William Jeffrey Schaefer

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Materials and structure for a high reliability BGA connection betwe...
- Patent number 7,287,323
- Issue date Oct 30, 2007
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer having a bottom surface protective coating
- Patent number RE38789
- Issue date Sep 6, 2005
- National Semiconductor Corporation
- Pai-Hsiang Kao
- 257 - Active solid-state devices
Information Patent Grant
Materials and structure for a high reliability bga connection betwe...
- Patent number 6,800,815
- Issue date Oct 5, 2004
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced flip chip packaging arrangement
- Patent number 6,770,513
- Issue date Aug 3, 2004
- National Semiconductor Corporation
- Seshadri Vikram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale and land grid array semiconductor packages
- Patent number 6,551,859
- Issue date Apr 22, 2003
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having a bottom surface protective coating
- Patent number 6,175,162
- Issue date Jan 16, 2001
- National Semiconductor Corporation
- Pai-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip integrated circuit package and method for making the same
- Patent number 6,084,308
- Issue date Jul 4, 2000
- National Semiconductor Corporation
- Nikhil V. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount die: wafer level chip-scale package and process for m...
- Patent number 6,075,290
- Issue date Jun 13, 2000
- National Semiconductor Corporation
- William Jeffrey Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having a bottom surface protective coating
- Patent number 6,023,094
- Issue date Feb 8, 2000
- National Semiconductor Corporation
- Pai-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS

William Jeffrey Schaefer

Person

Patents Grantslast 30 patents

Materials and structure for a high reliability BGA connection betwe...

Semiconductor wafer having a bottom surface protective coating

Materials and structure for a high reliability bga connection betwe...

Thermally enhanced flip chip packaging arrangement

Chip scale and land grid array semiconductor packages

Semiconductor wafer having a bottom surface protective coating

Chip-on-chip integrated circuit package and method for making the same

Surface mount die: wafer level chip-scale package and process for m...

Semiconductor wafer having a bottom surface protective coating