Whasu SIN

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 8,998,068
- Issue date Apr 7, 2015
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus to manufacture a semiconductor package having a buffer di...
- Patent number 8,156,636
- Issue date Apr 17, 2012
- Samsung Electronics Co., Ltd.
- Goon Woo Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS
- Publication number 20150179601
- Publication date Jun 25, 2015
- Samsung Electronics Co., Ltd.
- JaeYong PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...
- Publication number 20130008020
- Publication date Jan 10, 2013
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Pack...
- Publication number 20120087099
- Publication date Apr 12, 2012
- Samsung Electronics Co., Ltd.
- Taeho Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20100071854
- Publication date Mar 25, 2010
- Samsung Electronics Co., Ltd.
- Goon Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS