Wen-chou Vincent Wang

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for audio processing
- Patent number 9,232,319
- Issue date Jan 5, 2016
- DTS LLC
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Audio signal processing
- Patent number 8,831,254
- Issue date Sep 9, 2014
- DTS LLC
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stereo image widening system
- Patent number 8,660,271
- Issue date Feb 25, 2014
- DTS LLC
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 8,212,353
- Issue date Jul 3, 2012
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with dual material build-up layers
- Patent number 8,163,642
- Issue date Apr 24, 2012
- Altera Corporation
- Wen-Chou Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for audio processing
- Patent number 8,027,477
- Issue date Sep 27, 2011
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,741,160
- Issue date Jun 22, 2010
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Audio signal processing
- Patent number 7,720,240
- Issue date May 18, 2010
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package substrate with dual material build-up layers
- Patent number 7,602,062
- Issue date Oct 13, 2009
- Altera Corporation
- Wen-Chou Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,585,702
- Issue date Sep 8, 2009
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, material, and design for assembling a low-K Si die to ac...
- Patent number 7,427,813
- Issue date Sep 23, 2008
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad surface finish for high routing density substrate of BGA packages
- Patent number 7,148,569
- Issue date Dec 12, 2006
- Altera Corporation
- Wen-Chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
- Patent number 7,144,756
- Issue date Dec 5, 2006
- Altera Corporation
- Wen-Chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package with warpage control
- Patent number 6,949,404
- Issue date Sep 27, 2005
- Altera Corporation
- Don Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
- Patent number 6,909,176
- Issue date Jun 21, 2005
- Altera Corporation
- Wen-Chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and method for forming and method for deplating d...
- Patent number 6,882,045
- Issue date Apr 19, 2005
- Thomas J. Massingill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer opto-electronic substrates with electrical and optical...
- Patent number 6,845,184
- Issue date Jan 18, 2005
- Fujitsu Limited
- Tetsuzo Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilayer waveguides and fabrication process
- Patent number 6,785,447
- Issue date Aug 31, 2004
- Fujitsu Limited
- Tetsuzo Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated assembly-underfill flip chip process
- Patent number 6,773,958
- Issue date Aug 10, 2004
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of planarizing structures on wafers and substrates by polis...
- Patent number 6,733,685
- Issue date May 11, 2004
- Fujitsu Limited
- Solomon I. Beilin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical reflective structures and method for making
- Patent number 6,706,546
- Issue date Mar 16, 2004
- Fujitsu Limited
- Tetsuzo Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional opto-electronic modules with electrical and optic...
- Patent number 6,690,845
- Issue date Feb 10, 2004
- Fujitsu Limited
- Tetsuzo Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical coupling structures and the fabrication processes
- Patent number 6,684,007
- Issue date Jan 27, 2004
- Fujitsu Limited
- Tetsuzo Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device transfer method
- Patent number 6,669,801
- Issue date Dec 30, 2003
- Fujitsu Limited
- Tetsuzo Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a substrate with a via connection
- Patent number 6,662,443
- Issue date Dec 16, 2003
- Fujitsu Limited
- William T. Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-electronic substrates with electrical and optical interconnect...
- Patent number 6,611,635
- Issue date Aug 26, 2003
- Fujitsu Limited
- Tetsuzo Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection and method
- Patent number 6,543,674
- Issue date Apr 8, 2003
- Fujitsu Limited
- Michael G. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modules with pins and methods for making modules with pins
- Patent number 6,448,106
- Issue date Sep 10, 2002
- Fujitsu Limited
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress and zero stress interposers for integrated-circuit c...
- Patent number 6,444,921
- Issue date Sep 3, 2002
- Fujitsu Limited
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit structure build up method
- Patent number 6,428,942
- Issue date Aug 6, 2002
- Fujitsu Limited
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AUDIO ADJUSTMENT SYSTEM
- Publication number 20120099733
- Publication date Apr 26, 2012
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR AUDIO PROCESSING
- Publication number 20120014528
- Publication date Jan 19, 2012
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AUDIO SIGNAL PROCESSING
- Publication number 20100226500
- Publication date Sep 9, 2010
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AUDIO SIGNAL PROCESSING
- Publication number 20070230725
- Publication date Oct 4, 2007
- SRS Labs, Inc.
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR AUDIO PROCESSING
- Publication number 20070061026
- Publication date Mar 15, 2007
- Wen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-chip module and method for forming and method for deplating d...
- Publication number 20020155661
- Publication date Oct 24, 2002
- Thomas J. Massingill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional packaging
- Publication number 20020117753
- Publication date Aug 29, 2002
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer interconnection and method
- Publication number 20020104873
- Publication date Aug 8, 2002
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single and multilayer waveguides and fabrication process
- Publication number 20020097962
- Publication date Jul 25, 2002
- Tetsuzo Yoshimura
- G02 - OPTICS
Information Patent Application
Optical reflective structures and method for making
- Publication number 20020039464
- Publication date Apr 4, 2002
- Tetsuzo Yoshimura
- G02 - OPTICS
Information Patent Application
Device transfer method
- Publication number 20020036055
- Publication date Mar 28, 2002
- Tetsuzo Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical coupling structures and the fabrication processes
- Publication number 20020028045
- Publication date Mar 7, 2002
- Tetsuzo Yoshimura
- G02 - OPTICS
Information Patent Application
Method of fabricating a substrate with a via connection
- Publication number 20020000037
- Publication date Jan 3, 2002
- William T. Chou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Methods of planarizing structures on wafers and substrates by polis...
- Publication number 20010042734
- Publication date Nov 22, 2001
- Solomon I. Beilin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MULTILAYER CIRCUIT STRUCTURE
- Publication number 20010018796
- Publication date Sep 6, 2001
- MICHAEL G. LEE
- B32 - LAYERED PRODUCTS

