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Weng Hong Teh
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Cambridge, MA, US
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Patents Grants
last 30 patents
Information
Patent Grant
High density substrate routing in package
Patent number
11,810,884
Issue date
Nov 7, 2023
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
11,251,150
Issue date
Feb 15, 2022
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor die with bumpless die-package interface for...
Patent number
11,201,128
Issue date
Dec 14, 2021
Intel Corporation
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
10,861,815
Issue date
Dec 8, 2020
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having spacer layer
Patent number
10,636,769
Issue date
Apr 28, 2020
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with air pressure sensor
Patent number
10,508,961
Issue date
Dec 17, 2019
Intel Corporation
Kevin L. Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
High density substrate routing in package
Patent number
10,438,915
Issue date
Oct 8, 2019
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
10,199,346
Issue date
Feb 5, 2019
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetic encapsulation for microelectromechanical systems (MEMS) de...
Patent number
10,179,729
Issue date
Jan 15, 2019
Intel Corporation
Sarah K. Haney
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of making an accelerometer
Patent number
10,156,583
Issue date
Dec 18, 2018
Intel Corporation
Qing Ma
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor package having spacer layer
Patent number
10,083,936
Issue date
Sep 25, 2018
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in BBUL package
Patent number
9,929,119
Issue date
Mar 27, 2018
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical interconnect on bumpless build-up layer package
Patent number
9,800,015
Issue date
Oct 24, 2017
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded structures for package-on-package architecture
Patent number
9,748,177
Issue date
Aug 29, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration of laminate MEMS in BBUL coreless package
Patent number
9,708,178
Issue date
Jul 18, 2017
Intel Corporation
Weng Hong Teh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a microelectronic device package
Patent number
9,686,870
Issue date
Jun 20, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous integration of microfluidic devices in package struct...
Patent number
9,674,945
Issue date
Jun 6, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BBUL material integration in-plane with embedded die for warpage co...
Patent number
9,601,421
Issue date
Mar 21, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumpless die-package interface for bumpless build-up layer (BBUL)
Patent number
9,576,909
Issue date
Feb 21, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumpless build-up layer (BBUL) semiconductor package with ultra-thi...
Patent number
9,520,350
Issue date
Dec 13, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumpless build-up layer package including an integrated heat spreader
Patent number
9,520,376
Issue date
Dec 13, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, system and method for providing MEMS structures of a semico...
Patent number
9,505,610
Issue date
Nov 29, 2016
Intel Corporation
Weng Hong Teh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Multi die package having a die and a spacer layer in a recess
Patent number
9,490,196
Issue date
Nov 8, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in BBUL package
Patent number
9,437,569
Issue date
Sep 6, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductive inertial sensor architecture and fabrication in packaging...
Patent number
9,429,427
Issue date
Aug 30, 2016
Intel Corporation
Qing Ma
G01 - MEASURING TESTING
Information
Patent Grant
Embedded structures for package-on-package architecture
Patent number
9,368,401
Issue date
Jun 14, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic field shielding for packaging build-up architectures
Patent number
9,345,184
Issue date
May 17, 2016
Intel Corporation
Sasha Oster
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Controlled solder-on-die integrations on packages and methods of as...
Patent number
9,299,660
Issue date
Mar 29, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques, systems and devices related to acceleration measurement
Patent number
9,297,824
Issue date
Mar 29, 2016
Intel Corporation
Qing Ma
G01 - MEASURING TESTING
Information
Patent Grant
Optical interconnect on bumpless build-up layer package
Patent number
9,275,969
Issue date
Mar 1, 2016
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20240021562
Publication date
Jan 18, 2024
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...
Publication number
20230420400
Publication date
Dec 28, 2023
Intel Corporation
Pramod MALATKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20220130789
Publication date
Apr 28, 2022
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...
Publication number
20220068861
Publication date
Mar 3, 2022
Intel Corporation
Pramod MALATKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20210043596
Publication date
Feb 11, 2021
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20190393180
Publication date
Dec 26, 2019
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20190139926
Publication date
May 9, 2019
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING SPACER LAYER
Publication number
20190006325
Publication date
Jan 3, 2019
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20180145047
Publication date
May 24, 2018
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE
Publication number
20170225946
Publication date
Aug 10, 2017
Intel Corporation
Weng Hong TEH
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
Publication number
20170053887
Publication date
Feb 23, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...
Publication number
20170022050
Publication date
Jan 26, 2017
Sarah K. HANEY
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MULTI-DIE PACKAGE STRUCTURES
Publication number
20170025392
Publication date
Jan 26, 2017
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
Publication number
20160284644
Publication date
Sep 29, 2016
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL INTERCONNECT ON BUMPLESS BUILD-UP LAYER PACKAGE
Publication number
20160254641
Publication date
Sep 1, 2016
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACCELEROMETER AND METHOD OF MAKING SAME
Publication number
20160245841
Publication date
Aug 25, 2016
Intel Corporation
Qing MA
G01 - MEASURING TESTING
Information
Patent Application
BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL)
Publication number
20160233166
Publication date
Aug 11, 2016
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged Semiconductor Die with Bumpless Die-Package Interface for...
Publication number
20160133590
Publication date
May 12, 2016
Pramod Malatkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR
Publication number
20160076961
Publication date
Mar 17, 2016
Kevin L. Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
Publication number
20160079196
Publication date
Mar 17, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER
Publication number
20160027757
Publication date
Jan 28, 2016
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...
Publication number
20150291415
Publication date
Oct 15, 2015
Sarah K. HANEY
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ARRANGEMENT OF THROUGH-HOLE STRUCTURES OF A SEMICONDUCTOR PACKAGE
Publication number
20150217995
Publication date
Aug 6, 2015
Weng Hong Teh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
Publication number
20150194406
Publication date
Jul 9, 2015
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC FIELD SHIELDING FOR PACKAGING BUILD-UP ARCHITECTURES
Publication number
20150189797
Publication date
Jul 2, 2015
Intel Corporation
Sasha Oster
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SECONDARY DEVICE INTEGRATION INTO CORELESS MICROELECTRONIC DEVICE P...
Publication number
20150135526
Publication date
May 21, 2015
Intel Corporation
WENG HONG TEH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER
Publication number
20150104907
Publication date
Apr 16, 2015
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICO...
Publication number
20150084139
Publication date
Mar 26, 2015
Weng Hong Teh
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
Publication number
20150014861
Publication date
Jan 15, 2015
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A MAGNETIC MEMS TUNABLE CAPACITOR
Publication number
20150002984
Publication date
Jan 1, 2015
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS