Wenjian LIN

Person

Zhuhai City, CN

People

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240222143
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240178088
- Publication date May 30, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR
- Publication number 20240153819
- Publication date May 9, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED FLIP CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071852
- Publication date Feb 29, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...
- Publication number 20240047227
- Publication date Feb 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282565
- Publication date Sep 7, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGING SUBSTRATE, AND PACKAGING SUBST...
- Publication number 20230232545
- Publication date Jul 20, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Wenjian LIN

Person

Patents Applicationslast 30 patents

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE MANUFACTURING METHOD, EMBEDDED SUBSTRATE AND SEMICONDUCTOR

EMBEDDED FLIP CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A PACKAGING SUBSTRATE, AND PACKAGING SUBST...