Wen Shi

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free high-insulating ceramic coating zinc oxide arrester valve...
- Patent number 10,774,011
- Issue date Sep 15, 2020
- TDK ELECTRONICS AG
- Guangqiang Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability test structure for multilevel interconnect
- Patent number 8,323,990
- Issue date Dec 4, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wen Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose poly edge test structure
- Patent number 8,164,091
- Issue date Apr 24, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wen Shi
- G01 - MEASURING TESTING
Information Patent Grant
Multi-purpose poly edge test structure
- Patent number 7,439,538
- Issue date Oct 21, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wen Shi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Lead-Free High-Insulating Ceramic Coating Zinc Oxide Arrester Valve...
- Publication number 20200223761
- Publication date Jul 16, 2020
- TDK Electronics AG
- Guangqiang Pei
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR TESTING
- Publication number 20110074459
- Publication date Mar 31, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wei Wei Ruan
- G01 - MEASURING TESTING
Information Patent Application
Multi-purpose poly edge test structure
- Publication number 20090033354
- Publication date Feb 5, 2009
- Semiconductor Manufacturing International Corporation
- Wen Shi
- G01 - MEASURING TESTING
Information Patent Application
Multi-purpose poly edge test structure
- Publication number 20080128692
- Publication date Jun 5, 2008
- Semiconductor Manufacturing International Corporation
- Wen Shi
- G01 - MEASURING TESTING
Information Patent Application
Reliability test structure for multilevel interconnect
- Publication number 20080128693
- Publication date Jun 5, 2008
- Semiconductor Manufacturing International Corporation
- Wen Shi
- H01 - BASIC ELECTRIC ELEMENTS