William E. Sablinski

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to improve wettability by reducing liquid polymer macromolec...
- Patent number 7,932,342
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Steven E Molis
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Forming robust solder interconnect structures by reducing effects o...
- Patent number 7,767,575
- Issue date Aug 3, 2010
- Tessera Intellectual Properties, Inc.
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 7,473,997
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 6,995,084
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder hierarchy for lead free solder joint
- Patent number 6,892,925
- Issue date May 17, 2005
- International Business Machines Corporation
- Mario Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for lead free solder electronic package interc...
- Patent number 6,854,636
- Issue date Feb 15, 2005
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic package structure and process for planar passive opt...
- Patent number 6,827,505
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection process for module assembly and rework
- Patent number 6,574,859
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Shaji Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,518,674
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Mario J. Interrante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density column grid array connections and method thereof
- Patent number 6,429,388
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,303,400
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection structure and process module assembly and rework
- Patent number 6,235,996
- Issue date May 22, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 6,070,782
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates and process
- Patent number 5,881,945
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates
- Patent number 5,881,944
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 5,868,304
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Peter Jeffrey Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hot vacuum device removal process and apparatus
- Patent number 5,605,277
- Issue date Feb 25, 1997
- International Business Machines Corporation
- Raymond A. Jackson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for repairing electrical lines
- Patent number 5,543,584
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Edward F. Handford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for repairing electrical lines
- Patent number 5,153,408
- Issue date Oct 6, 1992
- International Business Machines Corporation
- Edward F. Handford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO IMPROVE WETTABILITY BY REDUCING LIQUID POLYMER MACROMOLEC...
- Publication number 20090182161
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Steven E. MOLIS
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...
- Publication number 20090163019
- Publication date Jun 25, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20060009022
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20050208748
- Publication date Sep 22, 2005
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for lead free solder electronic package interc...
- Publication number 20050106059
- Publication date May 19, 2005
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic package structure and process for planar passive opt...
- Publication number 20040114884
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- G02 - OPTICS
Information Patent Application
Structure and method for lead free solder electronic package interc...
- Publication number 20040108367
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder hierarchy for lead free solder joint
- Publication number 20040050904
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Mario Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary attach article and method for temporary attach of devices...
- Publication number 20010008778
- Publication date Jul 19, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection process for module assembly and rework
- Publication number 20010005314
- Publication date Jun 28, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS

William E. Sablinski

Person

Patents Grantslast 30 patents

Method to improve wettability by reducing liquid polymer macromolec...

Forming robust solder interconnect structures by reducing effects o...

Method for forming robust solder interconnect structures by reducin...

Method for forming robust solder interconnect structures by reducin...

Solder hierarchy for lead free solder joint

Structure and method for lead free solder electronic package interc...

Optoelectronic package structure and process for planar passive opt...

EMI shielding for semiconductor chip carriers

Interconnection process for module assembly and rework

Temporary attach article and method for temporary attach of devices...

High density column grid array connections and method thereof

Temporary attach article and method for temporary attach of devices...

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Solder disc connection

Interconnection structure and process module assembly and rework

Method for enhancing fatigue life of ball grid arrays

Socketable bump grid array shaped-solder on copper spheres

Solder disc connection

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Socketable bump grid array shaped-solder on copper spheres

Hot vacuum device removal process and apparatus

Structure for repairing electrical lines

Method and structure for repairing electrical lines

Patents Applicationslast 30 patents

METHOD TO IMPROVE WETTABILITY BY REDUCING LIQUID POLYMER MACROMOLEC...

FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

Structure and method for lead free solder electronic package interc...

Optoelectronic package structure and process for planar passive opt...

Structure and method for lead free solder electronic package interc...

Solder hierarchy for lead free solder joint

EMI shielding for semiconductor chip carriers

Temporary attach article and method for temporary attach of devices...

Interconnection process for module assembly and rework