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William C. Robinette Jr.
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Los Altos, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bare die carrier
Patent number
6,049,215
Issue date
Apr 11, 2000
Kulicke & Soffa Ind. Inc.
Fariborz Agahdel
G01 - MEASURING TESTING
Information
Patent Grant
Packaging and interconnect system for integrated circuits
Patent number
5,998,859
Issue date
Dec 7, 1999
Micromodule Systems, Inc.
Bradley L. Griswold
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging and interconnect system for integrated circuits
Patent number
5,796,164
Issue date
Aug 18, 1998
Micromodule Systems, Inc.
Mark T. McGraw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density, high speed, semiconductor interconnect using-multilay...
Patent number
5,508,558
Issue date
Apr 16, 1996
Digital Equipment Corporation
William C. Robinette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of testing semiconductor chips with reusable test package
Patent number
5,456,404
Issue date
Oct 10, 1995
Digital Equipment Corporation
William C. Robinette
G01 - MEASURING TESTING
Information
Patent Grant
Packaging and interconnect system for integrated circuits
Patent number
5,422,514
Issue date
Jun 6, 1995
Micromodule Systems, Inc.
Bradley L. Griswold
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bare die carrier
Patent number
5,402,077
Issue date
Mar 28, 1995
Micromodule Systems, Inc.
Fariborz Agahdel
G01 - MEASURING TESTING