William J. Davis

Person

Hollis, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing semiconductors using a combination of electro...
- Patent number 9,219,000
- Issue date Dec 22, 2015
- Raytheon Company
- Paul J. Duval
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and system to analyze interference susceptibility of a radio...
- Patent number 9,100,122
- Issue date Aug 4, 2015
- Raytheon Company
- John H. VanPatten
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for creating a selective solder seal interface for an integr...
- Patent number 8,987,892
- Issue date Mar 24, 2015
- Raytheon Company
- William J. Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated transferable interconnect for microelectronic package
- Patent number 8,969,176
- Issue date Mar 3, 2015
- Raytheon Company
- Ward G. Fillmore
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for predicting energy on target
- Patent number 8,957,811
- Issue date Feb 17, 2015
- Raytheon Company
- William H. Davis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for processing semiconductors using a combination of electro...
- Patent number 8,754,421
- Issue date Jun 17, 2014
- Raytheon Company
- Paul J. Duval
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for packaging semiconductors at a wafer level
- Patent number 8,653,673
- Issue date Feb 18, 2014
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounted monolithic microwave integrated circuit (MMIC) st...
- Patent number 8,581,406
- Issue date Nov 12, 2013
- Raytheon Company
- James A. Robbins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging semiconductors at wafer level
- Patent number 8,178,391
- Issue date May 15, 2012
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Developing and analyzing a communication system
- Patent number 8,086,187
- Issue date Dec 27, 2011
- Raytheon Company
- William H. Davis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging semiconductors at wafer level
- Patent number 8,035,219
- Issue date Oct 11, 2011
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CREATING A SELECTIVE SOLDER SEAL INTERFACE FOR AN INTEGR...
- Publication number 20140332949
- Publication date Nov 13, 2014
- Raytheon Company
- William J. Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTORS USING A COMBINATION OF ELECTRO...
- Publication number 20140206173
- Publication date Jul 24, 2014
- Raytheon Company
- Paul J. Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System to Analyze Interference Susceptibility of a Radio...
- Publication number 20130309987
- Publication date Nov 21, 2013
- Raytheon Company
- John H. VanPatten
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Methods and Systems for Predicting Jamming Effectiveness
- Publication number 20130307715
- Publication date Nov 21, 2013
- RAYTHEON CORPORATION
- William H. Davis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and System for Predicting Energy On Target
- Publication number 20130307726
- Publication date Nov 21, 2013
- Raytheon Company
- William H. Davis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) ST...
- Publication number 20130277843
- Publication date Oct 24, 2013
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Processing Semiconductors Using A Combination Of Electro...
- Publication number 20130221365
- Publication date Aug 29, 2013
- Raytheon Company
- Paul J. Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20130154124
- Publication date Jun 20, 2013
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED TRANSFERABLE INTERCONNECT FOR MICROELECTRONIC PACKAGE
- Publication number 20120139100
- Publication date Jun 7, 2012
- Raytheon Company
- Ward G. Fillmore
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT WAFER LEVEL
- Publication number 20120009735
- Publication date Jan 12, 2012
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20100013088
- Publication date Jan 21, 2010
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS

William J. Davis

Person

Patents Grantslast 30 patents

Method for processing semiconductors using a combination of electro...

Method and system to analyze interference susceptibility of a radio...

Method for creating a selective solder seal interface for an integr...

Laminated transferable interconnect for microelectronic package

Method and system for predicting energy on target

Method for processing semiconductors using a combination of electro...

Method for packaging semiconductors at a wafer level

Flip chip mounted monolithic microwave integrated circuit (MMIC) st...

Method for packaging semiconductors at wafer level

Developing and analyzing a communication system

Packaging semiconductors at wafer level

Patents Applicationslast 30 patents

METHOD FOR CREATING A SELECTIVE SOLDER SEAL INTERFACE FOR AN INTEGR...

METHOD FOR PROCESSING SEMICONDUCTORS USING A COMBINATION OF ELECTRO...

Method and System to Analyze Interference Susceptibility of a Radio...

Methods and Systems for Predicting Jamming Effectiveness

Method and System for Predicting Energy On Target

FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) ST...

Method For Processing Semiconductors Using A Combination Of Electro...

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

LAMINATED TRANSFERABLE INTERCONNECT FOR MICROELECTRONIC PACKAGE

METHOD FOR PACKAGING SEMICONDUCTORS AT WAFER LEVEL

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL