William G. America

Person

Hilton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical oxide removal of plasma damaged SiCOH low k dielectrics
- Patent number 8,106,485
- Issue date Jan 31, 2012
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for treating wafer edge region with toroidal p...
- Patent number 7,404,874
- Issue date Jul 29, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Grant
Chemical oxide removal of plasma damaged SiCOH low k dielectrics
- Patent number 7,368,393
- Issue date May 6, 2008
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated dual damascene RIE process with organic patterning layer
- Patent number 7,129,159
- Issue date Oct 31, 2006
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing silicon dioxide
- Patent number 7,091,164
- Issue date Aug 15, 2006
- Eastman Kodak Company
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for reactive ion etch processing of a dual damascene structure
- Patent number 6,875,688
- Issue date Apr 5, 2005
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing silicon dioxide
- Patent number 6,627,107
- Issue date Sep 30, 2003
- Eastman Kodak Company
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry for chemical mechanical polishing silicon dioxide
- Patent number 6,544,892
- Issue date Apr 8, 2003
- Eastman Kodak Company
- Ramanathan Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing silicon dioxide
- Patent number 6,491,843
- Issue date Dec 10, 2002
- Eastman Kodak Company
- Ramanathan Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved spectral response uniformity
- Patent number 6,489,642
- Issue date Dec 3, 2002
- Eastman Kodak Company
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing silicon dioxide
- Patent number 6,468,910
- Issue date Oct 22, 2002
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Charge coupled image sensor with u-shaped gates
- Patent number 6,403,993
- Issue date Jun 11, 2002
- Eastman Kodak Company
- David L. Losee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for charge coupled image sensor with U-shaped gates
- Patent number 6,300,160
- Issue date Oct 9, 2001
- Eastman Kodak Company
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS
- Publication number 20080224273
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William G. AMERICA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20080210270
- Publication date Sep 4, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20080210269
- Publication date Sep 4, 2008
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS
- Publication number 20070246442
- Publication date Oct 25, 2007
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LITHOGRAPHY AND ETCH FOR DUAL DAMASCENE STRUCTURES
- Publication number 20070166648
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Shom Ponoth
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Integrated dual damascene RIE process with organic patterning layer
- Publication number 20060040501
- Publication date Feb 23, 2006
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET
- Publication number 20050284568
- Publication date Dec 29, 2005
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
METHOD AND APPARATUS FOR TREATING WAFER EDGE REGION WITH TOROIDAL P...
- Publication number 20050284576
- Publication date Dec 29, 2005
- International Business Machines Corporation
- William George America
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE FORMED BY IN-SITU MODIFICATION OF DIELECTRIC L...
- Publication number 20050263901
- Publication date Dec 1, 2005
- International Business Machines Corporation
- William G. America
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OXIDIZED TANTALUM NITRIDE AS AN IMPROVED HARDMASK IN DUAL-DAMASCENE...
- Publication number 20050208742
- Publication date Sep 22, 2005
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma surface modification and passivation of organo-silicate glas...
- Publication number 20050067702
- Publication date Mar 31, 2005
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING ETCH SELECTIVITY EFFECTS IN DUAL DAMASCENE PRO...
- Publication number 20040175934
- Publication date Sep 9, 2004
- International Business Machines Corporation
- William G. America
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for chemical mechanical polishing silicon dioxide
- Publication number 20040051077
- Publication date Mar 18, 2004
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing silicon dioxide
- Publication number 20030006397
- Publication date Jan 9, 2003
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for chemical mechanical polishing silicon dioxide
- Publication number 20020195421
- Publication date Dec 26, 2002
- Ramanathan Srinivasan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

William G. America

Person

Patents Grantslast 30 patents

Chemical oxide removal of plasma damaged SiCOH low k dielectrics

Method and apparatus for treating wafer edge region with toroidal p...

Chemical oxide removal of plasma damaged SiCOH low k dielectrics

Integrated dual damascene RIE process with organic patterning layer

Slurry for chemical mechanical polishing silicon dioxide

Method for reactive ion etch processing of a dual damascene structure

Slurry for chemical mechanical polishing silicon dioxide

Slurry for chemical mechanical polishing silicon dioxide

Slurry for chemical mechanical polishing silicon dioxide

Image sensor having improved spectral response uniformity

Slurry for chemical mechanical polishing silicon dioxide

Charge coupled image sensor with u-shaped gates

Process for charge coupled image sensor with U-shaped gates

Patents Applicationslast 30 patents

CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

CHEMICAL OXIDE REMOVAL OF PLASMA DAMAGED SICOH LOW K DIELECTRICS

INTEGRATED LITHOGRAPHY AND ETCH FOR DUAL DAMASCENE STRUCTURES

Integrated dual damascene RIE process with organic patterning layer

REMOVING UNWANTED FILM FROM WAFER EDGE REGION WITH REACTIVE GAS JET

METHOD AND APPARATUS FOR TREATING WAFER EDGE REGION WITH TOROIDAL P...

SEMICONDUCTOR DEVICE FORMED BY IN-SITU MODIFICATION OF DIELECTRIC L...

OXIDIZED TANTALUM NITRIDE AS AN IMPROVED HARDMASK IN DUAL-DAMASCENE...

Plasma surface modification and passivation of organo-silicate glas...

METHOD FOR IMPROVING ETCH SELECTIVITY EFFECTS IN DUAL DAMASCENE PRO...

Slurry for chemical mechanical polishing silicon dioxide

Slurry for chemical mechanical polishing silicon dioxide

Slurry for chemical mechanical polishing silicon dioxide