Werner Robl

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low Cu percentages for reducing shorts in AlCu lines
- Patent number 6,960,306
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration scheme for metal gap fill, with fixed abrasive CMP
- Patent number 6,943,114
- Issue date Sep 13, 2005
- Infineon Technologies AG
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure comprising tungsten or tungsten compound layer o...
- Patent number 6,866,943
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Gerald Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three layer aluminum deposition process for high aspect ratio CL co...
- Patent number 6,794,282
- Issue date Sep 21, 2004
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner with poor step coverage to improve contact resistance in W co...
- Patent number 6,734,097
- Issue date May 11, 2004
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of eliminating back-end rerouting in ball grid array packaging
- Patent number 6,720,212
- Issue date Apr 13, 2004
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integration scheme for metal gap fill, with fixed abrasive CMP
- Publication number 20040248399
- Publication date Dec 9, 2004
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three layer aluminum deposition process for high aspect ratio CL co...
- Publication number 20040102001
- Publication date May 27, 2004
- Infineon Technologies North America Corp.
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER O...
- Publication number 20030203216
- Publication date Oct 30, 2003
- Infineon Technologies North America Corp.
- Gerald Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of eliminating back-end rerouting in ball grid array packaging
- Publication number 20030183913
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration scheme for metal gap fill with HDP and fixed abrasive CMP
- Publication number 20030186551
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner with poor step coverage to improve contact resistance in W co...
- Publication number 20030068894
- Publication date Apr 10, 2003
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS

Werner Robl

Person

Patents Grantslast 30 patents

Low Cu percentages for reducing shorts in AlCu lines

Integration scheme for metal gap fill, with fixed abrasive CMP

Bond pad structure comprising tungsten or tungsten compound layer o...

Three layer aluminum deposition process for high aspect ratio CL co...

Liner with poor step coverage to improve contact resistance in W co...

Method of eliminating back-end rerouting in ball grid array packaging

Patents Applicationslast 30 patents

Integration scheme for metal gap fill, with fixed abrasive CMP

Three layer aluminum deposition process for high aspect ratio CL co...

BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER O...

Method of eliminating back-end rerouting in ball grid array packaging

Integration scheme for metal gap fill with HDP and fixed abrasive CMP

Liner with poor step coverage to improve contact resistance in W co...