WEIHAI BU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,295,164
- Issue date May 6, 2025
- Semiconductor Technology Innovation Center (Beijing) Corporation
- Ren Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV interconnect structure and manufacturing method thereof
- Patent number 10,515,892
- Issue date Dec 24, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Weihai Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor and method for forming the same
- Patent number 9,484,204
- Issue date Nov 1, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Weihai Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 9,379,206
- Issue date Jun 28, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- WeiHai Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating quasi-SOI source/drain field effect transist...
- Patent number 9,349,588
- Issue date May 24, 2016
- Peking University
- Ru Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 9,136,164
- Issue date Sep 15, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xinpeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS devices and fabrication method
- Patent number 8,901,675
- Issue date Dec 2, 2014
- Semiconductor Manufacturing International Corp
- Weihai Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device and fabrication method
- Patent number 8,828,814
- Issue date Sep 9, 2014
- Semiconductor Manufacturing International Corp
- Wenbo Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20230411469
- Publication date Dec 21, 2023
- Semiconductor Technology Innovation Center (Beijing) Corporation
- Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220352343
- Publication date Nov 3, 2022
- Semiconductor Technology Innovation Center (Beijing) Corporation
- Ren YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A QUASI-SOI SOURCE-DRAIN MULTI-GATE DEVICE
- Publication number 20160247726
- Publication date Aug 25, 2016
- PERKING UNIVERSITY
- Ru HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING QUASI-SOI SOURCE/DRAIN FIELD EFFECT TRANSIST...
- Publication number 20160118245
- Publication date Apr 28, 2016
- Peking University
- Ru Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20150187633
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- XINPENG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20150145054
- Publication date May 28, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- WEIHAI BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140374916
- Publication date Dec 25, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- WEIHAI BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20140110769
- Publication date Apr 24, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- WeiHai BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS DEVICES AND FABRICATION METHOD
- Publication number 20140015064
- Publication date Jan 16, 2014
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
- WEIHAI BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20140001540
- Publication date Jan 2, 2014
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
- WENBO WANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for forming semiconductor structure

TSV interconnect structure and manufacturing method thereof

Transistor and method for forming the same

Semiconductor device and fabrication method thereof

Method for fabricating quasi-SOI source/drain field effect transist...

Semiconductor device and fabrication method

CMOS devices and fabrication method

Integrated semiconductor device and fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD FOR FABRICATING A QUASI-SOI SOURCE-DRAIN MULTI-GATE DEVICE

METHOD FOR FABRICATING QUASI-SOI SOURCE/DRAIN FIELD EFFECT TRANSIST...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

TRANSISTOR AND METHOD FOR FORMING THE SAME

TSV INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

CMOS DEVICES AND FABRICATION METHOD

INTEGRATED SEMICONDUCTOR DEVICE AND FABRICATION METHOD