Wei-Yan Shih

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezo-electric sensor reset
- Patent number 12,072,229
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Michael Zwerg
- G01 - MEASURING TESTING
Information Patent Grant
Piezoelectric thin-film sensor and use thereof
- Patent number 11,740,142
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Wei-Yan Shih
- G01 - MEASURING TESTING
Information Patent Grant
Piezoelectric sensor apparatus
- Patent number 11,487,381
- Issue date Nov 1, 2022
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Differential sensor using thin-film piezoelectric capacitors
- Patent number 11,393,971
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Sudhanshu Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric thin-film sensor and use thereof
- Patent number 11,131,589
- Issue date Sep 28, 2021
- Texas Instruments Incorporated
- Wei-Yan Shih
- G01 - MEASURING TESTING
Information Patent Grant
Piezo-electric sensor reset
- Patent number 11,105,676
- Issue date Aug 31, 2021
- Texas Instruments Incorporated
- Michael Zwerg
- G01 - MEASURING TESTING
Information Patent Grant
Piezoelectric sensing apparatus and method
- Patent number 10,873,020
- Issue date Dec 22, 2020
- Texas Instruments Incorporated
- Wei-Yan Shih
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Integrated force sensing element
- Patent number 10,353,503
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Piezoelectric thin-film sensor
- Patent number 9,970,831
- Issue date May 15, 2018
- Texas Instruments Incorporated
- Wei-Yan Shih
- G01 - MEASURING TESTING
Information Patent Grant
Extended range ultrasound transducer
- Patent number 9,751,108
- Issue date Sep 5, 2017
- Texas Instruments Incorporated
- Wei-Yan Shih
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,679,864
- Issue date Jun 13, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 9,630,835
- Issue date Apr 25, 2017
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,496,171
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost window production for hermetically sealed optical packages
- Patent number 9,411,159
- Issue date Aug 9, 2016
- Texas Instruments Incorporated
- Wei-Yan Shih
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low cost window production for hermetically sealed optical packages
- Patent number 9,050,764
- Issue date Jun 9, 2015
- Texas Instruments Incorporated
- Wei-Yan Shih
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated system with computing and imaging capabilities
- Patent number 8,674,933
- Issue date Mar 18, 2014
- Texas Instruments Incorporated
- Wei-Yan Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon microphone transducer
- Patent number 8,617,960
- Issue date Dec 31, 2013
- Texas Instruments Incorporated
- Marie Denison
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon microphone with integrated back side cavity
- Patent number 8,536,666
- Issue date Sep 17, 2013
- Texas Instruments Incorporated
- Wei-Yan Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS package having formed metal lid
- Patent number 8,309,388
- Issue date Nov 13, 2012
- Texas Instruments Incorporated
- Kurt P. Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon microphone with integrated back side cavity
- Patent number 8,304,846
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Wei-Yan Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low cost window production for hermetically sealed optical packages
- Patent number 8,042,248
- Issue date Oct 25, 2011
- Texas Instruments Incorporated
- Wei-Yan Shih
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microdisplay assemblies and methods of packaging microdisplays
- Patent number 7,786,747
- Issue date Aug 31, 2010
- Texas Instruments Incorporated
- Wei-Yan Shih
- G02 - OPTICS
Information Patent Grant
Split beam micromirror
- Patent number 7,106,491
- Issue date Sep 12, 2006
- Texas Instruments Incorporated
- Thomas J. Meyer
- G02 - OPTICS
Information Patent Grant
Active border pixels for digital micromirror device
- Patent number 6,937,382
- Issue date Aug 30, 2005
- Texas Instruments Incorporated
- Wei-Yan Shih
- G02 - OPTICS
Information Patent Grant
Split beam micromirror
- Patent number 6,724,518
- Issue date Apr 20, 2004
- Texas Instruments Incorporated
- Thomas J. Meyer
Information Patent Grant
Method of growing surface aluminum nitride on aluminum films with l...
- Patent number 6,573,194
- Issue date Jun 3, 2003
- Texas Instruments Incorporated
- Keith J. Brankner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride thin film formation on integrated circuits
- Patent number 6,465,350
- Issue date Oct 15, 2002
- Texas Instruments Incorporated
- Kelly J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads for integrated circuits having copper interconnect met...
- Patent number 6,329,722
- Issue date Dec 11, 2001
- Texas Instruments Incorporated
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded flip-chip assembly of semiconductor devices
- Patent number 6,268,662
- Issue date Jul 31, 2001
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF
- Publication number 20220011177
- Publication date Jan 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan SHIH
- G01 - MEASURING TESTING
Information Patent Application
PIEZO-ELECTRIC SENSOR RESET
- Publication number 20210389174
- Publication date Dec 16, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Michael Zwerg
- G01 - MEASURING TESTING
Information Patent Application
DIFFERENTIAL SENSOR USING THIN-FILM PIEZOELECTRIC CAPACITORS
- Publication number 20200168786
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sudhanshu Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FORCE SENSING ELEMENT
- Publication number 20190339806
- Publication date Nov 7, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIEZO-ELECTRIC SENSOR RESET
- Publication number 20190162590
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Michael Zwerg
- G01 - MEASURING TESTING
Information Patent Application
Piezoelectric Sensing Apparatus and Method
- Publication number 20190051812
- Publication date Feb 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF
- Publication number 20180231423
- Publication date Aug 16, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan SHIH
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL PACKAGING OF MEMS
- Publication number 20170217759
- Publication date Aug 3, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED FORCE SENSING ELEMENT
- Publication number 20170123548
- Publication date May 4, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Extended Range Ultrasound Transducer
- Publication number 20170028439
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20170033072
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTION SENSING POWER SWITCH
- Publication number 20160329183
- Publication date Nov 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Leonardo Estevez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20160093525
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MEMS
- Publication number 20160052781
- Publication date Feb 25, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF
- Publication number 20150226618
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan SHIH
- G01 - MEASURING TESTING
Information Patent Application
LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES
- Publication number 20150205098
- Publication date Jul 23, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON MICROPHONE WITH INTEGRATED BACK SIDE CAVITY
- Publication number 20130064400
- Publication date Mar 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES
- Publication number 20120036695
- Publication date Feb 16, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Silicon Microphone Transducer
- Publication number 20110158439
- Publication date Jun 30, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon Microphone with Integrated Back Side Cavity
- Publication number 20110156179
- Publication date Jun 30, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Package Having Formed Metal Lid
- Publication number 20090267223
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kurt P. WACHTLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microdisplay Assemblies and Methods of Packaging Microdisplays
- Publication number 20090140757
- Publication date Jun 4, 2009
- Wei-Yan Shih
- G02 - OPTICS
Information Patent Application
INTEGRATED SYSTEM WITH COMPUTING AND IMAGING CAPABILITES
- Publication number 20090128481
- Publication date May 21, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low cost window production for hermetically sealed optical packages
- Publication number 20080080077
- Publication date Apr 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ACTIVE BORDER PIXELS FOR DIGITAL MICROMIRROR DEVICE
- Publication number 20050146771
- Publication date Jul 7, 2005
- Wei-Yan Shih
- G02 - OPTICS
Information Patent Application
Split beam micromirror
- Publication number 20030123126
- Publication date Jul 3, 2003
- Thomas J. Meyer
- G02 - OPTICS
Information Patent Application
Method of growing surface aluminum nitride on aluminum films with l...
- Publication number 20020009885
- Publication date Jan 24, 2002
- Keith J. Brankner
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Yan Shih

Person

Patents Grantslast 30 patents

Wafer level packaging of MEMS

Piezo-electric sensor reset

Piezoelectric thin-film sensor and use thereof

Piezoelectric sensor apparatus

Differential sensor using thin-film piezoelectric capacitors

Piezoelectric thin-film sensor and use thereof

Piezo-electric sensor reset

Piezoelectric sensing apparatus and method

Integrated force sensing element

Piezoelectric thin-film sensor

Extended range ultrasound transducer

Printed interconnects for semiconductor packages

Wafer level packaging of MEMS

Printed interconnects for semiconductor packages

Low cost window production for hermetically sealed optical packages

Low cost window production for hermetically sealed optical packages

Integrated system with computing and imaging capabilities

Silicon microphone transducer

Silicon microphone with integrated back side cavity

MEMS package having formed metal lid

Silicon microphone with integrated back side cavity

Low cost window production for hermetically sealed optical packages

Microdisplay assemblies and methods of packaging microdisplays

Split beam micromirror

Active border pixels for digital micromirror device

Split beam micromirror

Method of growing surface aluminum nitride on aluminum films with l...

Aluminum nitride thin film formation on integrated circuits

Bonding pads for integrated circuits having copper interconnect met...

Wire bonded flip-chip assembly of semiconductor devices

Patents Applicationslast 30 patents

PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF

PIEZO-ELECTRIC SENSOR RESET

DIFFERENTIAL SENSOR USING THIN-FILM PIEZOELECTRIC CAPACITORS

INTEGRATED FORCE SENSING ELEMENT

PIEZO-ELECTRIC SENSOR RESET

Piezoelectric Sensing Apparatus and Method

PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF

WAFER LEVEL PACKAGING OF MEMS

INTEGRATED FORCE SENSING ELEMENT

Extended Range Ultrasound Transducer

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

MOTION SENSING POWER SWITCH

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

WAFER LEVEL PACKAGING OF MEMS

PIEZOELECTRIC THIN-FILM SENSOR AND USE THEREOF

LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES

SILICON MICROPHONE WITH INTEGRATED BACK SIDE CAVITY

LOW COST WINDOW PRODUCTION FOR HERMETICALLY SEALED OPTICAL PACKAGES

Silicon Microphone Transducer

Silicon Microphone with Integrated Back Side Cavity

MEMS Package Having Formed Metal Lid

Microdisplay Assemblies and Methods of Packaging Microdisplays

INTEGRATED SYSTEM WITH COMPUTING AND IMAGING CAPABILITES

Low cost window production for hermetically sealed optical packages

ACTIVE BORDER PIXELS FOR DIGITAL MICROMIRROR DEVICE

Split beam micromirror

Method of growing surface aluminum nitride on aluminum films with l...