Claims
- 1. A method of constructing an electronic circuit assembly comprising the steps of:
a) forming at least one electrode on a substrate; b) forming a layer of undercladding material upon the substrate and over the electrode; c) forming a wave guide core layer on said layer of cladding material; d) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material; e) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; f) forming at least one via aperture through said overcladding material and said undercladding material; and g) disposing a conductive material in said via aperture to produce an electronic circuit assembly.
- 2. The method of claim 1 wherein said disposing step (g) additionally comprises disposing a partial layer of the conductive material over the overcladding material.
- 3. The method of claim 1 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (g).
- 4. The method of claim 2 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (g).
- 5. The method of claim 1 wherein said via aperture terminates in said electrode.
- 6. The method of claim 4 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (g).
- 7. The method of claim 1 wherein said forming step (f) additionally comprises removing a portion of the optical wave guide.
- 8. The method of claim 6 wherein said forming step (f) additionally comprises removing a portion of the optical wave guide.
- 9. The method of claim 1 wherein said forming step (f) additionally comprises forming a forty-five degree sidewall in said optical wave guide.
- 10. The method of claim 8 wherein said forming step (f) additionally comprises forming a forty-five degree sidewall in said optical wave guide.
- 11. The method of claim 9 wherein said disposing step (g) additionally comprises forming a forty-five degree optical reflective surface on said forty-five degree sidewall.
- 12. The method of claim 10 wherein said disposing step (g) additionally comprises forming a forty-five degree optical reflective surface on said forty-five degree sidewall.
- 13. The method of claim 1 wherein said forming step (f) additionally comprises forming the via aperture to have opposed via walls such that a portion of said optical wave guide is generally centrically disposed in the via aperture between the via walls.
- 14. The method of claim 13 wherein said disposing step (g) additionally comprises disposing conductive material on said opposed via walls and against said portion of said optical wave guide.
- 15. The method of claim 13 additionally comprising coupling the conductive layer to a second electronic circuit assembly.
- 16. A method of constructing an electronic circuit assembly comprising the steps of.
a) forming at least one electrode on a substrate; b) disposing an electro-optic device on the substrate; c) forming a layer of undercladding material upon the substrate and over the electrode and the electro-optic device; d) disposing a second electrode on the layer of undercladding material; e) disposing an intermediate layer of cladding material over exposed portions of the layer of undercladding material and over the second electrode; f) forming a wave guide core layer on said layer of cladding material; g) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material; h) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; i) forming at least one via aperture through said overcladding material and said undercladding material; and j) disposing a conductive material in said via aperture to produce an electronic circuit assembly.
- 17. The method of claim 16 additionally comprising polishing the layer of the cladding material prior to the disposing step (d) until a top of the electrode is aligned with the cladding material.
- 18. The method of claim 16 additionally comprising forming, prior to said disposing step (d), an opening in said layer of undercladding material to expose a portion of the electro-optic device; and disposing conductive material in said opening and in contact with said electro-optic device.
- 19. The method of claim 17 additionally comprising forming, prior to said disposing step (d), an opening in said layer of undercladding material to expose a portion of the electro-optic device; and disposing conductive material in said opening and in contact with said electro-optic device.
- 20. The method of claim 16 wherein said disposing step (j) additionally comprises disposing a partial layer of the conductive material over the overcladding material.
- 21. The method of claim 16 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (j).
- 22. The method of claim 19 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (j).
- 23. The method of claim 16 wherein said via aperture terminates in said electrode.
- 24. The method of claim 22 additionally comprising forming a patterned resist on the overcladding material prior to said disposing step (j).
- 25. The method of claim 16 wherein said forming step (i) additionally comprises removing a portion of the optical wave guide.
- 26. The method of claim 24 wherein said forming step (i) additionally comprises removing a portion of the optical wave guide.
- 27. The method of claim 16 wherein said forming step (i) additionally comprises forming a forty-five degree sidewall in said optical wave guide.
- 28. The method of claim 26 wherein said forming step (i) additionally comprises forming a forty-five degree sidewall in said optical wave guide.
- 29. The method of claim 27 wherein said disposing step (j) additionally comprises forming a forty-five degree optical reflective surface on said forty-five degree sidewall.
- 30. The method of claim 28 wherein said disposing step (j) additionally comprises forming a forty-five degree optical reflective surface on said forty-five degree sidewall.
