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3374536 | Schroeder et al. | Mar 1968 | |
3469148 | Lund | Sep 1969 | |
3585272 | Shetz | Jun 1971 | |
3953566 | Gore | Apr 1976 | |
4482516 | Bowman et al. | Nov 1984 | |
4704626 | Mahaulikar et al. | Nov 1987 | |
4705762 | Ota et al. | Nov 1987 | |
4897508 | Mahulikar et al. | Jan 1990 | |
4985296 | Mortimer, Jr. | Jan 1991 | |
5386339 | Polinski, Sr. | Jan 1995 | |
5528457 | Hawke et al. | Jun 1996 | |
5545473 | Ameen et al. | Aug 1996 |
Number | Date | Country |
---|---|---|
0 257 466 | Mar 1988 | EPX |
0 460 822 | Dec 1991 | EPX |
2 276 977 | Oct 1994 | GBX |
Entry |
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"Semiconductor Device Package Having A Substrate with a Coefficient of Expansion Matching Silicon", IBM Technical Disclosure, vol. 20, No. 7, Dec., 1977, pp. 2849-2850. |
"Semiconductor Encapsulation," IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar., 1978, pp. 3903-3905. |