William T. Chen

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate having single patterned metal layer, and package applied...
- Patent number 8,399,776
- Issue date Mar 19, 2013
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
- Patent number 7,227,268
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Chi Shih Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming a metallic feature on a substrate
- Patent number 7,026,012
- Issue date Apr 11, 2006
- Agency for Science, Technology and Research
- William T. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming selective electroless plating on polymer surfaces
- Patent number 6,863,936
- Issue date Mar 8, 2005
- Agency for Science, Technology and Research
- William T. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
- Patent number 6,829,149
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Chi Shih Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under-ball-metallurgy layer
- Patent number 6,819,002
- Issue date Nov 16, 2004
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized chip scale ball grid array semiconductor package
- Patent number 6,429,530
- Issue date Aug 6, 2002
- International Business Machines Corporation
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective cover plate for flip chip assembly backside
- Patent number 6,403,882
- Issue date Jun 11, 2002
- International Business Machines Corporation
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rolling ball connector
- Patent number 6,358,627
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Grant
Proper choice of the encapsulant volumetric CTE for different PGBA...
- Patent number 6,353,182
- Issue date Mar 5, 2002
- International Business Machines Corporation
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relocating the neutral plane in a PBGA substrate to eliminate chip...
- Patent number 6,255,599
- Issue date Jul 3, 2001
- IBM
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rolling ball connector
- Patent number 6,177,729
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Grant
Testing laminates with x-ray moire interferometry
- Patent number 6,013,355
- Issue date Jan 11, 2000
- International Business Machines Corp.
- William Tze-You Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Construction of PBGA substrate for flip chip packing
- Patent number 5,959,348
- Issue date Sep 28, 1999
- International Business Machines Corporation
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting copper dielectric interface from delamination
- Patent number 5,773,132
- Issue date Jun 30, 1998
- International Business Machines Corporation
- Lawrence Robert Blumberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solderless electrical connection with a wirebon...
- Patent number 5,709,336
- Issue date Jan 20, 1998
- International Business Machines Corporation
- Anthony Paul Ingraham
- G01 - MEASURING TESTING
Information Patent Grant
Multilayered circuit board
- Patent number 5,442,144
- Issue date Aug 15, 1995
- International Business Machines Corporation
- William T. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayered circuit board
- Patent number 5,359,767
- Issue date Nov 1, 1994
- International Business Machines Corporation
- William T. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible supporting cable for an electronic device and method of ma...
- Patent number 4,906,803
- Issue date Mar 6, 1990
- International Business Machines Corporation
- Stanley M. Albrechta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED...
- Publication number 20100288541
- Publication date Nov 18, 2010
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED OPTICAL PACKAGE
- Publication number 20070166866
- Publication date Jul 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for forming a metallic feature on a substrate
- Publication number 20060134338
- Publication date Jun 22, 2006
- Agency for Science, Technology and Research
- William T. Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bump and fabricating process thereof
- Publication number 20050200014
- Publication date Sep 15, 2005
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Overmolded optical package
- Publication number 20050073036
- Publication date Apr 7, 2005
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Placement of sacrificial solder balls underneath the PBGA substrate
- Publication number 20050063165
- Publication date Mar 24, 2005
- Chi Shih Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for forming a metallic feature on a substrate
- Publication number 20020119251
- Publication date Aug 29, 2002
- William T. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming selective electroless plating on polymer surfaces
- Publication number 20020076497
- Publication date Jun 20, 2002
- INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING
- William T. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rolling ball connector
- Publication number 20010002330
- Publication date May 31, 2001
- Joseph A. Benenati
- G01 - MEASURING TESTING

William T. Chen

Person

Patents Grantslast 30 patents

Substrate having single patterned metal layer, and package applied...

Placement of sacrificial solder balls underneath the PBGA substrate

Method and apparatus for forming a metallic feature on a substrate

Method of forming selective electroless plating on polymer surfaces

Placement of sacrificial solder balls underneath the PBGA substrate

Under-ball-metallurgy layer

Miniaturized chip scale ball grid array semiconductor package

Protective cover plate for flip chip assembly backside

Rolling ball connector

Proper choice of the encapsulant volumetric CTE for different PGBA...

Relocating the neutral plane in a PBGA substrate to eliminate chip...

Rolling ball connector

Testing laminates with x-ray moire interferometry

Construction of PBGA substrate for flip chip packing

Protecting copper dielectric interface from delamination

Method of forming a solderless electrical connection with a wirebon...

Multilayered circuit board

Method of making multilayered circuit board

Flexible supporting cable for an electronic device and method of ma...

Patents Applicationslast 30 patents

SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED...

OVERMOLDED OPTICAL PACKAGE

Method and apparatus for forming a metallic feature on a substrate

Bump and fabricating process thereof

Overmolded optical package

Placement of sacrificial solder balls underneath the PBGA substrate

Method and apparatus for forming a metallic feature on a substrate

Method of forming selective electroless plating on polymer surfaces

Rolling ball connector