Wei-Luen SUEN

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna device and manufacturing method thereof
- Patent number 11,695,199
- Issue date Jul 4, 2023
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,387,201
- Issue date Jul 12, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,107,759
- Issue date Aug 31, 2021
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,153,237
- Issue date Dec 11, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,780,251
- Issue date Oct 3, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact structure with a redistribution layer connected...
- Patent number 9,640,683
- Issue date May 2, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,437,478
- Issue date Sep 6, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package
- Patent number 9,425,134
- Issue date Aug 23, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,970
- Issue date May 31, 2016
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method for manufacturing thereof
- Patent number 9,287,417
- Issue date Mar 15, 2016
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,209,124
- Issue date Dec 8, 2015
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising alignment mark and method for forming the same
- Patent number 9,165,890
- Issue date Oct 20, 2015
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and method for forming the same
- Patent number 8,963,312
- Issue date Feb 24, 2015
- Xintec, Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,952,501
- Issue date Feb 10, 2015
- Xintec, Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240351865
- Publication date Oct 24, 2024
- XINTEC INC.
- Jiun-Yen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069454
- Publication date Mar 3, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20210210538
- Publication date Jul 8, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210104455
- Publication date Apr 8, 2021
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082841
- Publication date Mar 18, 2021
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170271276
- Publication date Sep 21, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170179330
- Publication date Jun 22, 2017
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148752
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160355393
- Publication date Dec 8, 2016
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160086896
- Publication date Mar 24, 2016
- XINTEC INC.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150179831
- Publication date Jun 25, 2015
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150097286
- Publication date Apr 9, 2015
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140332968
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332908
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140203387
- Publication date Jul 24, 2014
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140054786
- Publication date Feb 27, 2014
- Xintec Inc.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140015111
- Publication date Jan 16, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130307125
- Publication date Nov 21, 2013
- Xintec Inc.
- Yu-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Luen SUEN

Person

Patents Grantslast 30 patents

Chip package and manufacturing method thereof

Antenna device and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and method for forming the same

Semiconductor structure and manufacturing method thereof

Electrical contact structure with a redistribution layer connected...

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Chip package and method for forming the same

Semiconductor chip package and method for manufacturing thereof

Chip package

Chip package comprising alignment mark and method for forming the same

Stacked chip package and method for forming the same

Chip package and method for forming the same

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MEMS DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME