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Hsinchu County, TW
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Patents Grants
last 30 patents
Information
Patent Grant
In-situ closed-loop management of radio frequency power generator
Patent number
11,854,768
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Wei Ting Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stretchable conductive substrate
Patent number
11,627,657
Issue date
Apr 11, 2023
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
Chain-Shu Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive substrate for a display device
Patent number
11,276,808
Issue date
Mar 15, 2022
Wen-Chang Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with conductive via in encapsulation connecti...
Patent number
11,257,747
Issue date
Feb 22, 2022
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with a conductive casing for heat dissipation...
Patent number
10,593,629
Issue date
Mar 17, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
10,431,549
Issue date
Oct 1, 2019
Powertech Technology Inc.
Chien-Wen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making an LED module and module made thereof
Patent number
10,211,188
Issue date
Feb 19, 2019
Cheng Chang TransFlexDisplay Corp.
Wen-Chang Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device of pop stacking for preventing bridging of interp...
Patent number
9,991,248
Issue date
Jun 5, 2018
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with reinforced redistribution layer
Patent number
9,859,233
Issue date
Jan 2, 2018
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with stacking chips
Patent number
9,853,015
Issue date
Dec 26, 2017
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-less package structure
Patent number
9,837,385
Issue date
Dec 5, 2017
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Broadband antenna and wireless communication device including the same
Patent number
9,450,288
Issue date
Sep 20, 2016
Wistron NeWeb Corp.
Wei-Hung Ruan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
9,324,651
Issue date
Apr 26, 2016
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe-type semiconductor package having EMI shielding layer con...
Patent number
8,853,834
Issue date
Oct 7, 2014
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wideband antenna
Patent number
8,779,986
Issue date
Jul 15, 2014
Wistron NeWeb Corporation
Wen-Chuan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package utilizing tape to reinforce fixing of leads t...
Patent number
8,541,870
Issue date
Sep 24, 2013
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an EMI shielding layer on all surfaces of a semi...
Patent number
8,420,437
Issue date
Apr 16, 2013
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip stacked package and its mother chip to save interposer
Patent number
8,304,917
Issue date
Nov 6, 2012
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame package structure for side-by-side disposed chips
Patent number
8,299,587
Issue date
Oct 30, 2012
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an isolated inner lead from a leadframe
Patent number
8,240,029
Issue date
Aug 14, 2012
Powertech Technology Inc.
Wen-Jeng Fan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Substrate panel having a plurality of substrate strips for semicond...
Patent number
8,053,676
Issue date
Nov 8, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package having isolated inner lead
Patent number
8,049,339
Issue date
Nov 1, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packaging method
Patent number
7,972,904
Issue date
Jul 5, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate strip for semiconductor packages
Patent number
7,952,168
Issue date
May 31, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method to save interposer
Patent number
7,927,919
Issue date
Apr 19, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate substrate and semiconductor package utilizing the substrate
Patent number
7,919,851
Issue date
Apr 5, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board ready to slot
Patent number
7,919,715
Issue date
Apr 5, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package having stepwise depression in substrate
Patent number
7,902,663
Issue date
Mar 8, 2011
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with wire-bonding on multi-zigzag fingers
Patent number
7,821,112
Issue date
Oct 26, 2010
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating wafer level chip scale packages
Patent number
7,776,649
Issue date
Aug 17, 2010
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR
Publication number
20240087851
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei Ting LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMART CLOTHING AND ITS DEVICE MOUNT
Publication number
20230284403
Publication date
Sep 7, 2023
AMPAK Technology Inc.
Wen-Sung FAN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
IN-SITU CLOSED-LOOP MANAGEMENT OF RADIO FREQUENCY POWER GENERATOR
Publication number
20230067745
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei Ting LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRETCHABLE DISPLAY MODULE
Publication number
20230041709
Publication date
Feb 9, 2023
National Yang Ming Chiao Tung University
Chain-Shu Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRETCHABLE CONDUCTIVE SUBSTRATE
Publication number
20230042692
Publication date
Feb 9, 2023
National Yang Ming Chiao Tung University
Chain-Shu Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200357770
Publication date
Nov 12, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200335456
Publication date
Oct 22, 2020
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200328144
Publication date
Oct 15, 2020
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE SUBSTRATE OF A DISPLAY DEVICE
Publication number
20200302858
Publication date
Sep 24, 2020
XINCHEN TECHNOLOGY CO., LTD.
WEN-CHANG FAN
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200243449
Publication date
Jul 30, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200243461
Publication date
Jul 30, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE SUBSTRATE FOR A DISPLAY DEVICE
Publication number
20200227605
Publication date
Jul 16, 2020
XINCHEN TECHNOLOGY CO., LTD.
WEN-CHANG FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200013721
Publication date
Jan 9, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200006274
Publication date
Jan 2, 2020
Powertech Technology Inc.
Chia-Wei Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20190244943
Publication date
Aug 8, 2019
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20190214347
Publication date
Jul 11, 2019
Powertech Technology Inc.
Chien-Wen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER
Publication number
20180182682
Publication date
Jun 28, 2018
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING AN LED MODULE AND MODULE MADE THEREOF
Publication number
20180158805
Publication date
Jun 7, 2018
Cheng Chang TransFlexDisplay Corp.
Wen-Chang FAN
F21 - LIGHTING
Information
Patent Application
METHOD AND DEVICE OF POP STACKING FOR PREVENTING BRIDGING OF INTERP...
Publication number
20180019235
Publication date
Jan 18, 2018
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUF...
Publication number
20170229426
Publication date
Aug 10, 2017
Powertech Technology Inc.
Ching Wei HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20160163624
Publication date
Jun 9, 2016
Powertech Technology Inc.
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING LAYER CON...
Publication number
20140167231
Publication date
Jun 19, 2014
Powertech Technology Inc.
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BROADBAND ANTENNA AND WIRELESS COMMUNICATION DEVICE INCLUDING THE SAME
Publication number
20140139377
Publication date
May 22, 2014
Wei-Hung RUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wideband Antenna
Publication number
20130021209
Publication date
Jan 24, 2013
Wen-Chuan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
Publication number
20120228759
Publication date
Sep 13, 2012
Wen-Jeng Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL GRID ARRAY PACKAGE
Publication number
20120049359
Publication date
Mar 1, 2012
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME PACKAGE STRUCTURE FOR SIDE-BY-SIDE DISPOSED CHIPS
Publication number
20110260306
Publication date
Oct 27, 2011
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND FLIP CHIP PACKAGE WITH GRADATIONAL PAD PITCHES
Publication number
20110169157
Publication date
Jul 14, 2011
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP STACKED PACKAGE AND ITS MOTHER CHIP TO SAVE INTERPOSER
Publication number
20110133324
Publication date
Jun 9, 2011
Powertech Technology Inc.
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGING METHOD
Publication number
20100261315
Publication date
Oct 14, 2010
Wen-Jeng FAN
H01 - BASIC ELECTRIC ELEMENTS