Wen-Chuan FAN

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Smart clothing and its device mount
- Patent number 12,022,629
- Issue date Jun 25, 2024
- AMPAK TECHNOLOGY INC.
- Wen-Sung Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ closed-loop management of radio frequency power generator
- Patent number 11,854,768
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable conductive substrate
- Patent number 11,627,657
- Issue date Apr 11, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chain-Shu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate for a display device
- Patent number 11,276,808
- Issue date Mar 15, 2022
- Wen-Chang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive via in encapsulation connecti...
- Patent number 11,257,747
- Issue date Feb 22, 2022
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a conductive casing for heat dissipation...
- Patent number 10,593,629
- Issue date Mar 17, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,431,549
- Issue date Oct 1, 2019
- Powertech Technology Inc.
- Chien-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an LED module and module made thereof
- Patent number 10,211,188
- Issue date Feb 19, 2019
- Cheng Chang TransFlexDisplay Corp.
- Wen-Chang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device of pop stacking for preventing bridging of interp...
- Patent number 9,991,248
- Issue date Jun 5, 2018
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reinforced redistribution layer
- Patent number 9,859,233
- Issue date Jan 2, 2018
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacking chips
- Patent number 9,853,015
- Issue date Dec 26, 2017
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less package structure
- Patent number 9,837,385
- Issue date Dec 5, 2017
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband antenna and wireless communication device including the same
- Patent number 9,450,288
- Issue date Sep 20, 2016
- Wistron NeWeb Corp.
- Wei-Hung Ruan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 9,324,651
- Issue date Apr 26, 2016
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-type semiconductor package having EMI shielding layer con...
- Patent number 8,853,834
- Issue date Oct 7, 2014
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband antenna
- Patent number 8,779,986
- Issue date Jul 15, 2014
- Wistron NeWeb Corporation
- Wen-Chuan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package utilizing tape to reinforce fixing of leads t...
- Patent number 8,541,870
- Issue date Sep 24, 2013
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an EMI shielding layer on all surfaces of a semi...
- Patent number 8,420,437
- Issue date Apr 16, 2013
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stacked package and its mother chip to save interposer
- Patent number 8,304,917
- Issue date Nov 6, 2012
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame package structure for side-by-side disposed chips
- Patent number 8,299,587
- Issue date Oct 30, 2012
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an isolated inner lead from a leadframe
- Patent number 8,240,029
- Issue date Aug 14, 2012
- Powertech Technology Inc.
- Wen-Jeng Fan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate panel having a plurality of substrate strips for semicond...
- Patent number 8,053,676
- Issue date Nov 8, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having isolated inner lead
- Patent number 8,049,339
- Issue date Nov 1, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method
- Patent number 7,972,904
- Issue date Jul 5, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strip for semiconductor packages
- Patent number 7,952,168
- Issue date May 31, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method to save interposer
- Patent number 7,927,919
- Issue date Apr 19, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrate and semiconductor package utilizing the substrate
- Patent number 7,919,851
- Issue date Apr 5, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board ready to slot
- Patent number 7,919,715
- Issue date Apr 5, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having stepwise depression in substrate
- Patent number 7,902,663
- Issue date Mar 8, 2011
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire-bonding on multi-zigzag fingers
- Patent number 7,821,112
- Issue date Oct 26, 2010
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR
- Publication number 20240087851
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Ting LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART CLOTHING AND ITS DEVICE MOUNT
- Publication number 20230284403
- Publication date Sep 7, 2023
- AMPAK Technology Inc.
- Wen-Sung FAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR
- Publication number 20230067745
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Ting LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DISPLAY MODULE
- Publication number 20230041709
- Publication date Feb 9, 2023
- National Yang Ming Chiao Tung University
- Chain-Shu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE CONDUCTIVE SUBSTRATE
- Publication number 20230042692
- Publication date Feb 9, 2023
- National Yang Ming Chiao Tung University
- Chain-Shu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200357770
- Publication date Nov 12, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335456
- Publication date Oct 22, 2020
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328144
- Publication date Oct 15, 2020
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE OF A DISPLAY DEVICE
- Publication number 20200302858
- Publication date Sep 24, 2020
- XINCHEN TECHNOLOGY CO., LTD.
- WEN-CHANG FAN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200243449
- Publication date Jul 30, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200243461
- Publication date Jul 30, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE FOR A DISPLAY DEVICE
- Publication number 20200227605
- Publication date Jul 16, 2020
- XINCHEN TECHNOLOGY CO., LTD.
- WEN-CHANG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200013721
- Publication date Jan 9, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200006274
- Publication date Jan 2, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190244943
- Publication date Aug 8, 2019
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190214347
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Chien-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER
- Publication number 20180182682
- Publication date Jun 28, 2018
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN LED MODULE AND MODULE MADE THEREOF
- Publication number 20180158805
- Publication date Jun 7, 2018
- Cheng Chang TransFlexDisplay Corp.
- Wen-Chang FAN
- F21 - LIGHTING
Information Patent Application
METHOD AND DEVICE OF POP STACKING FOR PREVENTING BRIDGING OF INTERP...
- Publication number 20180019235
- Publication date Jan 18, 2018
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUF...
- Publication number 20170229426
- Publication date Aug 10, 2017
- Powertech Technology Inc.
- Ching Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20160163624
- Publication date Jun 9, 2016
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING LAYER CON...
- Publication number 20140167231
- Publication date Jun 19, 2014
- Powertech Technology Inc.
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADBAND ANTENNA AND WIRELESS COMMUNICATION DEVICE INCLUDING THE SAME
- Publication number 20140139377
- Publication date May 22, 2014
- Wei-Hung RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wideband Antenna
- Publication number 20130021209
- Publication date Jan 24, 2013
- Wen-Chuan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
- Publication number 20120228759
- Publication date Sep 13, 2012
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE
- Publication number 20120049359
- Publication date Mar 1, 2012
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE STRUCTURE FOR SIDE-BY-SIDE DISPOSED CHIPS
- Publication number 20110260306
- Publication date Oct 27, 2011
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND FLIP CHIP PACKAGE WITH GRADATIONAL PAD PITCHES
- Publication number 20110169157
- Publication date Jul 14, 2011
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER
- Publication number 20110133324
- Publication date Jun 9, 2011
- Powertech Technology Inc.
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD
- Publication number 20100261315
- Publication date Oct 14, 2010
- Wen-Jeng FAN
- H01 - BASIC ELECTRIC ELEMENTS