- 31. The method of claim 16 wherein said forming step (i) additionally comprises forming the via aperture to have opposed via walls such that a portion of said optical wave guide is generally centrically disposed in the via aperture between the via walls.
- 32. The method of claim 31 wherein said disposing step (j) additionally comprises disposing conductive material on said opposed via walls and against said portion of said optical wave guide.
- 33. The method of claim 31 additionally comprising coupling the conductive layer to a second electronic circuit assembly.
- 34. The method of claim 15 additionally comprising removing said substrate prior to coupling the conductive layer to the second electronic circuit assembly.
- 35. The method of claim 33 additionally comprising removing said substrate prior to coupling the conductive layer to the second electronic circuit assembly.
- 36. A method of constructing an electronic circuit assembly comprising the steps of:
a) forming a layer of undercladding material upon a first substrate; b) forming a wave guide core layer on said layer of cladding material; c) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material; d) forming a layer of overcladding material upon the exposed undercladding material; e) forming at least one via aperture through said overcladding material and said undercladding material; f) disposing a conductive material in said via aperture leaving a first portion of the conductive material exposed; and g) coupling the first portion of the conductive material to a second substrate to produce an electronic circuit.
- 37. The method of claim 36 additionally comprising removing the first substrate to expose a second portion of the conductive material.
- 38. The method of claim 37 additionally comprising disposing at least one electrode on the exposed second portion of the conductive material.
- 39. The method of claim 38 additionally comprising coupling the disposed electrode to a second electronic circuit assembly.
- 40. The method of claim 37 additionally comprising removing the second substrate to expose the first portion of the conductive material.
- 41. The method of claim 39 additionally comprising removing the second substrate to expose the first portion of the conductive material.
- 42. A method of constructing an electronic circuit assembly comprising the steps of:
a) forming a layer of undercladding material upon a first substrate; b) forming a wave guide core layer on said layer of cladding material; c) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material; d) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; e) disposing an electrode on the layer of overcladding material; f) disposing an electro-optic device on the layer of overcladding material; g) depositing an intermediate layer of cladding material over exposed overcladding material and over the electrode and the electro-optic device; h) removing a portion of the intermediate layer of cladding material and a portion of a top of the electrode until a plane along the top of the electro-optic device registers with a residual electrode surface and a residual cladding surface respectively remaining after removal of the portion of the top of the electrode and the portion of the intermediate layer of cladding material; i) disposing a second electrode on the residual electrode surface; j) coupling the second electrode to a second substrate; k) removing the first substrate to expose the undercladding material; l) forming at least one via aperture through said overcladding material and said undercladding material; and m) disposing a conductive material in said via aperture to produce an electronic circuit assembly.
- 43. The method of claim 42 additionally comprising coupling the conductive material to a second electronic circuit assembly, and removing said second substrate.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is continuation-in-part application of copending application having Ser. No. 09/574,422, file May 19, 2000, and entitled “Three-Dimensional-Opto-Electronic Modules with Electrical and Optical Interconnections and Methods for Making.”
[0002] Application Ser. No. 09/574,422 is a continuation-in-part of U.S. Pat. application Ser. No. 09/295,628 filed Apr. 20, 1999, entitled “Opto-Electronic Substrates With Electrical And Optical Interconnections And Methods For Making” and commonly assigned, and which claimed the benefit of U.S. Provisional Application No. 60/103,726 filed Oct. 9, 1998.
[0003] Application Ser. No. 09/574,422 is also a continuation-in-part of U.S. Pat. application Ser. No. 09/295,813 filed Apr. 20, 1999, entitled “Systems Based On Opto-Electronic Substrates With Electrical And Optical Interconnections And Methods For Making,” and commonly assigned, and which claimed the benefits of U.S. Provisional Application No. 60/103,726 filed Oct. 9, 1998.
[0004] Application Ser. No. 09/574,422 is also continuation-in-part of U.S. Pat. application Ser. No. 09/295,431, filed Apr. 20, 1999, entitled “Multi-Layer Opto-Electronic Substrates With Electrical And Optical Interconnections And Methods For Making,” and commonly assigned, and which claimed the benefits of U.S. Provisional Application No. 60/103,726 filed Oct. 9, 1998.
[0005] Benefit of all earlier filing dates is claimed with respect to common subject matter.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09574422 |
May 2000 |
US |
Child |
09757052 |
Jan 2001 |
US |