William J. Lambert

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase switching regulators with hybrid inductors and per phas...
- Patent number 12,068,684
- Issue date Aug 20, 2024
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front-end structures
- Patent number 11,937,367
- Issue date Mar 19, 2024
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,870,163
- Issue date Jan 9, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,870,132
- Issue date Jan 9, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,804,426
- Issue date Oct 31, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond and leadframe magnetic inductors
- Patent number 11,804,456
- Issue date Oct 31, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front-end structures
- Patent number 11,729,902
- Issue date Aug 15, 2023
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermals for packages with inductors
- Patent number 11,699,630
- Issue date Jul 11, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-in-via structure for high density package integrated inductor
- Patent number 11,676,950
- Issue date Jun 13, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,664,596
- Issue date May 30, 2023
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave antenna architecture with thermal management
- Patent number 11,616,283
- Issue date Mar 28, 2023
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helical plated through-hole package inductor
- Patent number 11,608,564
- Issue date Mar 21, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband multi-pin edge connector for radio frequency front end module
- Patent number 11,611,164
- Issue date Mar 21, 2023
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 11,522,291
- Issue date Dec 6, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,380,979
- Issue date Jul 5, 2022
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level distributed clamps
- Patent number 11,380,652
- Issue date Jul 5, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,355,849
- Issue date Jun 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package inductor having thermal solution structures
- Patent number 11,335,620
- Issue date May 17, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermals for packages with inductors
- Patent number 11,335,618
- Issue date May 17, 2022
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system to protect circuitry during a burn-in pro...
- Patent number 11,215,662
- Issue date Jan 4, 2022
- Intel Corporation
- William Lambert
- G01 - MEASURING TESTING
Information Patent Grant
Reconfigurable inductor
- Patent number 11,211,866
- Issue date Dec 28, 2021
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 11,121,468
- Issue date Sep 14, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave cooling through PCB
- Patent number 11,112,841
- Issue date Sep 7, 2021
- Intel Corporation
- Divya Mani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,107,757
- Issue date Aug 31, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an inductor
- Patent number 10,998,120
- Issue date May 4, 2021
- Intel Corporation
- William J. Lambert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package architecture for antenna arrays
- Patent number 10,868,366
- Issue date Dec 15, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER TRANSFER CLAMP FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT T...
- Publication number 20240203978
- Publication date Jun 20, 2024
- Intel Corporation
- Samuel James BADER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT-END STRUCTURES
- Publication number 20240164010
- Publication date May 16, 2024
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20240072419
- Publication date Feb 29, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20240063544
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT-END STRUCTURES
- Publication number 20230354508
- Publication date Nov 2, 2023
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...
- Publication number 20230163098
- Publication date May 25, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...
- Publication number 20230097714
- Publication date Mar 30, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
- Publication number 20230095063
- Publication date Mar 30, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230088170
- Publication date Mar 23, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230060727
- Publication date Mar 2, 2023
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230068300
- Publication date Mar 2, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20220278439
- Publication date Sep 1, 2022
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
5G mmWAVE COOLING THROUGH PCB
- Publication number 20220256715
- Publication date Aug 11, 2022
- Intel Corporation
- Divya MANI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMALS FOR PACKAGES WITH INDUCTORS
- Publication number 20220238410
- Publication date Jul 28, 2022
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20220216611
- Publication date Jul 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...
- Publication number 20220094263
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS
- Publication number 20220093314
- Publication date Mar 24, 2022
- Intel Corporation
- Anuj MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-THROUGHPUT ADDITIVELY MANUFACTURED POWER DELIVERY VIAS AND TRACES
- Publication number 20210407903
- Publication date Dec 30, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20210398895
- Publication date Dec 23, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20210351116
- Publication date Nov 11, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20210344116
- Publication date Nov 4, 2021
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
- Publication number 20210304952
- Publication date Sep 30, 2021
- Intel Corporation
- William J. Lambert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

William J. Lambert

Person

Patents Grantslast 30 patents

Package embedded magnetic inductor structures and manufacturing tec...

Power delivery structures

Multi-phase switching regulators with hybrid inductors and per phas...

High performance integrated RF passives using dual lithography process

Radio frequency front-end structures

Antenna package using ball attach array to connect antenna and base...

Antenna modules and communication devices

Integrated circuit structures in package substrates

Wirebond and leadframe magnetic inductors

Radio frequency front-end structures

Thermals for packages with inductors

Via-in-via structure for high density package integrated inductor

Antenna modules and communication devices

5G mmWave antenna architecture with thermal management

Helical plated through-hole package inductor

Wideband multi-pin edge connector for radio frequency front end module

Antenna boards and communication devices

Antenna modules and communication devices

Multi-level distributed clamps

Antenna package using ball attach array to connect antenna and base...

Package inductor having thermal solution structures

Thermals for packages with inductors

High performance integrated RF passives using dual lithography process

Method, device and system to protect circuitry during a burn-in pro...

Reconfigurable inductor

Antenna modules and communication devices

5G mmWave cooling through PCB

Integrated circuit structures in package substrates

Method of making an inductor

Package architecture for antenna arrays

Patents Applicationslast 30 patents

POWER DELIVERY STRUCTURES

LAYER TRANSFER CLAMP FOR GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT T...

RADIO FREQUENCY FRONT-END STRUCTURES

ANTENNA MODULES AND COMMUNICATION DEVICES

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

RADIO FREQUENCY FRONT-END STRUCTURES

POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...

INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

ANTENNA MODULES AND COMMUNICATION DEVICES

5G mmWAVE COOLING THROUGH PCB

THERMALS FOR PACKAGES WITH INDUCTORS

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

MULTI-PHASE SWITCHING REGULATORS WITH HYBRID INDUCTORS AND PER PHAS...

PACKAGE EMBEDDED MAGNETIC POWER TRANSFORMERS FOR SMPS

MAGNETIC CORE INDUCTORS IN INTERPOSER

HIGH-THROUGHPUT ADDITIVELY MANUFACTURED POWER DELIVERY VIAS AND TRACES

POWER DELIVERY STRUCTURES

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

ANTENNA MODULES AND COMMUNICATION DEVICES

HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR