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William Y. Hata
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Saratoga, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Heat spreading in molded semiconductor packages
Patent number
9,870,978
Issue date
Jan 16, 2018
Altera Corporation
William H Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond and probe pad distribution
Patent number
9,267,985
Issue date
Feb 23, 2016
Altera Corporation
William Y. Hata
G01 - MEASURING TESTING
Information
Patent Grant
Heat pipe in overmolded flip chip package
Patent number
9,202,772
Issue date
Dec 1, 2015
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package architecture
Patent number
8,772,085
Issue date
Jul 8, 2014
Altera Corporation
William Y. Hata
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package architecture
Patent number
8,148,813
Issue date
Apr 3, 2012
Altera Corporation
William Y. Hata
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Reticle for wafer test structure areas
Patent number
8,003,984
Issue date
Aug 23, 2011
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reticle for layout modification of wafer test structure areas
Patent number
7,316,935
Issue date
Jan 8, 2008
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for monitoring yield of integrated circuits
Patent number
7,212,032
Issue date
May 1, 2007
Altera Corporation
Jayabrata Ghosh Dastidar
G01 - MEASURING TESTING
Information
Patent Grant
Methods and apparatus for laser marking of integrated circuit faults
Patent number
7,020,582
Issue date
Mar 28, 2006
Altera Corporation
John M. Dicosola
G01 - MEASURING TESTING
Information
Patent Grant
Method and apparatus for operating a burn-in board to achieve lower...
Patent number
6,982,566
Issue date
Jan 3, 2006
Altera Corporation
Mohammed Alam
G01 - MEASURING TESTING
Information
Patent Grant
Techniques for reticle layout to modify wafer test structure area
Patent number
6,967,111
Issue date
Nov 22, 2005
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill for maximum flip chip package reliability
Patent number
6,956,165
Issue date
Oct 18, 2005
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT SPREADING IN MOLDED SEMICONDUCTOR PACKAGES
Publication number
20140239483
Publication date
Aug 28, 2014
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT PIPE IN OVERMOLDED FLIP CHIP PACKAGE
Publication number
20140239487
Publication date
Aug 28, 2014
Altera Corporation
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURE
Publication number
20120159779
Publication date
Jun 28, 2012
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND AND PROBE PAD DISTRIBUTION
Publication number
20110025359
Publication date
Feb 3, 2011
William Y. Hata
G01 - MEASURING TESTING
Information
Patent Application
PACKAGE ARCHITECTURE
Publication number
20110024889
Publication date
Feb 3, 2011
William Y. Hata
H01 - BASIC ELECTRIC ELEMENTS