Wing Cheng

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a hybrid composite wafer carrier for wet c...
- Patent number 8,292,697
- Issue date Oct 23, 2012
- Lam Research Corporation
- Wing Lau Cheng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate support having fluid channel
- Patent number 8,279,577
- Issue date Oct 2, 2012
- Applied Materials, Inc.
- Andrew Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid composite wafer carrier for wet clean equipment
- Patent number 8,146,902
- Issue date Apr 3, 2012
- Lam Research Corporation
- Wing Lau Cheng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for providing radiation occlusion and aero-therma...
- Patent number 8,056,858
- Issue date Nov 15, 2011
- Raytheon Company
- Frederick Koehler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate support having heat transfer system
- Patent number 7,768,765
- Issue date Aug 3, 2010
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support having heat transfer system
- Patent number 7,221,553
- Issue date May 22, 2007
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for regulating temperature of a process kit in a semicond...
- Patent number 6,795,292
- Issue date Sep 21, 2004
- Dennis Grimard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature electrical connector
- Patent number 6,736,668
- Issue date May 18, 2004
- Arnold V. Kholodenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process chamber having multiple gas distributors and method
- Patent number 6,676,760
- Issue date Jan 13, 2004
- Appiled Materials, Inc.
- Arnold V. Kholodenko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support tolerant to thermal expansion stresses
- Patent number 6,583,980
- Issue date Jun 24, 2003
- Applied Materials Inc.
- You Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor wafer support chuck apparatus...
- Patent number 6,572,814
- Issue date Jun 3, 2003
- Applied Materials Inc.
- Shamouil Shamoulian
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrostatic chuck having heater and method
- Patent number 6,538,872
- Issue date Mar 25, 2003
- Applied Materials, Inc.
- You Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support having bonded sections and method
- Patent number 6,503,368
- Issue date Jan 7, 2003
- Applied Materials Inc.
- Arnold Kholodenko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck bonded to base with a bond layer and method
- Patent number 6,490,146
- Issue date Dec 3, 2002
- Applied Materials Inc.
- You Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck having improved electrical connector and method
- Patent number 6,462,928
- Issue date Oct 8, 2002
- Applied Materials, Inc.
- Shamouil Shamouilian
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrostatic chuck having gas cavity and method
- Patent number 6,310,755
- Issue date Oct 30, 2001
- Applied Materials, Inc.
- Arnold Kholodenko
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing a Hybrid Composite Wafer Carrier for Wet C...
- Publication number 20120168079
- Publication date Jul 5, 2012
- LAM RESEARCH CORPORATION
- Wing Lau Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SUPPORT HAVING FLUID CHANNEL
- Publication number 20110024047
- Publication date Feb 3, 2011
- Applied Materials, Inc.
- Andrew NGUYEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR PROVIDING RADIATION OCCLUSION AND AERO-THERMA...
- Publication number 20100270430
- Publication date Oct 28, 2010
- Frederick Koehler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COMPOSITE WAFER CARRIER FOR WET CLEAN EQUIPMENT
- Publication number 20080152922
- Publication date Jun 26, 2008
- Wing Lau Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Chemical resistant semiconductor processing chamber bodies
- Publication number 20080038448
- Publication date Feb 14, 2008
- Lam Research Corp.
- Arnold Kholodenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT HAVING HEAT TRANSFER SYSTEM
- Publication number 20070165356
- Publication date Jul 19, 2007
- APPLIED MATERIALS, INC.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate support having heat transfer system
- Publication number 20040212947
- Publication date Oct 28, 2004
- APPLIED MATERIALS, INC.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing chamber having magnetic assembly and method
- Publication number 20030192646
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Robert W. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process chamber having multiple gas distributors and method
- Publication number 20030033979
- Publication date Feb 20, 2003
- APPLIED MATERIALS, INC.
- Arnold V. Kholodenko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for regulating temperature of a process kit in a semicond...
- Publication number 20020171994
- Publication date Nov 21, 2002
- APPLIED MATERIALS, INC.
- Dennis Grimard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic chuck bonded to base with a bond layer and method
- Publication number 20020075624
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- You Wang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTROSTATIC CHUCK HAVING COMPOSITE BASE AND METHOD
- Publication number 20020036881
- Publication date Mar 28, 2002
- SHAMOUIL SHAMOUILIAN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CONNECTORS FOR AN ELETROSTATIC CHUCK
- Publication number 20020022403
- Publication date Feb 21, 2002
- WING L. CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a semiconductor wafer support chuck apparatus...
- Publication number 20010024349
- Publication date Sep 27, 2001
- APPLIED MATERIALS, INC.
- Shamouil Shamoulian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Person

Patents Grantslast 30 patents

Method for manufacturing a hybrid composite wafer carrier for wet c...

Substrate support having fluid channel

Hybrid composite wafer carrier for wet clean equipment

Device and method for providing radiation occlusion and aero-therma...

Substrate support having heat transfer system

Substrate support having heat transfer system

Apparatus for regulating temperature of a process kit in a semicond...

High temperature electrical connector

Process chamber having multiple gas distributors and method

Substrate support tolerant to thermal expansion stresses

Method of fabricating a semiconductor wafer support chuck apparatus...

Electrostatic chuck having heater and method

Substrate support having bonded sections and method

Electrostatic chuck bonded to base with a bond layer and method

Electrostatic chuck having improved electrical connector and method

Electrostatic chuck having gas cavity and method

Patents Applicationslast 30 patents

Method for Manufacturing a Hybrid Composite Wafer Carrier for Wet C...

SUBSTRATE SUPPORT HAVING FLUID CHANNEL

DEVICE AND METHOD FOR PROVIDING RADIATION OCCLUSION AND AERO-THERMA...

HYBRID COMPOSITE WAFER CARRIER FOR WET CLEAN EQUIPMENT

Chemical resistant semiconductor processing chamber bodies

SUBSTRATE SUPPORT HAVING HEAT TRANSFER SYSTEM

Substrate support having heat transfer system

Plasma processing chamber having magnetic assembly and method

Process chamber having multiple gas distributors and method

Apparatus for regulating temperature of a process kit in a semicond...

Electrostatic chuck bonded to base with a bond layer and method

ELECTROSTATIC CHUCK HAVING COMPOSITE BASE AND METHOD

CONNECTORS FOR AN ELETROSTATIC CHUCK

Method of fabricating a semiconductor wafer support chuck apparatus...