Wen-Chiang Tu

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inductive monitoring of conductive loops
- Patent number 10,741,459
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 10,556,315
- Issue date Feb 11, 2020
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Modifying substrate thickness profiles
- Patent number 10,464,184
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 10,207,386
- Issue date Feb 19, 2019
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 10,199,281
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 10,103,073
- Issue date Oct 16, 2018
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 9,911,664
- Issue date Mar 6, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 9,754,846
- Issue date Sep 5, 2017
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Adjusting eddy current measurements
- Patent number 9,636,797
- Issue date May 2, 2017
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback of layer thickness timing and clearance timing for polishi...
- Patent number 9,496,190
- Issue date Nov 15, 2016
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback control using detection of clearance and adjustment for un...
- Patent number 9,472,475
- Issue date Oct 18, 2016
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing control using weighting with default sequence
- Patent number 9,296,084
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 9,281,253
- Issue date Mar 8, 2016
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Determination of gain for eddy current sensor
- Patent number 9,275,917
- Issue date Mar 1, 2016
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint detection during polishing using integrated differential i...
- Patent number 9,248,544
- Issue date Feb 2, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
In-situ monitoring system with monitoring of elongated region
- Patent number 9,205,527
- Issue date Dec 8, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
X-ray metrology for control of polishing
- Patent number 9,186,774
- Issue date Nov 17, 2015
- Applied Materials, Inc.
- Boguslaw A. Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
Feedback control of polishing using optical detection of clearance
- Patent number 9,073,169
- Issue date Jul 7, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Monitoring retaining ring thickness and pressure control
- Patent number 9,067,295
- Issue date Jun 30, 2015
- Applied Materials, Inc.
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Grant
High sensitivity eddy current monitoring system
- Patent number 9,023,667
- Issue date May 5, 2015
- Applied Materials, Inc.
- Hassan G. Iravani
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 9,005,999
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GST film thickness monitoring
- Patent number 8,989,890
- Issue date Mar 24, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Detection of layer clearing using spectral monitoring
- Patent number 8,860,932
- Issue date Oct 14, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrates of varying thickness on the...
- Patent number 8,694,144
- Issue date Apr 8, 2014
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Using optical metrology for within wafer feed forward process control
- Patent number 8,679,979
- Issue date Mar 25, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Metrology for GST film thickness and phase
- Patent number 8,639,377
- Issue date Jan 28, 2014
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical planarization of copper wafer polishing
- Patent number 8,586,481
- Issue date Nov 19, 2013
- Applied Materials, Inc.
- You Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of using optical metrology for feed back and feed forward p...
- Patent number 8,579,675
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Using optical metrology for wafer to wafer feed back process control
- Patent number 8,292,693
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
- Publication number 20190134775
- Publication date May 9, 2019
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
- Publication number 20190035699
- Publication date Jan 31, 2019
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20180166347
- Publication date Jun 14, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20170365532
- Publication date Dec 21, 2017
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...
- Publication number 20170151647
- Publication date Jun 1, 2017
- Applied Materials, Inc.
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
- Publication number 20160158908
- Publication date Jun 9, 2016
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20150371913
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20150371907
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modifying Substrate Thickness Profiles
- Publication number 20150321312
- Publication date Nov 12, 2015
- Applied Materials, Inc.
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTING EDDY CURRENT MEASUREMENTS
- Publication number 20150224623
- Publication date Aug 13, 2015
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
FEEDBACK OF LAYER THICKNESS TIMING AND CLEARANCE TIMING FOR POLISHI...
- Publication number 20150194356
- Publication date Jul 9, 2015
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
- Publication number 20150118766
- Publication date Apr 30, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
- Publication number 20150118765
- Publication date Apr 30, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING...
- Publication number 20140315381
- Publication date Oct 23, 2014
- You Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TRE...
- Publication number 20140308814
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- David Maxwell Gage
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
X-RAY METROLOGY FOR CONTROL OF POLISHING
- Publication number 20140273745
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Boguslaw A. Swedek
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20140222188
- Publication date Aug 7, 2014
- Applied Materials, Inc.
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
In-Sequence Spectrographic Sensor
- Publication number 20140141694
- Publication date May 22, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
IN-SITU MONITORING SYSTEM WITH MONITORING OF ELONGATED REGION
- Publication number 20140127971
- Publication date May 8, 2014
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
Residue Detection with Spectrographic Sensor
- Publication number 20140093987
- Publication date Apr 3, 2014
- Jeffrey Drue David
- G01 - MEASURING TESTING
Information Patent Application
Monitoring Retaining Ring Thickness And Pressure Control
- Publication number 20140027407
- Publication date Jan 30, 2014
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...
- Publication number 20140030956
- Publication date Jan 30, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Endpoint Detection During Polishing Using Integrated Differential I...
- Publication number 20140024291
- Publication date Jan 23, 2014
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Pad and Multi-Head Polishing System
- Publication number 20140024299
- Publication date Jan 23, 2014
- Wen-Chiang Tu
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Control Using Weighting With Default Sequence
- Publication number 20140024292
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20140004626
- Publication date Jan 2, 2014
- Applied Materials, Inc.
- KUN XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Feedback Control Using Detection Of Clearance And Adjustment For Un...
- Publication number 20130224890
- Publication date Aug 29, 2013
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY FOR PLANARIZING PHOTORESIST
- Publication number 20130189843
- Publication date Jul 25, 2013
- You Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY FOR COBALT APPLICATIONS
- Publication number 20130186850
- Publication date Jul 25, 2013
- APPLIED MATERIALS, INC.
- You Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS
- Publication number 20120276817
- Publication date Nov 1, 2012
- Hassan G. Iravani
- B24 - GRINDING POLISHING

