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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
8,115,323
Issue date
Feb 14, 2012
Samsung Electronics Co., Ltd.
Wha-Su Sin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and method thereof and a solder ball land and...
Patent number
8,039,972
Issue date
Oct 18, 2011
Samsung Electronics Co., Ltd.
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of cutting a wafer
Patent number
7,863,161
Issue date
Jan 4, 2011
Samsung Electronics Co., Ltd.
Dae-Sang Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, semiconductor package module including the s...
Patent number
7,745,932
Issue date
Jun 29, 2010
Samsung Electronics Co., Ltd.
Jun-young Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package using redistribution...
Patent number
7,713,788
Issue date
May 11, 2010
Samsung Electronics Co., Ltd.
Jun-Young Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having pillar-shaped terminal
Patent number
7,696,615
Issue date
Apr 13, 2010
Samsung Electronics Co., Ltd.
Jun-Young Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and method thereof and a solder ball land and...
Patent number
7,576,438
Issue date
Aug 18, 2009
Samsung Electronics Co., Ltd.
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of processing a semiconductor wafer for manufacture of semic...
Patent number
7,452,753
Issue date
Nov 18, 2008
Samsung Electronics Co., Ltd.
Dae-Sang Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming solder ball, and fabricating method and structure...
Patent number
7,427,558
Issue date
Sep 23, 2008
Samsung Electronics Co., Ltd.
Jae-Hong Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package stack and manufacturing method thereof
Patent number
7,420,814
Issue date
Sep 2, 2008
Samsung Electronics Co., Ltd.
Jae-Hong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved chip attachment and manufacturi...
Patent number
7,235,887
Issue date
Jun 26, 2007
Samsung Electronics Co., Ltd.
Jong-Ung Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BE...
Publication number
20120013007
Publication date
Jan 19, 2012
Hyun-ik HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
Publication number
20110124273
Publication date
May 26, 2011
Samsung Electronics Co., Ltd.
Jung-Hyun Roh
B24 - GRINDING POLISHING
Information
Patent Application
WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE...
Publication number
20110024919
Publication date
Feb 3, 2011
Tae-Gyu Kang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Printed circuit board and method thereof and a solder ball land and...
Publication number
20090278249
Publication date
Nov 12, 2009
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
Publication number
20090200362
Publication date
Aug 13, 2009
Ky-Hyun JUNG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION...
Publication number
20090053858
Publication date
Feb 26, 2009
Samsung Electronics Co., Ltd.
Jun-Young KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package, semiconductor package module including the s...
Publication number
20080315408
Publication date
Dec 25, 2008
SAMSUNG ELECTRONICS CO., LTD.
Jun-young Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF CUTTING A WAFER
Publication number
20080311727
Publication date
Dec 18, 2008
Samsung Electronics Co., Ltd.
Dae-Sang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20080265431
Publication date
Oct 30, 2008
Samsung Electronics Co., Ltd.
Wha-Su Sin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molding apparatus, molded semiconductor package using multi-layered...
Publication number
20080251949
Publication date
Oct 16, 2008
SAMSUNG ELECTRONICS CO., LTD.
Wha-Su Sin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cleaning solutions and methods of cleaning boards using the same
Publication number
20080110477
Publication date
May 15, 2008
Samsung Electronics Co., Ltd.
Ky-Hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING...
Publication number
20080111230
Publication date
May 15, 2008
Samsung Electronics Co., Ltd.
Goon-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIXING APPARATUS FOR SEMICONDUCTOR WAFER
Publication number
20080070382
Publication date
Mar 20, 2008
Samsung Electronics Co., Ltd.
Dae-Sang CHAN
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
Publication number
20080061434
Publication date
Mar 13, 2008
Samsung Electronics Co., Ltd.
Ky-Hyun JUNG
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FI...
Publication number
20080042279
Publication date
Feb 21, 2008
Samsung Electronics Co., Ltd.
Hyo-Jae BANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
Publication number
20080012096
Publication date
Jan 17, 2008
Samsung Electronics Co., Ltd.
Wha-Su SIN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20080012116
Publication date
Jan 17, 2008
Samsung Electronics Co., Ltd.
Jun-Young KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating wafer chips
Publication number
20070057410
Publication date
Mar 15, 2007
SAMSUNG ELECTRONICS CO., LTD.
Dae-sang Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer level chip package and method of manufacturing...
Publication number
20070052094
Publication date
Mar 8, 2007
SAMSUNG ELECTRONICS CO., LTD.
Goon-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package stack and manufacturing method thereof
Publication number
20060076665
Publication date
Apr 13, 2006
Jae-Hong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming solder ball, and fabricating method and structure...
Publication number
20060057833
Publication date
Mar 16, 2006
Jae-Hong Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of processing a semiconductor wafer for manufacture of semic...
Publication number
20060008948
Publication date
Jan 12, 2006
Dae-Sang Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus for ejecting relatively thin IC chip from semiconductor w...
Publication number
20060003491
Publication date
Jan 5, 2006
Goon-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package with improved chip attachment and manufacturi...
Publication number
20050040514
Publication date
Feb 24, 2005
Samsung Electronics Co., Ltd.
Jong-Ung Lee
H01 - BASIC ELECTRIC ELEMENTS