Wen CHU

Person

Tao Yuan Shien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for reducing compound semiconductor wafer distortion
- Patent number 10,410,979
- Issue date Sep 10, 2019
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing compound semiconductor wafer distortion
- Patent number 10,158,212
- Issue date Dec 18, 2018
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of backside copper metallization for semiconductor device...
- Patent number 9,548,276
- Issue date Jan 17, 2017
- WIN SEMICONDUCTORS CORP.
- Jason Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High breakdown voltage metal-insulator-metal capacitor
- Patent number 9,178,007
- Issue date Nov 3, 2015
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating apparatus and method
- Patent number 8,911,551
- Issue date Dec 16, 2014
- WIN Semiconductor Corp.
- Jason Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing backside copper layer for semiconductor chips
- Patent number 8,497,206
- Issue date Jul 30, 2013
- WIN Semiconductor Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using an electroless plating for depositing a metal seed...
- Patent number 8,003,532
- Issue date Aug 23, 2011
- Win Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF
- Publication number 20200373225
- Publication date Nov 26, 2020
- WIN Semiconductors Corp.
- Chih-Hsien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366418
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366913
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20160020178
- Publication date Jan 21, 2016
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR
- Publication number 20150318342
- Publication date Nov 5, 2015
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20130277845
- Publication date Oct 24, 2013
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING APPARATUS AND METHOD
- Publication number 20130034959
- Publication date Feb 7, 2013
- Jason CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING BACKSIDE COPPER LAYER FOR SEMICONDUCTOR CHIPS
- Publication number 20110201192
- Publication date Aug 18, 2011
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using an electroless plating for depositing a metal seed...
- Publication number 20110059610
- Publication date Mar 10, 2011
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Structure for reducing compound semiconductor wafer distortion

Structure for reducing compound semiconductor wafer distortion

Structure of backside copper metallization for semiconductor device...

High breakdown voltage metal-insulator-metal capacitor

Electroless plating apparatus and method

Method of processing backside copper layer for semiconductor chips

Method of using an electroless plating for depositing a metal seed...

Patents Applicationslast 30 patents

SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...

HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR

STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...

ELECTROLESS PLATING APPARATUS AND METHOD

METHOD OF PROCESSING BACKSIDE COPPER LAYER FOR SEMICONDUCTOR CHIPS

Method of using an electroless plating for depositing a metal seed...