Wen-chou Vincent Wang

Person

Patents Grantslast 30 patents

Systems and methods for audio processing

Audio signal processing

Stereo image widening system

Structure and assembly procedure for low stress thin die flip chip...

Package substrate with dual material build-up layers

Systems and methods for audio processing

Structure and assembly procedure for low stress thin die flip chip...

Audio signal processing

Package substrate with dual material build-up layers

Structure and assembly procedure for low stress thin die flip chip...

Structure, material, and design for assembling a low-K Si die to ac...

Pad surface finish for high routing density substrate of BGA packages

Structure and material for assembling a low-K Si die to achieve a l...

Flip chip package with warpage control

Structure and material for assembling a low-K Si die to achieve a l...

Multi-chip module and method for forming and method for deplating d...

Multi-layer opto-electronic substrates with electrical and optical...

Single and multilayer waveguides and fabrication process

Integrated assembly-underfill flip chip process

Methods of planarizing structures on wafers and substrates by polis...

Optical reflective structures and method for making

Three-dimensional opto-electronic modules with electrical and optic...

Optical coupling structures and the fabrication processes

Device transfer method

Method of fabricating a substrate with a via connection

Opto-electronic substrates with electrical and optical interconnect...

Multilayer interconnection and method

Modules with pins and methods for making modules with pins

Reduced stress and zero stress interposers for integrated-circuit c...

Multilayer circuit structure build up method

Patents Applicationslast 30 patents

AUDIO ADJUSTMENT SYSTEM

SYSTEMS AND METHODS FOR AUDIO PROCESSING

AUDIO SIGNAL PROCESSING

AUDIO SIGNAL PROCESSING

SYSTEMS AND METHODS FOR AUDIO PROCESSING

Multi-chip module and method for forming and method for deplating d...

Three dimensional packaging

Multilayer interconnection and method

Single and multilayer waveguides and fabrication process

Optical reflective structures and method for making

Device transfer method

Optical coupling structures and the fabrication processes

Method of fabricating a substrate with a via connection

Methods of planarizing structures on wafers and substrates by polis...

METHOD OF FORMING MULTILAYER CIRCUIT STRUCTURE