Wei-Ying TAI

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,244,909
- Issue date Feb 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,107,791
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for powder distribution and additive manufacturin...
- Patent number 10,675,655
- Issue date Jun 9, 2020
- Industrial Technology Research Institute
- Chuan-Sheng Zhuang
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Detachable aerial photographic apparatus
- Patent number 10,009,518
- Issue date Jun 26, 2018
- Industrial Technology Research Institute
- Wei-Ying Tai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor device and semiconductor manufacturing process
- Patent number 9,911,709
- Issue date Mar 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for powder distribution and additive manufacturin...
- Patent number 9,533,350
- Issue date Jan 3, 2017
- Industrial Technology Research Institute
- Chuan-Sheng Zhuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connector used for connecting a coaxial cable and a microstrip
- Patent number 8,152,534
- Issue date Apr 10, 2012
- National Taipei University of Technology
- Eric S. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure having a solder mask and a process for making t...
- Patent number 7,473,629
- Issue date Jan 6, 2009
- Advanced Semiconductor Engineering, Inc.
- Wei-Chang Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package structure
- Patent number 7,417,329
- Issue date Aug 26, 2008
- Advanced Semiconductor Engineering, Inc.
- Meng-Jung Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for balancing molding flow during the assembly of semiconduc...
- Patent number 7,195,956
- Issue date Mar 27, 2007
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mesh shaped dam mounted on a substrate
- Patent number 7,180,181
- Issue date Feb 20, 2007
- Advanced Semiconductor Engineering, Inc.
- Pai-Chou Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package
- Patent number 6,815,833
- Issue date Nov 9, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210287999
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200294964
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETACHABLE AERIAL PHOTOGRAPHIC APPARATUS
- Publication number 20170126935
- Publication date May 4, 2017
- Industrial Technology Research Institute
- Wei-Ying TAI
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
DEVICE AND METHOD FOR POWDER DISTRIBUTION AND ADDITIVE MANUFACTURIN...
- Publication number 20170036238
- Publication date Feb 9, 2017
- Industrial Technology Research Institute
- Chuan-Sheng ZHUANG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Device and method for powder distribution and additive manufacturin...
- Publication number 20130186514
- Publication date Jul 25, 2013
- Industrial Technology Research Institute
- Chuan-Sheng Zhuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONNECTOR
- Publication number 20120088402
- Publication date Apr 12, 2012
- National Taipei University of Technology
- ERIC S. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate structure having a solder mask and a process for making t...
- Publication number 20070243704
- Publication date Oct 18, 2007
- Wei-Chang Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM-IN-PACKAGE STRUCTURE
- Publication number 20070132093
- Publication date Jun 14, 2007
- Meng-Jung Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die package and method for making the same
- Publication number 20070072341
- Publication date Mar 29, 2007
- Wei-Chang Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stacking BGA packages and structure from the same
- Publication number 20060110849
- Publication date May 25, 2006
- Cheng-Yin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for balancing molding flow during the assembly of semiconduc...
- Publication number 20050266616
- Publication date Dec 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Gwo-Liang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20050181543
- Publication date Aug 18, 2005
- SHIH-CHANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate with mesh
- Publication number 20050082680
- Publication date Apr 21, 2005
- Advanced Semiconductor Engineering, Inc.
- Pai-Chou Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
[SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING MEHOD THEREOF]
- Publication number 20040113266
- Publication date Jun 17, 2004
- SHIH-CHANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package
- Publication number 20040089879
- Publication date May 13, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System in package structure
- Publication number 20040080036
- Publication date Apr 29, 2004
- Advanced Semiconductor Engineering, Inc.
- Ching-Hui Chang
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Ying TAI

Person

Patents Grantslast 30 patents

Package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Device and method for powder distribution and additive manufacturin...

Detachable aerial photographic apparatus

Semiconductor device and semiconductor manufacturing process

Device and method for powder distribution and additive manufacturin...

Connector used for connecting a coaxial cable and a microstrip

Substrate structure having a solder mask and a process for making t...

System-in-package structure

Method for balancing molding flow during the assembly of semiconduc...

Mesh shaped dam mounted on a substrate

Flip chip package

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DETACHABLE AERIAL PHOTOGRAPHIC APPARATUS

DEVICE AND METHOD FOR POWDER DISTRIBUTION AND ADDITIVE MANUFACTURIN...

Device and method for powder distribution and additive manufacturin...

CONNECTOR

Substrate structure having a solder mask and a process for making t...

SYSTEM-IN-PACKAGE STRUCTURE

Die package and method for making the same

Method for stacking BGA packages and structure from the same

Method for balancing molding flow during the assembly of semiconduc...

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Substrate with mesh

[SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING MEHOD THEREOF]

Flip chip package

System in package structure