Wei Zhou

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 12,300,647
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grindable heat sink for multiple die packaging
- Patent number 12,300,570
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive columns in a semiconductor device and associa...
- Patent number 12,183,716
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive column in a semiconductor device and associat...
- Patent number 12,074,094
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated segments and methods of manufacturin...
- Patent number 11,894,327
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 11,862,591
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,962
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,963
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for protection of dielectric films during mic...
- Patent number 11,289,360
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 11,114,415
- Issue date Sep 7, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,943,842
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level methods of fabricating semiconductor device packages an...
- Patent number 10,896,894
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Wei Zhou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,210
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,209
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 10,748,857
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an electrically-coupled protection mechan...
- Patent number 10,741,528
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 10,615,150
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 10,580,710
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an electrically-coupled protection mechan...
- Patent number 10,475,771
- Issue date Nov 12, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a layered protection mechanism and associ...
- Patent number 10,381,329
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20250140756
- Publication date May 1, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20250096202
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Publication number 20250006704
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...
- Publication number 20240413021
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...
- Publication number 20240412980
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20240379503
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240282731
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...
- Publication number 20240178170
- Publication date May 30, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILI...
- Publication number 20240063094
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...
- Publication number 20240047424
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240047260
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343672
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...
- Publication number 20230343673
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20230260964
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260875
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260876
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Conductive buffer layers for semiconductor die assemblies and assoc...

Apparatus including integrated pads and methods of manufacturing th...

Grindable heat sink for multiple die packaging

Monolithic conductive columns in a semiconductor device and associa...

Bond pad with micro-protrusions for direct metallic bonding

Methods and systems for manufacturing semiconductor devices

Monolithic conductive column in a semiconductor device and associat...

Apparatus including integrated segments and methods of manufacturin...

Conductive buffer layers for semiconductor die assemblies and assoc...

Apparatus including integrated pads and methods of manufacturing th...

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor device with a protection mechanism and associated sys...

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Die features for self-alignment during die bonding

Methods and apparatus for protection of dielectric films during mic...

Semiconductor device with a layered protection mechanism and associ...

Semiconductor device with a protection mechanism and associated sys...

Wafer-level methods of fabricating semiconductor device packages an...

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Die features for self-alignment during die bonding

Semiconductor device with an electrically-coupled protection mechan...

Semiconductor device with a layered protection mechanism and associ...

Semiconductor device with a protection mechanism and associated sys...

Semiconductor device with an electrically-coupled protection mechan...

Semiconductor device with a layered protection mechanism and associ...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...

SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

SEMICONDUCTOR DEVICE ASSEMBLIES WITH A CAVITY EXPOSING THROUGH-SILI...

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICON...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...