William G. Petefish

Person

Eau Claire, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect module with reduced power distribution impedance
- Patent number 6,847,527
- Issue date Jan 25, 2005
- 3M Innovative Properties Company
- Mark F. Sylvester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,184,589
- Issue date Feb 6, 2001
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing warp and die stress in the production of an e...
- Patent number 6,027,590
- Issue date Feb 22, 2000
- W. L. Gore & Associates, Inc.
- Mark F. Sylvester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having an...
- Patent number 6,015,722
- Issue date Jan 18, 2000
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,011,697
- Issue date Jan 4, 2000
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having at...
- Patent number 5,970,319
- Issue date Oct 19, 1999
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having at...
- Patent number 5,919,329
- Issue date Jul 6, 1999
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning and laminating substrates to stiffeners in elec...
- Patent number 5,882,459
- Issue date Mar 16, 1999
- W. L. Gore & Associates, Inc.
- William George Petefish
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for improving wireability in chip modules
- Patent number 5,879,787
- Issue date Mar 9, 1999
- W. L. Gore & Associates, Inc.
- William George Petefish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 5,879,786
- Issue date Mar 9, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing warp and die stress in the production of an e...
- Patent number 5,868,887
- Issue date Feb 9, 1999
- W. L. Gore & Associates, Inc.
- Mark F. Sylvester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coining solder balls on an electrical circuit package
- Patent number 5,853,517
- Issue date Dec 29, 1998
- W. L. Gore & Associates, Inc.
- William George Petefish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 5,701,032
- Issue date Dec 23, 1997
- W. L. Gore & Associates, Inc.
- Paul James Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 5,525,834
- Issue date Jun 11, 1996
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect system for an area array interconnection us...
- Patent number 5,276,955
- Issue date Jan 11, 1994
- SuperComputer Systems Limited Partnership
- David B. Noddin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect module with reduced power distribution impedance
- Publication number 20040170006
- Publication date Sep 2, 2004
- Mark F. Sylvester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect module with reduced power distribution impedance
- Publication number 20040012938
- Publication date Jan 22, 2004
- Mark F. Sylvester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA SOLDER BALL SHEAR STRENGTH
- Publication number 20020045036
- Publication date Apr 18, 2002
- ROBIN GORRELL
- H01 - BASIC ELECTRIC ELEMENTS

William G. Petefish

Person

Patents Grantslast 30 patents

Interconnect module with reduced power distribution impedance

Constraining ring for use in electronic packaging

Method for minimizing warp and die stress in the production of an e...

Method for assembling an integrated circuit chip package having an...

Constraining ring for use in electronic packaging

Method for assembling an integrated circuit chip package having at...

Method for assembling an integrated circuit chip package having at...

Method for aligning and laminating substrates to stiffeners in elec...

Method and apparatus for improving wireability in chip modules

Constraining ring for use in electronic packaging

Method for minimizing warp and die stress in the production of an e...

Method for coining solder balls on an electrical circuit package

Integrated circuit package

Integrated circuit package

Multilayer interconnect system for an area array interconnection us...

Patents Applicationslast 30 patents

Interconnect module with reduced power distribution impedance

Interconnect module with reduced power distribution impedance

BGA SOLDER BALL SHEAR STRENGTH