Wern Ken Daryl Wee

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including roughening features
- Patent number 10,937,744
- Issue date Mar 2, 2021
- Infineon Technologies AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230197586
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ROUGHENING FEATURES
- Publication number 20200273813
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS