Membership
Tour
Register
Log in
Wing Keung Lam
Follow
Person
Kowloon, HK
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
8,610,262
Issue date
Dec 17, 2013
UTAC Hong Kong Limited
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package that includes a collapsible spacer for sepa...
Patent number
7,315,080
Issue date
Jan 1, 2008
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package and process for manufacturing same
Patent number
6,987,032
Issue date
Jan 17, 2006
ASAT Ltd.
Chun Ho Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball grid array package with improved thermal characteristics
Patent number
6,737,755
Issue date
May 18, 2004
Asat, Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-up tape ball grid array package
Patent number
6,586,834
Issue date
Jul 1, 2003
ASAT Ltd.
Ming Wang Sze
H01 - BASIC ELECTRIC ELEMENTS