Willy Michel

Follow

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding two substrates
- Patent number 8,349,703
- Issue date Jan 8, 2013
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a compound-material wafer
- Patent number 7,892,861
- Issue date Feb 22, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interface quality by cold cleaning and hot bonding
- Patent number 7,645,682
- Issue date Jan 12, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BONDING TWO SUBSTRATES
- Publication number 20100093152
- Publication date Apr 15, 2010
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING INTERFACE QUALITY BY COLD CLEANING AND HOT BONDING
- Publication number 20080200008
- Publication date Aug 21, 2008
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a compound-material and method for choosing...
- Publication number 20070231931
- Publication date Oct 4, 2007
- Ludovic Ecarnot
- H01 - BASIC ELECTRIC ELEMENTS