Wenting Hou

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for reducing tungsten resistivity
- Patent number 11,655,534
- Issue date May 23, 2023
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon-containing layer for bit line resistance reduction
- Patent number 11,637,107
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-containing layer for bit line resistance reduction
- Patent number 11,626,410
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for reducing tungsten resistivity
- Patent number 11,447,857
- Issue date Sep 20, 2022
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,257,677
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for filling a feature disposed in a substrate
- Patent number 10,950,500
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap layer for bit line resistance reduction
- Patent number 10,700,072
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for filling substrate features with cobalt
- Patent number 10,304,732
- Issue date May 28, 2019
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Layered Substrate with Ruthenium Layer and Method for Producing
- Publication number 20240282709
- Publication date Aug 22, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...
- Publication number 20240249920
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Wenting HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240234204
- Publication date Jul 11, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY GAPFILL
- Publication number 20240175120
- Publication date May 30, 2024
- Applied Materials, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240136223
- Publication date Apr 25, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20240038859
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY
- Publication number 20240006236
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Containing Layer for Bit Line Resistance Reduction
- Publication number 20220406788
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Containing Layer for Bit Line Resistance Reduction
- Publication number 20220406790
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REDUCING TUNGSTEN RESITIVITY
- Publication number 20220341025
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Wenting HOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20220231137
- Publication date Jul 21, 2022
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20220130676
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR REDUCING TUNGSTEN RESITIVITY
- Publication number 20220081756
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Wenting HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20210233770
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT INTERCONNECTION
- Publication number 20210123139
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Chunming ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cap Layer For Bit Line Resistance Reduction
- Publication number 20200235104
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cap Layer For Bit Line Resistance Reduction
- Publication number 20200126996
- Publication date Apr 23, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING SUBSTRATE FEATURES WITH COBALT
- Publication number 20190088540
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20180323103
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-COATED SHIELD USING IN VHF-RF PVD CHAMBERS
- Publication number 20170145553
- Publication date May 25, 2017
- Applied Materials, Inc.
- Zhendong LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Wenting Hou

Person

Patents Grantslast 30 patents

Methods and devices for subtractive self-alignment

Apparatus for reducing tungsten resistivity

Silicon-containing layer for bit line resistance reduction

Silicon-containing layer for bit line resistance reduction

Methods and apparatus for reducing tungsten resistivity

Methods and devices for subtractive self-alignment

Methods and apparatus for filling a feature disposed in a substrate

Cap layer for bit line resistance reduction

Methods and apparatus for filling substrate features with cobalt

Patents Applicationslast 30 patents

Layered Substrate with Ruthenium Layer and Method for Producing

REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...

Ru Liner above a Barrier Layer

LOW RESISTIVITY GAPFILL

Ru Liner above a Barrier Layer

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

METAL CAP FOR CONTACT RESISTANCE REDUCTION

PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY

Silicon-Containing Layer for Bit Line Resistance Reduction

Silicon-Containing Layer for Bit Line Resistance Reduction

APPARATUS FOR REDUCING TUNGSTEN RESITIVITY

METAL CAP FOR CONTACT RESISTANCE REDUCTION

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHODS AND APPARATUS FOR REDUCING TUNGSTEN RESITIVITY

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT INTERCONNECTION

Cap Layer For Bit Line Resistance Reduction

Cap Layer For Bit Line Resistance Reduction

METHODS AND APPARATUS FOR FILLING SUBSTRATE FEATURES WITH COBALT

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

PRE-COATED SHIELD USING IN VHF-RF PVD CHAMBERS