Wen-An Liang

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,972,984
- Issue date Apr 30, 2024
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,569,133
- Issue date Jan 31, 2023
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,892,194
- Issue date Jan 12, 2021
- United Microelectronics Corp.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,741,455
- Issue date Aug 11, 2020
- United Microelectronics Corp.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,679,903
- Issue date Jun 9, 2020
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,658,458
- Issue date May 19, 2020
- UNITED MICROELECTRONCIS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,607,897
- Issue date Mar 31, 2020
- United Microelectronics Corp.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,475,709
- Issue date Nov 12, 2019
- United Microelectronics Corp.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 10,312,146
- Issue date Jun 4, 2019
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,043,868
- Issue date Aug 7, 2018
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 10,032,675
- Issue date Jul 24, 2018
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,824,931
- Issue date Nov 21, 2017
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin structures for non-planar semiconductor device
- Patent number 9,786,502
- Issue date Oct 10, 2017
- United Microelectronics Corp.
- Kuan-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,653,402
- Issue date May 16, 2017
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,607,985
- Issue date Mar 28, 2017
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 9,608,062
- Issue date Mar 28, 2017
- United Microelectronics Corp.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240371699
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240282637
- Publication date Aug 22, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230135742
- Publication date May 4, 2023
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200328126
- Publication date Oct 15, 2020
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200258788
- Publication date Aug 13, 2020
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200176331
- Publication date Jun 4, 2020
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200035568
- Publication date Jan 30, 2020
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190172753
- Publication date Jun 6, 2019
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20190019731
- Publication date Jan 17, 2019
- United Microelectronics Corp.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180331177
- Publication date Nov 15, 2018
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180040694
- Publication date Feb 8, 2018
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING FIN STRUCTURES FOR NON-PLANAR SEMICONDUCTOR DEVICE
- Publication number 20170263454
- Publication date Sep 14, 2017
- UNITED MICROELECTRONICS CORP.
- Kuan-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20170207129
- Publication date Jul 20, 2017
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170154823
- Publication date Jun 1, 2017
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170092643
- Publication date Mar 30, 2017
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170012000
- Publication date Jan 12, 2017
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20160276429
- Publication date Sep 22, 2016
- UNITED MICROELECTRONICS CORP.
- I-Ming Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Wen-An Liang

Person

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor structure and method of forming the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method for fabricating semiconductor device

Semiconductor structure and method of forming the same

Method for fabricating semiconductor device

Semiconductor device and method for fabricating the same

Method for forming fin structures for non-planar semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor structure and method of forming the same

Patents Applicationslast 30 patents

Semiconductor structure and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR FORMING FIN STRUCTURES FOR NON-PLANAR SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME