William Boone Mullen III

Person

Boca Raton, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Switch system
- Patent number 6,307,304
- Issue date Oct 23, 2001
- Motorola, Inc.
- Rudy Yorio
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Moisture enhanced ball grid array package
- Patent number 6,242,802
- Issue date Jun 5, 2001
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric switch
- Patent number 6,104,119
- Issue date Aug 15, 2000
- Motorola, Inc.
- Andrzej T. Guzik
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Switching method using a frequency domain piezoelectric switch
- Patent number 6,060,817
- Issue date May 9, 2000
- Motorola, Inc.
- William Boone Mullen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric switch apparatus for a communication device
- Patent number 5,977,690
- Issue date Nov 2, 1999
- Motorola, Inc.
- David L. Ellis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solderless electrical interconnection including metallized hook and...
- Patent number 5,774,341
- Issue date Jun 30, 1998
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quality forecasting engine
- Patent number 5,761,093
- Issue date Jun 2, 1998
- Motorola, Inc.
- Glenn F. Urbish
- G05 - CONTROLLING REGULATING
Information Patent Grant
One-way optical highway communication system
- Patent number 5,734,343
- Issue date Mar 31, 1998
- Motorola, Inc.
- Glenn F. Urbish
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multipoint electrical interconnection having deformable J-hooks
- Patent number 5,694,296
- Issue date Dec 2, 1997
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single alloy solder clad substrate
- Patent number 5,623,127
- Issue date Apr 22, 1997
- Motorola, Inc.
- Edwin L. Bradley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering process
- Patent number 5,540,379
- Issue date Jul 30, 1996
- Motorola, Inc.
- Vahid Kazem-Goudarzi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip carrier having copper pattern plated with gold on one surface...
- Patent number 5,446,625
- Issue date Aug 29, 1995
- Motorola, Inc.
- Glenn F. Urbish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering process
- Patent number 5,435,481
- Issue date Jul 25, 1995
- Motorola, Inc.
- Francisco Da Costa Alves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple alloy solder preform
- Patent number 5,427,865
- Issue date Jun 27, 1995
- Motorola, Inc.
- William B. Mullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a substrate having selectively releasing conductiv...
- Patent number 5,338,391
- Issue date Aug 16, 1994
- Motorola, Inc.
- Anthony B. Suppelsa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Backplane grounding for flip-chip integrated circuit
- Patent number 5,311,059
- Issue date May 10, 1994
- Motorola, Inc.
- Kingshuk Banerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip carrier
- Patent number 5,293,067
- Issue date Mar 8, 1994
- Motorola, Inc.
- Kenneth R. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively releasing conductive runner and substrate assembly
- Patent number 5,280,139
- Issue date Jan 18, 1994
- Motorola, Inc.
- Anthony B. Suppelsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless pad array chip carrier
- Patent number 5,241,133
- Issue date Aug 31, 1993
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection verification
- Patent number 5,184,768
- Issue date Feb 9, 1993
- Motorola, Inc.
- Robert S. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tacking agent
- Patent number 5,177,134
- Issue date Jan 5, 1993
- Motorola, Inc.
- William B. Mullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively releasing conductive runner and substrate assembly havi...
- Patent number 5,166,774
- Issue date Nov 24, 1992
- Motorola, Inc.
- Kingshuk Banerji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making high density solder bumps and a substrate socket f...
- Patent number 5,024,372
- Issue date Jun 18, 1991
- Motorola, Inc.
- Leonard F. Altman
- G02 - OPTICS
Information Patent Grant
Method for effecting solder interconnects
- Patent number 4,889,275
- Issue date Dec 26, 1989
- Motorola, Inc.
- William B. Mullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical socket apparatus with temporary housing
- Patent number 4,878,851
- Issue date Nov 7, 1989
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a one-piece injection molded battery contact assembly
- Patent number 4,877,569
- Issue date Oct 31, 1989
- Motorola, Inc.
- Glenn F. Urbish
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Zero insertion force edge clip interconnect pin
- Patent number 4,752,244
- Issue date Jun 21, 1988
- Motorola, Inc.
- Virgil F. Kuhl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective bonding interconnection mask
- Patent number 4,626,309
- Issue date Dec 2, 1986
- Motorola, Inc.
- William B. Mullen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High density electrical lead
- Patent number 4,598,972
- Issue date Jul 8, 1986
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical subassembly structure
- Patent number 4,586,764
- Issue date May 6, 1986
- Motorola, Inc.
- William B. Mullen
- H01 - BASIC ELECTRIC ELEMENTS

William Boone Mullen III

Person

Patents Grantslast 30 patents

Switch system

Moisture enhanced ball grid array package

Piezoelectric switch

Switching method using a frequency domain piezoelectric switch

Piezoelectric switch apparatus for a communication device

Solderless electrical interconnection including metallized hook and...

Quality forecasting engine

One-way optical highway communication system

Multipoint electrical interconnection having deformable J-hooks

Single alloy solder clad substrate

Soldering process

Chip carrier having copper pattern plated with gold on one surface...

Soldering process

Multiple alloy solder preform

Method of making a substrate having selectively releasing conductiv...

Backplane grounding for flip-chip integrated circuit

Integrated circuit chip carrier

Selectively releasing conductive runner and substrate assembly

Leadless pad array chip carrier

Solder interconnection verification

Tacking agent

Selectively releasing conductive runner and substrate assembly havi...

Method of making high density solder bumps and a substrate socket f...

Method for effecting solder interconnects

Electrical socket apparatus with temporary housing

Method of making a one-piece injection molded battery contact assembly

Zero insertion force edge clip interconnect pin

Selective bonding interconnection mask

High density electrical lead

Electrical subassembly structure