Wenxu Xie

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation of a substrate electrically connected to a plurality...
- Patent number 11,276,645
- Issue date Mar 15, 2022
- Huawei Technologies Co., Ltd.
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND PACKAGING METHOD
- Publication number 20200381361
- Publication date Dec 3, 2020
- Huawei Technologies Co., Ltd
- Nan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD
- Publication number 20180308789
- Publication date Oct 25, 2018
- Huawei Technologies Co., Ltd
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS