Wen-Zen Shen

Person

Hsin Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,080,681
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse-width modulation signal observation circuit and hardware-in-t...
- Patent number 12,039,232
- Issue date Jul 16, 2024
- Industrial Technology Research Institute
- Chun-An Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Voltage measurement device for pulse-width modulation signals, moto...
- Patent number 11,658,599
- Issue date May 23, 2023
- Industrial Technology Research Institute
- Wen-Che Shen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Motor parameter estimation device and method
- Patent number 11,616,462
- Issue date Mar 28, 2023
- Industrial Technology Research Institute
- Chia-Min Ting
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,502,015
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,424,219
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,106,241
- Issue date Aug 31, 2021
- AU OPTRONICS CORPORATION
- Po-Lan Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Output torque calculation device and calculation method thereof
- Patent number 10,581,359
- Issue date Mar 3, 2020
- Industrial Technology Research Institute
- Chun-An Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate interconnections having different sizes
- Patent number 9,773,755
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving the strength of micro-bump joints
- Patent number 9,768,138
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method and stacking structure t...
- Patent number 9,373,564
- Issue date Jun 21, 2016
- Industrial Technology Research Institute
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strength of micro-bump joints
- Patent number 9,219,046
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate interconnections having different sizes
- Patent number 9,142,533
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strength of micro-bump joints
- Patent number 8,901,736
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zigzag pattern for TSV copper adhesion
- Patent number 8,653,648
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed pillar structure
- Patent number 8,241,963
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming through silicon via with dummy structure
- Patent number 8,202,800
- Issue date Jun 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strong interconnection post geometry
- Patent number 8,178,970
- Issue date May 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via with dummy structure and method for forming the...
- Patent number 7,969,013
- Issue date Jun 28, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ACS circuit and Viterbi decoder with the circuit
- Patent number 7,581,160
- Issue date Aug 25, 2009
- Mediatek Inc.
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
PRML system with a branch estimator
- Patent number 7,178,093
- Issue date Feb 13, 2007
- Mediatek Inc.
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
ACS circuit and viterbi decoder with the circuit
- Patent number 7,127,667
- Issue date Oct 24, 2006
- Mediatek Inc.
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Survivor path memory circuit and Viterbi decoder with the same
- Patent number 7,120,855
- Issue date Oct 10, 2006
- Mediatek Inc.
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for antialiasing
- Patent number 5,903,279
- Issue date May 11, 1999
- Industrial Technology Research Institute
- Chi-Chih Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alkalline-solution-developable liquid photographic composition
- Patent number 5,153,102
- Issue date Oct 6, 1992
- Industrial Technology Research Institute
- Rong-Jer Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive compositions having enhanced photopolymerization rate
- Patent number 5,011,762
- Issue date Apr 30, 1991
- Industrial Technology Research Institute
- Rong-Jer Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multiplication and accumulation device
- Patent number 4,991,131
- Issue date Feb 5, 1991
- Industrial Technology Research Institute
- I-Hau Yeh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY
- Publication number 20250017001
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363587
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-FREQUENCY NOSIE TRANSISTORS WITH CURVED CHANNELS
- Publication number 20240088289
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230378132
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE MEASUREMENT DEVICE FOR PULSE-WIDTH MODULATION SIGNALS, MOTO...
- Publication number 20230188075
- Publication date Jun 15, 2023
- Industrial Technology Research Institute
- WEN-CHE SHEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359335
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336416
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSE-WIDTH MODULATION SIGNAL OBSERVATION CIRCUIT AND HARDWARE-IN-T...
- Publication number 20220114303
- Publication date Apr 14, 2022
- Industrial Technology Research Institute
- CHUN-AN LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210375711
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210225806
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20200183454
- Publication date Jun 11, 2020
- AU OPTRONICS CORPORATION
- PO-LAN HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Improving the Strength of Micro-Bump Joints
- Publication number 20160104685
- Publication date Apr 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE, MANUFACTURING METHOD AND STACKING STRUCTURE T...
- Publication number 20160043018
- Publication date Feb 11, 2016
- Industrial Technology Research Institute
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Interconnections having Different Sizes
- Publication number 20160013162
- Publication date Jan 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strength of Micro-Bump Joints
- Publication number 20150037936
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed Pillar Structure
- Publication number 20120012997
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strength of Micro-Bump Joints
- Publication number 20110291262
- Publication date Dec 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Interconnections having Different Sizes
- Publication number 20110285023
- Publication date Nov 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THROUGH SILICON VIA WITH DUMMY STRUCTURE
- Publication number 20110217841
- Publication date Sep 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE...
- Publication number 20110095436
- Publication date Apr 28, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRONG INTERCONNECTION POST GEOMETRY
- Publication number 20110068465
- Publication date Mar 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zigzag Pattern for TSV Copper Adhesion
- Publication number 20100084747
- Publication date Apr 8, 2010
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACS circuit and Viterbi decoder with the circuit
- Publication number 20070044008
- Publication date Feb 22, 2007
- MediaTek, Inc.
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Survivor path memory circuit and viterbi decoder with the same
- Publication number 20030212950
- Publication date Nov 13, 2003
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACS circuit and viterbi decoder with the circuit
- Publication number 20030196163
- Publication date Oct 16, 2003
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PRML system with a branch estimator
- Publication number 20030182618
- Publication date Sep 25, 2003
- Hong-Ching Chen
- H03 - BASIC ELECTRONIC CIRCUITRY

Wen-Zen Shen

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Pulse-width modulation signal observation circuit and hardware-in-t...

Voltage measurement device for pulse-width modulation signals, moto...

Motor parameter estimation device and method

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Display device

Output torque calculation device and calculation method thereof

Substrate interconnections having different sizes

Improving the strength of micro-bump joints

Semiconductor device, manufacturing method and stacking structure t...

Strength of micro-bump joints

Substrate interconnections having different sizes

Strength of micro-bump joints

Zigzag pattern for TSV copper adhesion

Recessed pillar structure

Method of forming through silicon via with dummy structure

Strong interconnection post geometry

Through silicon via with dummy structure and method for forming the...

ACS circuit and Viterbi decoder with the circuit

PRML system with a branch estimator

ACS circuit and viterbi decoder with the circuit

Survivor path memory circuit and Viterbi decoder with the same

Method for antialiasing

Alkalline-solution-developable liquid photographic composition

Photosensitive compositions having enhanced photopolymerization rate

Multiplication and accumulation device

Patents Applicationslast 30 patents

NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY

SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING PACKAGE STRUCTURE

LOW-FREQUENCY NOSIE TRANSISTORS WITH CURVED CHANNELS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

VOLTAGE MEASUREMENT DEVICE FOR PULSE-WIDTH MODULATION SIGNALS, MOTO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PULSE-WIDTH MODULATION SIGNAL OBSERVATION CIRCUIT AND HARDWARE-IN-T...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE

Improving the Strength of Micro-Bump Joints

SEMICONDCUTOR DEVICE, MANUFACTURING METHOD AND STACKING STRUCTURE T...

Substrate Interconnections having Different Sizes

Strength of Micro-Bump Joints

Recessed Pillar Structure

Strength of Micro-Bump Joints

Substrate Interconnections having Different Sizes

METHOD OF FORMING THROUGH SILICON VIA WITH DUMMY STRUCTURE

THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE...

STRONG INTERCONNECTION POST GEOMETRY

Zigzag Pattern for TSV Copper Adhesion

ACS circuit and Viterbi decoder with the circuit

Survivor path memory circuit and viterbi decoder with the same

ACS circuit and viterbi decoder with the circuit

PRML system with a branch estimator