DETAILED DESCRIPTION OF THE INVENTION
Referring to FIGS. 2A to 2D, they show the processes for making a substrate structure having a solder mask according to the present invention. Referring to FIG. 2A, firstly, a substrate 20 is provided. The substrate 20 has a top surface 201, and the top surface 201 has a die pad 202 and a plurality of solder pads 203. Referring to FIG. 2B, a first solder mask 21 is formed on the top surface 201. The first solder mask 21 has a plurality of openings 211. Each opening 211 is corresponding to each solder pad 203 so as to expose the solder pad 203. In the embodiment, the openings 211 are formed by using exposure and development.
Referring to FIG. 2C, a second solder mask 22 is formed on the first solder mask 21 and the solder pads 203. Referring to FIG. 2D, part of the second solder mask 22 is then removed by using exposure and development so as to expose part of the solder pads 203 and the first solder mask 21. The exposed part of the first solder mask 21 is corresponding to the die pad 202. A top mold (not shown) presses the second solder mask 22 so as to form a higher space for disposing the die when molding. For another application, part of the first solder mask 21 and part of the second solder mask 22 form a stair-shaped structure, as shown in FIG. 2E. For another application, a groove 221 may be formed on the second solder mask 22 by using exposure and development, as shown in FIG. 2F. When molding, the groove 221 can be used as a buffering flow channel so that the overflow of molding compound will be avoided.
Referring to FIGS. 2G to 2H, the first solder mask 21 and the second solder mask 22 are heated and melt together to form a third solder mask 23. It should be noticed that the first solder mask 21 and the second solder mask 22 may be a delaminated structure after heating, as shown in FIG. 2E and FIG. 2F, and that actually depends on the baking sequence and heating conditions.
Referring to FIG. 3, it shows a packaging structure having a solder mask according to a first embodiment of the present invention. The packaging structure 3 of the invention comprises a substrate 30, a solder mask 31, a die 32, a plurality of wires 33 and molding compound 34. The substrate 30 has a top surface 301. The top surface 301 has a die pad 302 and a plurality of solder pads 303. The solder mask 31 is formed on the top surface 301. The solder mask 31 has a plurality of openings 311. Each opening 311 is corresponding to each solder pad 303 so as to expose part of the solder pad 303. The openings 311 are formed by using exposure and development. The solder mask 31 has a first portion 312 and a second portion 313. The first portion 312 is correspondingly on the die pad 302, and the second portion 313 is around the edge of the top surface 301 of the substrate 30. The first portion 312 is lower than the second portion 313, and the second portion 313 is formed as a stair-shaped structure.
The die 32 is attached on the first portion 312 of the solder mask 31 correspondingly on the die pad 302. The wires 33 are used to electrically connect the die 32 and the solder pads 303. The molding compound 34 is used to encapsulate the wires 33, the die 32 and the solder pads 303 to form the packaging structure 3.
Referring to FIG. 4, it shows a packaging structure having a solder mask according to a second embodiment of the present invention. The packaging structure 4 of the invention comprises a substrate 40, a solder mask 41, a die 42, a plurality of wires 43 and molding compound 44. The difference between the packaging structure 4 according to the second embodiment and the packaging structure 3 according to the first embodiment is that a groove 412 may be formed on the solder mask 41 by using exposure and development in the second embodiment.
Referring to FIG. 5, it shows a packaging structure having a solder mask according to a third embodiment of the present invention. The packaging structure 5 of the invention comprises a substrate 50, a first solder mask 51, a second solder mask 52, a die 53, a plurality of wires 54 and molding compound 55. The difference between the packaging structure 5 according to the second embodiment and the packaging structure 3 according to the first embodiment is that the first solder mask 51 and the second solder mask 52 are a delaminated structure but not a single structure.
The first solder mask 51 has a first portion 511 and a second portion 512. The first portion 511 is correspondingly on the die pad 502, and the second portion 512 is around the edge of the top surface of the substrate 50. The second solder mask 52 is disposed on part of the first solder mask 51 (for example, on the second portion 512). The second solder mask 52 and the second portion 512 of the first solder mask 51 have a width difference to form as a stair-shaped structure.
Referring to FIG. 6, it shows a packaging structure having a solder mask according to a fourth embodiment of the present invention. The packaging structure 6 of the invention comprises a substrate 60, a first solder mask 61, a second solder mask 62, a die 63, a plurality of wires 64 and molding compound 65. The difference between the packaging structure 6 according to the fourth embodiment and the packaging structure 4 according to the second embodiment is that the first solder mask 61 and the second solder mask 62 are a delaminated structure but not a single structure.
The first solder mask 61 has a first portion 611 and a second portion 612. The first portion 611 is correspondingly on the die pad 602, and the second portion 612 is around the edge of the top surface of the substrate 60. The second solder mask 62 is disposed on part of the first solder mask 61 (for example, on the second portion 612) and further has a ring-shaped groove 621.
By utilizing the process for making a packaging structure of the present invention, the packaging structure of a single structure or of a delaminated structure can be formed. For the package of a single structure (as shown in FIG. 3 and FIG. 4), the first portion of the first solder mask is lower than the second portion. By utilizing the second portion, a thicker die can be used to be packaged so as to prevent the die crack. Furthermore, the second portion may form as a stair-shaped structure, and a ring-shaped groove may be formed on the second portion. Therefore, the overflow of molding compound will be avoided, and the solder pads will not be polluted.
In addition, for the package of a delaminated structure (as shown in FIG. 5 and FIG. 6), the first portion of the first solder mask is correspondingly on the die pad, the second portion is around the edge of the top surface of the substrate, and the second solder mask is disposed on the second portion of the first solder mask. Since the first solder mask and the second solder mask form a higher solder, a thicker die can be used to be packaged so as to prevent the die crack. Furthermore, the second portion of the first solder mask and the second solder mask form as a stair-shaped structure, and a ring-shaped groove may be formed on the second solder mask. Therefore, the overflow of molding compound will be avoided, and the solder pads will not be polluted.
While the embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications that maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Patent Application
20070243704
