William D. Tandy

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having reduced bow and method for making...
- Patent number 7,344,921
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having dummy segments with trapped corner air
- Patent number 7,265,453
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for marking a bare semiconductor die including applying a t...
- Patent number 7,238,543
- Issue date Jul 3, 2007
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for marking a packaged semiconductor die including applying...
- Patent number 7,094,618
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having reduced bow and method for making...
- Patent number 7,095,097
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for fabricating semiconductor components using mold cavities...
- Patent number 6,969,918
- Issue date Nov 29, 2005
- Micron Technology, Inc.
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an integrated circuit package having reduced bow
- Patent number 6,887,740
- Issue date May 3, 2005
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for marking a bare semiconductor die
- Patent number 6,734,032
- Issue date May 11, 2004
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for marking a bare semiconductor die
- Patent number 6,692,978
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having reduced bow and method for making...
- Patent number 6,577,018
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for marking a bare semiconductor die
- Patent number 6,524,881
- Issue date Feb 25, 2003
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit device having reduced bow and method for making...
- Publication number 20060141673
- Publication date Jun 29, 2006
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for marking a bare semiconductor die
- Publication number 20060079011
- Publication date Apr 13, 2006
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having dummy segments with trapped corner air
- Publication number 20050040506
- Publication date Feb 24, 2005
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor components using mold cavities...
- Publication number 20050035435
- Publication date Feb 17, 2005
- Steven L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having reduced bow and method for making...
- Publication number 20050023653
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for marking a bare semiconductor die
- Publication number 20040161876
- Publication date Aug 19, 2004
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having reduced bow and method for making...
- Publication number 20030201547
- Publication date Oct 30, 2003
- Micron Technology, Inc.
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for marking a bare semiconductor die
- Publication number 20030003688
- Publication date Jan 2, 2003
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for marking a bare semiconductor die
- Publication number 20020098608
- Publication date Jul 25, 2002
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for marking a bare semiconductor die
- Publication number 20020096491
- Publication date Jul 25, 2002
- William D. Tandy
- H01 - BASIC ELECTRIC ELEMENTS

William D. Tandy

Person

Patents Grantslast 30 patents

Integrated circuit device having reduced bow and method for making...

Semiconductor component having dummy segments with trapped corner air

Methods for marking a bare semiconductor die including applying a t...

Methods for marking a packaged semiconductor die including applying...

Integrated circuit device having reduced bow and method for making...

System for fabricating semiconductor components using mold cavities...

Method for making an integrated circuit package having reduced bow

Method and apparatus for marking a bare semiconductor die

Methods for marking a bare semiconductor die

Integrated circuit device having reduced bow and method for making...

Method and apparatus for marking a bare semiconductor die

Patents Applicationslast 30 patents

Integrated circuit device having reduced bow and method for making...

Methods for marking a bare semiconductor die

Semiconductor component having dummy segments with trapped corner air

Method for fabricating semiconductor components using mold cavities...

Integrated circuit device having reduced bow and method for making...

Methods for marking a bare semiconductor die

Integrated circuit device having reduced bow and method for making...

Method and apparatus for marking a bare semiconductor die

Method and apparatus for marking a bare semiconductor die

Method and apparatus for marking a bare semiconductor die