Wen-Chuan FAN

Person

Patents Grantslast 30 patents

Smart clothing and its device mount

In-situ closed-loop management of radio frequency power generator

Stretchable conductive substrate

Conductive substrate for a display device

Semiconductor package with conductive via in encapsulation connecti...

Semiconductor package with a conductive casing for heat dissipation...

Semiconductor package and manufacturing method thereof

Method for making an LED module and module made thereof

Method and device of pop stacking for preventing bridging of interp...

Semiconductor device package with reinforced redistribution layer

Semiconductor device with stacking chips

Substrate-less package structure

Broadband antenna and wireless communication device including the same

Package structure

Leadframe-type semiconductor package having EMI shielding layer con...

Wideband antenna

Semiconductor package utilizing tape to reinforce fixing of leads t...

Method for forming an EMI shielding layer on all surfaces of a semi...

Multi-chip stacked package and its mother chip to save interposer

Lead frame package structure for side-by-side disposed chips

Method for forming an isolated inner lead from a leadframe

Substrate panel having a plurality of substrate strips for semicond...

Semiconductor package having isolated inner lead

Wafer level packaging method

Substrate strip for semiconductor packages

Semiconductor packaging method to save interposer

Laminate substrate and semiconductor package utilizing the substrate

Circuit board ready to slot

Semiconductor package having stepwise depression in substrate

Semiconductor device with wire-bonding on multi-zigzag fingers

Patents Applicationslast 30 patents

IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR

SMART CLOTHING AND ITS DEVICE MOUNT

IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR

STRETCHABLE DISPLAY MODULE

STRETCHABLE CONDUCTIVE SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE SUBSTRATE OF A DISPLAY DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE SUBSTRATE FOR A DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER

METHOD FOR MAKING AN LED MODULE AND MODULE MADE THEREOF

METHOD AND DEVICE OF POP STACKING FOR PREVENTING BRIDGING OF INTERP...

FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUF...

PACKAGE STRUCTURE

LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING LAYER CON...

BROADBAND ANTENNA AND WIRELESS COMMUNICATION DEVICE INCLUDING THE SAME

Wideband Antenna

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

BALL GRID ARRAY PACKAGE

LEAD FRAME PACKAGE STRUCTURE FOR SIDE-BY-SIDE DISPOSED CHIPS

SUBSTRATE AND FLIP CHIP PACKAGE WITH GRADATIONAL PAD PITCHES

MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER

WAFER LEVEL PACKAGING METHOD