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Werner Reiss
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Bad Feilnbach, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
Patent number
8,592,258
Issue date
Nov 26, 2013
United Test and Assembly Center, Ltd.
Denver Paul C. Castillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable single package and stacked multi-chip assembly
Patent number
7,265,441
Issue date
Sep 4, 2007
Infineon Technologies AG
Werner Reiss
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
Publication number
20120034738
Publication date
Feb 9, 2012
QIMONDA AG
Denver Paul C. CASTILLO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE
Publication number
20110162204
Publication date
Jul 7, 2011
QIMONDA AG
Werner Reiss
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PLASMA CLEANING OF WIRE STRANDS
Publication number
20110079242
Publication date
Apr 7, 2011
Werner REISS
B08 - CLEANING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
Publication number
20090194871
Publication date
Aug 6, 2009
UTAC - United Test and Assembly Test Center, Ltd.
Denver Paul C. Castillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE
Publication number
20080064232
Publication date
Mar 13, 2008
QIMONDA AG
Werner Reiss
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Integrated chip device in a package
Publication number
20070090527
Publication date
Apr 26, 2007
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable single package and stacked multi-chip assembly
Publication number
20070035006
Publication date
Feb 15, 2007
Werner Reiss
H01 - BASIC ELECTRIC ELEMENTS