The present invention relates in general to integrated circuit packaging, and in particular to an improved ball grid array (BGA) package with enhanced thermal characteristics and a unique method of manufacturing the ball grid array package.
High performance integrated circuit (IC) packages are well known in the art. Improvements in IC packages are driven by industry demands for increased thermal and electrical performance and decreased size and cost of manufacture.
In general, array packaging such as Plastic Ball Grid Array (PBGA) packages provide a high density of interconnects relative to the surface area of the package. However, typical PBGA packages include a convoluted signal path, giving rise to high impedance and an inefficient thermal path which results in low thermal dissipation performance. With increasing package density, the spreading of heat generated by the package is increasingly important.
Reference is made to
Variations to conventional BGA packages have been proposed for the purpose of increasing thermal and electrical performance. One particular variation includes the addition of a metal heat spreader to the package, as shown in
It is therefore an object of an aspect of the present invention to provide a process for manufacturing a BGA package with a heat spreader that obviates or mitigates at least some of the disadvantages of the prior art.
In one aspect, a process for manufacturing an integrated circuit package is provided. The process includes mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to said semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of said substrate and at least one collapsible spacer is mounted to at least one of a heat spreader, said die adapter and said substrate. One of the heat spreader and said substrate are placed in a mold cavity and the other of said heat spreader and said substrate is clamped to a die of said mold cavity, such that said collapsible spacer is disposed between said heat spreader and said substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, said die adapter, said at least one collapsible spacer and said heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces and the integrated circuit package is singulated.
In another aspect, a process for manufacturing a plurality of integrated circuit packages comprises mounting a plurality of semiconductor dice to a first surface of a substrate array and mounting a plurality of die adapters to said semiconductor dice such that each one of said die adapters is mounted to a corresponding one of said semiconductor dice. The semiconductor dice are wire bonded to ones of conductive traces of said substrate array and a collapsible spacer array is mounted to one of a heat spreader array and said substrate array. One of said heat spreader array and said substrate array is placed in a mold cavity and the other of said heat spreader array and said substrate array is releasably clamped to a first die of said mold such that said collapsible spacer array is disposed between said heat spreader array and said substrate array. A molding compound is molded in the mold, thereby molding the semiconductor dice, said substrate array, said wire bonds, said die adapters, said collapsible spacer array and said heat spreader array into the molding compound to provide an array of molded packages. A plurality of ball grid arrays are formed on a second surface of said substrate array, bumps of said ball grid arrays being electrically connected to said conductive traces and each integrated circuit package is singulated from said array of molded packages.
In another aspect, there is provided an integrated circuit package. The integrated circuit package is a ball grid array package that includes a substrate that has a plurality of conductive traces. A semiconductor die is mounted to a first surface of the substrate and a die adapter is mounted to the semiconductor die. A plurality of wire bonds connect the semiconductor die and ones of the conductive traces. A heat spreader is disposed proximal to and spaced from the die adapter by at least one collapsible spacer. A molding compound encapsulates the semiconductor die, the wire bonds, the die adapter and the collapsible spacer between the substrate and the heat spreader. A ball grid array is disposed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces.
Advantageously, a heat spreader is incorporated into the BGA package during molding. The heat spreader is prepared and placed in the mold and is incorporated into the package by molding. An array of heat spreaders is placed in the mold and molded with a substrate array such that a plurality of packages including heat spreaders are manufactured in a single mold shot.
A thermal path is provided from the semiconductor die, through the die adapter and the collapsible spacer and to the heat spreader. Also, the heat spreader is effectively pressed against the lower mold die surface during molding, thereby inhibiting mold flash on the outer side of the heat spreader. The incorporation of a deformable material (collapsible spacer) that is stable at molding temperature, provides a compliant layer between the substrate and the heat spreader and between the semiconductor die and the heat spreader. Thus, the heat spreader is pressed against the lower mold die, maintaining the heat spreader in contact with the lower mold die during molding and reducing mold flash.
In another aspect, ground bonds are provided between the semiconductor die and the die adapter. Thus, a ground path is provided through the die adapter, the collapsible spacer in contact with the die adapter, the heat spreader and the collapsible spacers in contact with the substrate. Advantageously, better signal layout on the substrate can be achieved and better wire looping control is provided. Also, ground wire length is reduced.
The invention will be better understood with reference to the following description and to the drawings, in which:
Reference is now made to
Referring to
The process for manufacturing the ball grid array package 120, according to one embodiment of the present invention, will now be described in more detail. Referring to
A singulated semiconductor die 124 is conventionally mounted to an upper surface of the substrate 122 using a suitable die attach adhesive (
A die adapter 134 is mounted to the semiconductor die 124 using a thermally conductive adhesive for conducting heat from the semiconductor die 124 to the adapter 134 (
The semiconductor die 124 has a conductive pad array formed thereon and wire bonds 126 are bonded between the conductive pads of the array and the conductive traces on the substrate 122 using conventional wire bonding techniques (
The heat spreader 132 is manufactured in the form of an array frame that is compatible with the substrate array 122 (
A plurality of collapsible spacers 136 are mounted to the substrate 122. In the present embodiment, the collapsible spacers 136 are manufactured in the form of an array that is compatible with the substrate array 122 and the heat spreader 132 (
The heat spreader 132, in the array format, is placed in the bottom of the die cavity, on the lower surface of the mold. Features of the mold cavity and the frame are designed such that the heat spreader 132 aligns with the substrate 122 in the die cavity. The substrate array strip 122 is clamped to a surface of an upper mold die, in the mold cavity such that the semiconductor die 124, the die adapter 134 and the collapsible spacers 136 protrude from the substrate 22 into the mold cavity. The collapsible spacers 136, in the array format, are thus disposed between the heat spreader 132 and the substrate 122 (
Molding using a molding compound 128 in the mold cavity follows. During molding, the collapsible spacers 136 are compressed between the substrate 122 and the heat spreader 132 and between the die adapter 134 and the heat spreader 132, causing deformation of the collapsible spacers 136 (
After removing the package 120 from the mold, the solder balls 130, also referred to as solder bumps, are formed on the lower surface of the substrate 122 by conventional positioning (
Singulation of the individual BGA unit from the array strip is then performed either by saw singulation or die punching, resulting in the configuration shown in
Reference is now made to
During wire bonding of the package shown in
Reference is now made to
Alternative embodiments and variations are possible. For example, rather than placing the heat spreader 132 in the bottom of the mold cavity and clamping the substrate 122 to the top mold die, the substrate 122 can be placed in the bottom of the mold cavity and the heat spreader 132 clamped to the top of the mold die.
In another alternative, the collapsible spacers 136 are individually placed on the substrate 122 and die adapter 134 or on the heat spreader 132, rather than being manufactured in the form of an array (
Other alternative embodiments and variations are also possible. For example, rather than etching a copper strip to prepare the array frame of heat spreaders 132, the frame can be manufactured by metal stamping. Also, the heat spreader is not limited to copper as other suitable heat spreader materials are possible and will occur to those skilled in the art. In the above-described embodiments, the collapsible spacers are mounted to the substrate or the heat spreader using epoxy, however other means for mounting the collapsible spacers are possible. For example, the collapsible spacers can be mounted using solder reflow technique. Also, the collapsible spacers are not limited to solder preform as other suitable materials can be employed, including for example, low modulus conductive polymer such as silicone or a thermoplastic material with low modulus such as polycarbonate. The die adapter 134 is not limited to copper as other suitable materials can be used. For example, the die adapter can be constructed of silicon, ceramics and other metals. In the embodiment shown in
This is a Divisional Application of U.S. patent application Ser. No. 10/643,961, filed Aug. 20, 2003, and issued as U.S. Pat. No. 6,987,032, which is a continuation-in-part of U.S. patent application Ser. No. 10/323,657, entitled Process For Manufacturing Ball Grid Array Package, filed Dec. 20, 2002, and issued as U.S. Pat. No. 6,979,594, which is a continuation-in-part of U.S. patent application Ser. No. 10/197,832 entitled Improved Ball Grid Array Package, filed Jul. 19, 2002, and issued as U.S. Pat. No. 6,800,948.
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Number | Date | Country |
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Parent | 10643961 | Aug 2003 | US |
Child | 10885965 | US |
Number | Date | Country | |
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Parent | 10323657 | Dec 2002 | US |
Child | 10643961 | US | |
Parent | 10197832 | Jul 2002 | US |
Child | 10323657 | US |