Weimin Li

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming intermediate semiconductor device structures usi...
- Patent number 8,486,612
- Issue date Jul 16, 2013
- Micron Technology, Inc.
- Weimin Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sequential pulse deposition
- Patent number 7,910,177
- Issue date Mar 22, 2011
- Mosaid Technologies Incorporated
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a selective contact and local interconnect in situ
- Patent number 7,858,518
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- Christopher W. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming intermediate semiconductor device structures usi...
- Patent number 7,855,154
- Issue date Dec 21, 2010
- Micron Technology, Inc.
- Weimin Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Intermediate semiconductor device structures using photopatternable...
- Patent number 7,678,460
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection in integrated circuits
- Patent number 7,632,737
- Issue date Dec 15, 2009
- Micron Technology, Inc.
- Neal R. Rueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filled trench isolation structure
- Patent number 7,550,816
- Issue date Jun 23, 2009
- Micron Technology, Inc.
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low k interlevel dielectric layer fabrication methods
- Patent number 7,521,354
- Issue date Apr 21, 2009
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection in integrated circuits
- Patent number 7,494,894
- Issue date Feb 24, 2009
- Micron Technology, Inc.
- Neal R. Rueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a silicon dioxide comprising layer doped with...
- Patent number 7,470,632
- Issue date Dec 30, 2008
- Micron Technology, Inc.
- Chris W. Hill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Masking structure having multiple layers including amorphous carbon...
- Patent number 7,341,957
- Issue date Mar 11, 2008
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical treatment of semiconductor substrates
- Patent number 7,314,837
- Issue date Jan 1, 2008
- Micron Technology, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions of matter and barrier layer compositions
- Patent number 7,279,118
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling high aspect ratio trenches in semiconductor layers
- Patent number 7,259,079
- Issue date Aug 21, 2007
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming and integrated circuit structures containing ru...
- Patent number 7,253,076
- Issue date Aug 7, 2007
- Micron Technologies, Inc.
- Vishnu K. Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing methods
- Patent number 7,235,499
- Issue date Jun 26, 2007
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for high efficiency metalorganic chemical vapor deposition
- Patent number 7,214,618
- Issue date May 8, 2007
- Micron Technology, Inc.
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of eliminating residual carbon from flowable oxide fill
- Patent number 7,205,248
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivation processes for use with metallization techniques
- Patent number 7,186,638
- Issue date Mar 6, 2007
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Masking structure having multiple layers including an amorphous car...
- Patent number 7,129,180
- Issue date Oct 31, 2006
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low K interlevel dielectric layer fabrication methods
- Patent number 7,078,356
- Issue date Jul 18, 2006
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low k interlevel dielectric layer fabrication methods
- Patent number 7,067,415
- Issue date Jun 27, 2006
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low k interlevel dielectric layer fabrication methods
- Patent number 7,067,414
- Issue date Jun 27, 2006
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming intermediate semiconductor device structures usi...
- Patent number 7,060,637
- Issue date Jun 13, 2006
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition methods of forming silicon dioxide comprisi...
- Patent number 7,018,469
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical treatment of semiconductor substrates
- Patent number 7,008,885
- Issue date Mar 7, 2006
- Micron Technology, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling high aspect ratio trenches in semiconductor layers
- Patent number 6,982,207
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor multilevel interconnect struc...
- Patent number 6,951,709
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery system for deposition processes, and methods of using...
- Patent number 6,936,547
- Issue date Aug 30, 2005
- Micron Technology, Inc.
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a silicon dioxide comprising layer doped with...
- Patent number 6,930,058
- Issue date Aug 16, 2005
- Micron Technology, Inc.
- Chris W. Hill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEQUENTIAL PULSE DEPOSITION
- Publication number 20110212628
- Publication date Sep 1, 2011
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING INTERMEDIATE SEMICONDUCTOR DEVICE STRUCTURES USI...
- Publication number 20110065050
- Publication date Mar 17, 2011
- Micron Technology, Inc.
- Weimin Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor processing methods
- Publication number 20070004227
- Publication date Jan 4, 2007
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION IN INTEGRATED CIRCUITS
- Publication number 20060270240
- Publication date Nov 30, 2006
- Neal R. Rueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sequential pulse deposition
- Publication number 20060265100
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Intermediate semiconductor device structures using photopatternable...
- Publication number 20060205236
- Publication date Sep 14, 2006
- Weimin Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of forming intermediate semiconductor device structures usi...
- Publication number 20060172079
- Publication date Aug 3, 2006
- Weimin Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Chemical treatment of semiconductor substrates
- Publication number 20060128164
- Publication date Jun 15, 2006
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming and integrated circuit structures containing ru...
- Publication number 20060076597
- Publication date Apr 13, 2006
- Micron Technology, Inc.
- Vishnu K. Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low k interlevel dielectric layer fabrication methods
- Publication number 20060068584
- Publication date Mar 30, 2006
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing a silicon dioxide comprising layer doped with...
- Publication number 20060035471
- Publication date Feb 16, 2006
- Chris W. Hill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Masking structure having multiple layers including an amorphous car...
- Publication number 20060001175
- Publication date Jan 5, 2006
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor multilevel interconnect structure
- Publication number 20050239002
- Publication date Oct 27, 2005
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for high efficiency metalorganic chemical vapor deposition
- Publication number 20050223978
- Publication date Oct 13, 2005
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CVD of PtRh with good adhesion and morphology
- Publication number 20050066895
- Publication date Mar 31, 2005
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic layer deposition methods of forming silicon dioxide comprisi...
- Publication number 20050061234
- Publication date Mar 24, 2005
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Masking structure having multiple layers including an amorphous car...
- Publication number 20050056940
- Publication date Mar 17, 2005
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation processes for use with metallization techniques
- Publication number 20050032367
- Publication date Feb 10, 2005
- Weimin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas delivery system for deposition processes, and methods of using...
- Publication number 20050011449
- Publication date Jan 20, 2005
- Micron Technology, Inc.
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for filling high aspect ratio trenches in semiconductor layers
- Publication number 20050009291
- Publication date Jan 13, 2005
- Jingyi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical treatment of semiconductor substrates
- Publication number 20050009308
- Publication date Jan 13, 2005
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving HDP fill process
- Publication number 20040235263
- Publication date Nov 25, 2004
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Use of spin-on, photopatternable, interlayer dielectric materials a...
- Publication number 20040229050
- Publication date Nov 18, 2004
- Weimin Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of eliminating residual carbon from flowable oxide fill
- Publication number 20040212036
- Publication date Oct 28, 2004
- Micron Technology, Inc.
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a silicon dioxide comprising layer doped with...
- Publication number 20040209484
- Publication date Oct 21, 2004
- Chris W. Hill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compositions of matter and barrier layer compositions
- Publication number 20040159875
- Publication date Aug 19, 2004
- WEIMIN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of eliminating residual carbon from flowable oxide fill
- Publication number 20040152342
- Publication date Aug 5, 2004
- Micron Technology, Inc.
- Li Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Technique for high efficiency metaloganic chemical vapor deposition
- Publication number 20040147103
- Publication date Jul 29, 2004
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Technique for high efficiency metalorganic chemical vapor deposition
- Publication number 20040142559
- Publication date Jul 22, 2004
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gas delivery system for deposition processes, and methods of using...
- Publication number 20040083972
- Publication date May 6, 2004
- Weimin Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Methods of forming intermediate semiconductor device structures usi...

Sequential pulse deposition

Method for forming a selective contact and local interconnect in situ

Methods of forming intermediate semiconductor device structures usi...

Intermediate semiconductor device structures using photopatternable...

Protection in integrated circuits

Filled trench isolation structure

Low k interlevel dielectric layer fabrication methods

Protection in integrated circuits

Method of depositing a silicon dioxide comprising layer doped with...

Masking structure having multiple layers including amorphous carbon...

Chemical treatment of semiconductor substrates

Compositions of matter and barrier layer compositions

Methods for filling high aspect ratio trenches in semiconductor layers

Methods for forming and integrated circuit structures containing ru...

Semiconductor processing methods

Technique for high efficiency metalorganic chemical vapor deposition

Method of eliminating residual carbon from flowable oxide fill

Passivation processes for use with metallization techniques

Masking structure having multiple layers including an amorphous car...

Low K interlevel dielectric layer fabrication methods

Low k interlevel dielectric layer fabrication methods

Low k interlevel dielectric layer fabrication methods

Methods of forming intermediate semiconductor device structures usi...

Atomic layer deposition methods of forming silicon dioxide comprisi...

Chemical treatment of semiconductor substrates

Methods for filling high aspect ratio trenches in semiconductor layers

Method of fabricating a semiconductor multilevel interconnect struc...

Gas delivery system for deposition processes, and methods of using...

Method of depositing a silicon dioxide comprising layer doped with...

Patents Applicationslast 30 patents

SEQUENTIAL PULSE DEPOSITION

METHODS OF FORMING INTERMEDIATE SEMICONDUCTOR DEVICE STRUCTURES USI...

Semiconductor processing methods

PROTECTION IN INTEGRATED CIRCUITS

Sequential pulse deposition

Intermediate semiconductor device structures using photopatternable...

Methods of forming intermediate semiconductor device structures usi...

Chemical treatment of semiconductor substrates

Methods for forming and integrated circuit structures containing ru...

Low k interlevel dielectric layer fabrication methods

Method of depositing a silicon dioxide comprising layer doped with...

Masking structure having multiple layers including an amorphous car...

Semiconductor multilevel interconnect structure

Technique for high efficiency metalorganic chemical vapor deposition

CVD of PtRh with good adhesion and morphology

Atomic layer deposition methods of forming silicon dioxide comprisi...

Masking structure having multiple layers including an amorphous car...

Passivation processes for use with metallization techniques

Gas delivery system for deposition processes, and methods of using...

Methods for filling high aspect ratio trenches in semiconductor layers

Chemical treatment of semiconductor substrates

Method of improving HDP fill process

Use of spin-on, photopatternable, interlayer dielectric materials a...

Method of eliminating residual carbon from flowable oxide fill

Method of depositing a silicon dioxide comprising layer doped with...

Compositions of matter and barrier layer compositions

Method of eliminating residual carbon from flowable oxide fill

Technique for high efficiency metaloganic chemical vapor deposition

Technique for high efficiency metalorganic chemical vapor deposition

Gas delivery system for deposition processes, and methods of using...