Wen-Chiang Tu

Person

Patents Grantslast 30 patents

Inductive monitoring of conductive loops

Endpoint control of multiple substrate zones of varying thickness i...

Determination of gain for eddy current sensor

Modifying substrate thickness profiles

Determination of gain for eddy current sensor

Substrate features for inductive monitoring of conductive trench depth

Inductive monitoring of conductive trench depth

Substrate features for inductive monitoring of conductive trench depth

Inductive monitoring of conductive trench depth

Adjusting eddy current measurements

Feedback of layer thickness timing and clearance timing for polishi...

Feedback control using detection of clearance and adjustment for un...

Polishing control using weighting with default sequence

Determination of gain for eddy current sensor

Determination of gain for eddy current sensor

Endpoint detection during polishing using integrated differential i...

In-situ monitoring system with monitoring of elongated region

X-ray metrology for control of polishing

Feedback control of polishing using optical detection of clearance

Monitoring retaining ring thickness and pressure control

High sensitivity eddy current monitoring system

Temperature control of chemical mechanical polishing

GST film thickness monitoring

Detection of layer clearing using spectral monitoring

Endpoint control of multiple substrates of varying thickness on the...

Using optical metrology for within wafer feed forward process control

Metrology for GST film thickness and phase

Chemical planarization of copper wafer polishing

Methods of using optical metrology for feed back and feed forward p...

Using optical metrology for wafer to wafer feed back process control

Patents Applicationslast 30 patents

DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

INDUCTIVE MONITORING OF CONDUCTIVE LOOPS

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...

DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

Modifying Substrate Thickness Profiles

ADJUSTING EDDY CURRENT MEASUREMENTS

FEEDBACK OF LAYER THICKNESS TIMING AND CLEARANCE TIMING FOR POLISHI...

DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING...

CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TRE...

X-RAY METROLOGY FOR CONTROL OF POLISHING

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

In-Sequence Spectrographic Sensor

IN-SITU MONITORING SYSTEM WITH MONITORING OF ELONGATED REGION

Residue Detection with Spectrographic Sensor

Monitoring Retaining Ring Thickness And Pressure Control

CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...

Endpoint Detection During Polishing Using Integrated Differential I...

Polishing Pad and Multi-Head Polishing System

Polishing Control Using Weighting With Default Sequence

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

Feedback Control Using Detection Of Clearance And Adjustment For Un...

SLURRY FOR PLANARIZING PHOTORESIST

SLURRY FOR COBALT APPLICATIONS

EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS