Patent Application
20050263901
(1) Technical Field
The present invention relates generally to the manufacture of semiconductor devices and more particularly to the in-situ modification of a dielectric layer to form an etchstop.
(2) Related Art
In the manufacture of semiconductor devices, it is usually necessary to construct openings of different depths into a dielectric layer. Vertical openings, such as vias, extend downward through the dielectric layer to contact a substrate. Horizontal openings, such as troughs, extend partially into a dielectric layer along an essentially horizontal pathway.
As the openings for vias and troughs extend into the di-electric layer to different depths, it is necessary to be able to etch the dielectric layer to different depths. One approach for doing this process is time-based plasma etching, in which, for example, openings for vias are etched for a longer period than are the shallower openings for troughs. A significant drawback to such a method is the amount of variation in trough depth. Variations in the thickness of the dielectric layer itself are compounded by variations in the rate at which the dielectric layer is etched. Such variations lead not only to variations in the resistance of the final conductive line of the semiconductor device, but to variations in the resistances of conductive lines among different semiconductor devices.
Another approach for etching a dielectric layer to different depths is the deposition of the dielectric material in discrete layers. Generally, a dielectric material is deposited to a fraction of the desired thickness of the dielectric layer, then a thin etch-resistant layer is deposited, and, finally, the original dielectric material is again deposited until the dielectric layer reaches its desired thickness. Such methods suffer from two major drawbacks. First, deposition of each of these layers is discrete, requiring stoppage of the deposition between layers. Second, the etch-resistant layer is usually a silicon nitride or silicon carbide, which increases the overall dielectric constant of the dielectric layer.
Thus, there remains a need for a method of creating openings of different depths in a dielectric layer that does not require reliance on time-based etching techniques or formation of the dielectric layer by deposition of discrete layers.
The invention includes a semiconductor device with a continuously-deposited dielectric layer having different etch resistances through its depth and methods of manufacturing such a device. Specifically, differing etch resistances in the dielectric layer are obtained by modifying the composition of the dielectric layer, the deposition conditions, or both, during deposition of the dielectric layer. The disclosed device and methods eliminate the depth and resistance variations inherent in time-based etch techniques and enable the deposition of a dielectric layer with varying etch resistances in a single deposition step.
A first aspect of the invention is directed toward a semiconductor device comprising a substrate; a dielectric layer atop the substrate, the dielectric layer including a first sub-layer, a second sub-layer and a non-discrete transitional sub-layer residing between the first and second sub-layer, wherein the first sublayer has an etch resistance different than the second sub-layer; and an opening extending no deeper than the sub-layer nearest the substrate.
A second aspect of the invention is directed toward a method of modifying a dielectric composition during deposition, the method comprising the steps of continuously depositing a dielectric layer onto a substrate; and modifying at least one of a dielectric layer composition and a deposition condition during the depositing step.
A third aspect of the invention is directed toward a method of forming at least one opening in a dielectric layer, the method comprising the steps of continuously depositing a dielectric layer onto a substrate; modifying at least one of the dielectric layer composition and a deposition condition; and forming an opening in the dielectric layer.
The foregoing and other features of the invention will be apparent from the following more particular description of embodiments of the invention.
The embodiments of this invention will be described in detail, with reference to the following figures, wherein like designations denote like elements, and wherein:
In general, the device and methods of the claimed invention employ terminologies common to the manufacture of semiconductor devices. For example, unless stated more specifically, an “opening”, as used in the following description and claims, may be a channel, via, hole, socket, valley, furrow, trough, duct, trench, or any other similar structure. Similarly, deposition of a dielectric layer and formation of openings in a dielectric layer may be by any means now known or later developed.
Referring to
In one embodiment, second dielectric sub-layer 30 is more etch resistant than first dielectric sub-layer 20, effectively forming an etch stop layer within the dielectric layer. In one embodiment, etch resistance is increased in second dielectric sub-layer 30 by, for example, increasing its carbon content, or fluorine content, or both. An increase in carbon content results, for example, in a general reduction in etch rate. And, since typical etch processes use fluorocarbon gasses, such as, tetrafluoromethane (CF4), trifluoromethane (CHF3), difluoromethane (CH2F2), perfluorobutene (C4F8), etc., the substitution of fluorine atoms for hydrogen atoms in the dielectric layer will similarly result in a reduced etch rate. Thus, an increase in etch resistance and formation of an etch stop layer can be achieved by modifying the composition of the dielectric layer, or the deposition conditions, or both.
In one embodiment, modification of the composition of the dielectric layer includes the addition of organic alkoxysilanes, alkylsiloxanes, and their fluoro-substituted analogs. In one embodiment of the invention, such compounds may include, for example, methylsilane, dimethylsilane, trimethylsilane, trifluoromethylsilane, 1,2-disilanotetrafluorethylene, 1,3-bis(silanodifluoromethylene)disiloxane, 2,2-disilanohexafluorosilane, bis(trifluoromethyldisiloxanyl)difluormethane, octamethylcyclotetrasiloxane, and tetramethylcyclotetrasiloxane. It should be recognized that the above list is not exhaustive.
Modification of the deposition conditions includes changes to, for example, temperature, pressure, flow rate of dielectric layer components, and plasma power. In one embodiment, useful ranges of such conditions include, for example, a temperature range of −20° C. to 400° C.; a pressure range of 1 to 3 Torr; flow rates of 10 to 50 standard cubic centemeters per minute (sccm) for a carbon source or fluorocarbon source, 300 to 500 sccm for an oxidizer, such as, oxygen (O2), nitrogen dioxide (NO2), etc., and 1500 to 2500 sccm for an inert gas, such as, helium (He), argon (Ar), etc.; and a plasma power range of 20 to 500 Watts. The above ranges are provide for purposes of illustration only and are not meant to be limiting.
Referring to
The interface between second dielectric sub-layer 30 and third dielectric sub-layer 28 is distinguished by a second non-discrete transitional sub-layer 26. The composition of second non-discrete transitional sub-layer 26 varies through its thickness from a composition substantially the same as second dielectric sub-layer 30 where it contacts second dielectric sub-layer 30 to a composition substantially the same as third dielectric sub-layer 28 where it contacts third dielectric sub-layer 28, the change in composition being gradual within second non-discrete transitional sub-layer 26.
Together, first dielectric sub-layer 20, first non-discrete transitional sub-layer 24, second dielectric sub-layer 30, second non-discrete transitional sub-layer 26, and third dielectric sub-layer 28 comprise dielectric layer 40.
Referring to
Referring to
Together etch-resistant dielectric sub-layer 130, non-discrete transitional sub-layer 126, and etchable dielectric sub-layer 120 form dielectric layer 140.
In one embodiment, etchable dielectric sub-layer 120 is more susceptible to etching than etch-resistant dielectric sub-layer 130, the latter of which effectively forms an etch stop layer within dielectric layer 140. In one embodiment, etch resistance is decreased in etchable dielectric sub-layer 120 by, for example, decreasing its carbon content, or fluorine content, or both. A decrease in carbon content, for example, results in a general increase in etch rate. And, since typical etch processes use fluorocarbon gasses (e.g., CF4, CHF3, CH2F2, C4F8, etc.), the substitution of hydrogen atoms for fluorine atoms in the dielectric layer will similarly result in an increased etch rate. Thus, a decrease in etch resistance and formation of an etch stop layer beneath an etchable dielectric sub-layer can be achieved by modifying the composition of the dielectric layer, or the deposition conditions, or both.
In this embodiment, since etch-resistant sub-layer 130 is deposited first, modification of the composition of the dielectric layer may include the removal of organic alkoxysilanes, alkylsiloxanes, and their fluoro-substituted analogs. In one embodiment, such compounds may include, for example, methylsilane, dimethylsilane, trimethylsilane, trifluoromethylsilane, 1,2-disilanotetrafluorethylene, 1,3-bis(silanodifluoromethylene)disiloxane, 2,2-disilanohexafluorosilane, bis(trifluoromethyldisiloxanyl)difluormethane, octamethylcyclotetrasiloxane, and tetramethylcyclotetrasiloxane. Modification of the deposition conditions may be as stated above relative to the first embodiment.
Referring to
The invention includes, as described above in connection with the first and second embodiments, a method of forming at least one opening in the dielectric layer. The method comprises the steps of continuously depositing a dielectric layer onto a substrate, modifying at least one of a dielectric layer composition and a deposition condition, and forming an opening in the dielectric layer. The properties of the modified and unmodified dielectric sublayers that result enable the formation of various openings in the dielectric layer.
In either the first or second embodiment above, using an etch recipe selective to neither sub-layer enables the formation of an opening in the dielectric layer that may extend to the substrate. It is also possible, through the use of particular etch recipes, to form an opening in the dielectric layer that extends to a depth not greater than a depth at which the at least one of the dielectric layer composition and the deposition condition were not modified. In the first embodiment of the invention, this may be accomplished, for example, by using an etch recipe selective to the modified sub-layer but capable of etching the unmodified sub-layer. In the second embodiment of the invention, this may be accomplished, for example, by using an etch recipe selective to the unmodified sub-layer but capable of etching the modified sub-layer.
While this invention has been described in conjunction with the specific embodiments outlined above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the embodiments of the invention as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the invention as defined in the following claims.
