applied Materials, Inc.
- Wei Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGULATION OF OPTICAL DEVICES FROM OPTICAL DEVICE SUBSTRATES VIA L...
- Publication number 20230123795
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING OF LITHIUM BATTERY WEB
- Publication number 20230113276
- Publication date Apr 13, 2023
- Applied Materials, Inc.
- Wei-Sheng LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP MAGNETS FOR DECREASED NON-UNIFORMITY IN PVD
- Publication number 20230088552
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Borui Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...
- Publication number 20230023235
- Publication date Jan 26, 2023
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES
- Publication number 20230002268
- Publication date Jan 5, 2023
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR SHAPING MAGNETIC FIELDS DURING SEMICONDUCTOR PROCESSING
- Publication number 20220380888
- Publication date Dec 1, 2022
- Goichi YOSHIDOME
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING
- Publication number 20220375787
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Wei-Sheng LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUC...
- Publication number 20220336227
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- TAKASHI KURATOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO DICE OPTICAL DEVICES WITH OPTIMIZATION OF LASER PULSE SP...
- Publication number 20220305588
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHIUM METAL SURFACE MODIFICATION USING CARBONATE PASSIVATION
- Publication number 20220181599
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Alejandro Sevilla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20220139884
- Publication date May 5, 2022
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wafer dicing using femtosecond-based laser and plasma etch

Top magnets for decreased non-uniformity in PVD

Laser dicing glass wafers using advanced laser sources

Laser dicing system for filamenting and singulating optical devices

Laser scribing trench opening control in wafer dicing using hybrid...

High connectivity device stacking

Methods of micro-via formation for advanced packaging

Laser ablation system for package fabrication

Wafer dicing using femtosecond-based laser and plasma etch

Additive manufacturing with a polygon scanner

Methods and apparatus for controlling contact resistance in cobalt-...

Methods for selective deposition of tungsten atop a dielectric laye...

Laser ablation for package fabrication

Wafer dicing using hybrid laser scribing and plasma etch approach w...

Selective deposition of titanium films

High connectivity device stacking

Method and apparatus for laser drilling blind vias

Hybrid wafer dicing approach using a split beam laser scribing proc...

Light-absorbing mask for hybrid laser scribing and plasma etch wafe...

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Mitigation of particle contamination for wafer dicing processes

Wafer dicing using femtosecond-based laser and plasma etch

Hybrid wafer dicing approach using a multiple pass laser scribing p...

Mitigation of particle contamination for wafer dicing processes

Wafer dicing using femtosecond-based laser and plasma etch

Ternary tungsten boride nitride films and methods for forming same

Hybrid wafer dicing approach using a split beam laser scribing proc...

Hybrid wafer dicing approach using a rotating beam laser scribing p...

Wafer coating

Patents Applicationslast 30 patents

INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS

HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...

LASER DICING SYSTEM FOR FILAMENTING AND SINGULATING OPTICAL DEVICES

Interlayer for Resistivity Reduction in Metal Deposition Applications

Buffer Layer for Dielectric Protection in Physical Vapor Deposition...

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY

LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...

HIGH CONNECTIVITY DEVICE STACKING

NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...

SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION

INKJET INKS FOR DEPOSITION AND REMOVAL IN A LASER DICING PROCESS

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

METHODS AND APPARATUS FOR TUNGSTEN GAP FILL

SINGULATION OF OPTICAL DEVICES FROM OPTICAL DEVICE SUBSTRATES VIA L...

LASER PROCESSING OF LITHIUM BATTERY WEB

TOP MAGNETS FOR DECREASED NON-UNIFORMITY IN PVD

ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...

LASER DICING GLASS WAFERS USING ADVANCED LASER SOURCES

METHODS FOR SHAPING MAGNETIC FIELDS DURING SEMICONDUCTOR PROCESSING

METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING

METHODS FOR CONTROLLING CONTACT RESISTANCE IN COBALT-TITANIUM STRUC...

GAP FILL METHODS USING CATALYZED DEPOSITION

METHODS TO DICE OPTICAL DEVICES WITH OPTIMIZATION OF LASER PULSE SP...

LITHIUM METAL SURFACE MODIFICATION USING CARBONATE PASSIVATION

HIGH CONNECTIVITY DEVICE STACKING