Wei-Ming Hsiao

Person

Miaoli County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
ReRAM structure and method of fabricating the same
- Patent number 11,424,408
- Issue date Aug 23, 2022
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ReRAM structure and method of fabricating the same
- Patent number 11,165,019
- Issue date Nov 2, 2021
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,139,384
- Issue date Oct 5, 2021
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,490,643
- Issue date Nov 26, 2019
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material evaporator and heat dissipating apparatus usi...
- Patent number 10,443,960
- Issue date Oct 15, 2019
- Man Zai Industrial Co., Ltd.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid heat-dissipating assembly
- Patent number 10,342,159
- Issue date Jul 2, 2019
- Man Zai Industrial Co., Ltd.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,340,350
- Issue date Jul 2, 2019
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,074,725
- Issue date Sep 11, 2018
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 9,691,704
- Issue date Jun 27, 2017
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process of forming metal gates with different thresho...
- Patent number 9,659,937
- Issue date May 23, 2017
- United Microelectronics Corp.
- Ching-Yun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230213173
- Publication date Jul 6, 2023
- InnoLux Corporation
- Yen-Chi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A THIN FILM RESISTOR WITH IMPROVED THERMAL STABI...
- Publication number 20220238632
- Publication date Jul 28, 2022
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ReRAM STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210351347
- Publication date Nov 11, 2021
- UNITED MICROELECTRONICS CORP.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ReRAM STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210057643
- Publication date Feb 25, 2021
- UNITED MICROELECTRONICS CORP.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDENSER AND HEAT DISSIPATION APPARATUS
- Publication number 20200064074
- Publication date Feb 27, 2020
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200006514
- Publication date Jan 2, 2020
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR A DISPLAY UNIT
- Publication number 20190327864
- Publication date Oct 24, 2019
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PARALLEL-CONNECTED CONDENSER AND COOLING DEVICE USING THE SAME
- Publication number 20190078846
- Publication date Mar 14, 2019
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PHASE CHANGE MATERIAL EVAPORATOR AND HEAT DISSIPATING APPARATUS USI...
- Publication number 20190041144
- Publication date Feb 7, 2019
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180331193
- Publication date Nov 15, 2018
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180261675
- Publication date Sep 13, 2018
- United Microelectronics Corp.
- Shih-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID HEAT-DISSIPATING ASSEMBLY
- Publication number 20180063992
- Publication date Mar 1, 2018
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID-COOLING HEAT SINK
- Publication number 20170181317
- Publication date Jun 22, 2017
- MAN ZAI INDUSTRIAL CO., LTD.
- Cheng-Chien Wan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170148891
- Publication date May 25, 2017
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS OF FORMING METAL GATES WITH DIFFERENT THRESHO...
- Publication number 20160268259
- Publication date Sep 15, 2016
- UNITED MICROELECTRONICS CORP.
- Ching-Yun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Ming Hsiao

Person

Patents Grantslast 30 patents

ReRAM structure and method of fabricating the same

ReRAM structure and method of fabricating the same

Method for fabricating semiconductor device

Semiconductor device and method for fabricating the same

Phase change material evaporator and heat dissipating apparatus usi...

Liquid heat-dissipating assembly

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for manufacturing the same

Semiconductor process of forming metal gates with different thresho...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

METHOD FOR FORMING A THIN FILM RESISTOR WITH IMPROVED THERMAL STABI...

ReRAM STRUCTURE AND METHOD OF FABRICATING THE SAME

ReRAM STRUCTURE AND METHOD OF FABRICATING THE SAME

CONDENSER AND HEAT DISSIPATION APPARATUS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

HEAT SINK FOR A DISPLAY UNIT

PARALLEL-CONNECTED CONDENSER AND COOLING DEVICE USING THE SAME

PHASE CHANGE MATERIAL EVAPORATOR AND HEAT DISSIPATING APPARATUS USI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

LIQUID HEAT-DISSIPATING ASSEMBLY

LIQUID-COOLING HEAT SINK

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PROCESS OF FORMING METAL GATES WITH DIFFERENT THRESHO...