Wen-Hung Lan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Backside power rail structure and methods of forming same
- Patent number 12,183,678
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical structure
- Patent number 12,062,705
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with backside power rails
- Patent number 12,057,385
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with hybrid nanostructures
- Patent number 12,057,477
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,040,329
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of multiple fin structures on a single substrate
- Patent number 11,973,079
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for back-side power rail device
- Patent number 11,961,915
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside self-aligned power rail and meth...
- Patent number 11,916,125
- Issue date Feb 27, 2024
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail structure and methods of forming same
- Patent number 11,842,965
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with backside power rails
- Patent number 11,742,280
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,664,378
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside self-aligned power rail and meth...
- Patent number 11,444,170
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with backside power rails
- Patent number 11,387,181
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of multiple fin structures on a single substrate
- Patent number 11,342,325
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet thickness
- Patent number 11,302,580
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for back-side power rail device
- Patent number 11,289,606
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail structure and methods of forming same
- Patent number 11,264,327
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with hybrid nanost...
- Patent number 11,257,903
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical structure
- Patent number 10,854,723
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with backside power rails
- Patent number 10,833,003
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,755,943
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,157,751
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a poly-crystalline silcon ingot from a nucle...
- Patent number 10,087,080
- Issue date Oct 2, 2018
- Sino-American Silicon Products Inc.
- Wen-Huai Yu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Poly-crystalline silicon ingot having a nucleation promotion layer...
- Patent number 10,065,863
- Issue date Sep 4, 2018
- Sino-American Silicon Products Inc.
- Wen-Huai Yu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Crystal growth apparatus and thermal insulation cover of the same
- Patent number 10,053,797
- Issue date Aug 21, 2018
- GlobalWafers Co., Ltd.
- Lu-Chung Chuang
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and method of forming vertical structure
- Patent number 9,755,033
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stirring apparatus of ingot casting furnace
- Patent number 9,708,727
- Issue date Jul 18, 2017
- GLOBALWAFERS CO., LTD.
- Lu-Chung Chuang
- C30 - CRYSTAL GROWTH
Information Patent Grant
Crystalline silicon ingot including nucleation promotion layer
- Patent number 9,637,391
- Issue date May 2, 2017
- Sino-American Silicon Products Inc.
- Wen-Huai Yu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of fabricating crystalline silicon ingot including nucleatio...
- Patent number 9,493,357
- Issue date Nov 15, 2016
- Sino-American Silicon Products Inc.
- Wen-Huai Yu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Wireless signal transmission device and signal receiver with a wave...
- Patent number 9,197,337
- Issue date Nov 24, 2015
- Wistron NeWeb Corp.
- Ta-Jen Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES
- Publication number 20240371934
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS
- Publication number 20240363522
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240339455
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE
- Publication number 20240274601
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE
- Publication number 20240258432
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE SELF-ALIGNED POWER RAIL AND METH...
- Publication number 20240250141
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL STRUCTURE AND METHODS OF FORMING SAME
- Publication number 20240063125
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20240038719
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MEMORY DEVICE AT A BACKSIDE OF A WAFER SUBSTRA...
- Publication number 20240023463
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH POWER RAIL
- Publication number 20240021708
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240006479
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LAYER FOR SEMICONDUCTOR DEVICE
- Publication number 20230402405
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS
- Publication number 20230369196
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230290780
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM FREE WAFER BONDING METHODS AND DEVICES
- Publication number 20230142902
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shi Ning JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE SELF-ALIGNED POWER RAIL AND METH...
- Publication number 20220359699
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS
- Publication number 20220344254
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220328482
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Backside Self-Aligned Power Rail and Meth...
- Publication number 20220293759
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE
- Publication number 20220285343
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanosheet Thickness
- Publication number 20220238384
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE
- Publication number 20220216346
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Power Rail Structure and Methods of Forming Same
- Publication number 20220181259
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES
- Publication number 20220173213
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanosheet Thickness
- Publication number 20210375859
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Ting Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE
- Publication number 20210351303
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shi Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE
- Publication number 20210296312
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES AND METHOD FOR F...
- Publication number 20210159311
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Power Rail Structure and Methods of Forming Same
- Publication number 20210134721
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICAL STRUCTURE
- Publication number 20210111262
- Publication date Apr 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS

Wen-Hung Lan

Person

Patents Grantslast 30 patents

Backside power rail structure and methods of forming same

Semiconductor device and method of forming vertical structure

Integrated circuits with backside power rails

Semiconductor structure with hybrid nanostructures

Semiconductor device structure and methods of forming the same

Integration of multiple fin structures on a single substrate

Capacitance reduction for back-side power rail device

Semiconductor device with backside self-aligned power rail and meth...

Backside power rail structure and methods of forming same

Integrated circuits with backside power rails

Semiconductor device structure and methods of forming the same

Semiconductor device with backside self-aligned power rail and meth...

Integrated circuits with backside power rails

Integration of multiple fin structures on a single substrate

Nanosheet thickness

Capacitance reduction for back-side power rail device

Backside power rail structure and methods of forming same

Method for manufacturing semiconductor structure with hybrid nanost...

Semiconductor device and method of forming vertical structure

Integrated circuits with backside power rails

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Methods of fabricating a poly-crystalline silcon ingot from a nucle...

Poly-crystalline silicon ingot having a nucleation promotion layer...

Crystal growth apparatus and thermal insulation cover of the same

Semiconductor device and method of forming vertical structure

Stirring apparatus of ingot casting furnace

Crystalline silicon ingot including nucleation promotion layer

Method of fabricating crystalline silicon ingot including nucleatio...

Wireless signal transmission device and signal receiver with a wave...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES

INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE

CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE

SEMICONDUCTOR DEVICE WITH BACKSIDE SELF-ALIGNED POWER RAIL AND METH...

BACKSIDE POWER RAIL STRUCTURE AND METHODS OF FORMING SAME

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

METHOD FOR FORMING A MEMORY DEVICE AT A BACKSIDE OF A WAFER SUBSTRA...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH POWER RAIL

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PROTECTION LAYER FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

TRIM FREE WAFER BONDING METHODS AND DEVICES

SEMICONDUCTOR DEVICE WITH BACKSIDE SELF-ALIGNED POWER RAIL AND METH...

INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Semiconductor Device with Backside Self-Aligned Power Rail and Meth...

INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE

Nanosheet Thickness

CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE

Backside Power Rail Structure and Methods of Forming Same

SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES

Nanosheet Thickness

CAPACITANCE REDUCTION FOR BACK-SIDE POWER RAIL DEVICE

INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE

SEMICONDUCTOR STRUCTURE WITH HYBRID NANOSTRUCTURES AND METHOD FOR F...

Backside Power Rail Structure and Methods of Forming Same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICAL STRUCTURE