Wiren D. Becker

Person

Hyde Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically transitioning between substrate integrated waveguides (S...
- Patent number 11,658,378
- Issue date May 23, 2023
- International Business Machines Corporation
- Joshua C. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB with substrate integrated waveguides using multi-band monopole...
- Patent number 11,399,428
- Issue date Jul 26, 2022
- International Business Machines Corporation
- Pavel Roy Paladhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure having high density chip interconnect...
- Patent number 11,133,259
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slack and strain control mechanism
- Patent number 10,257,599
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Wiren D. Becker
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structural dynamic heat sink
- Patent number 10,247,489
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for fabricating a hybrid land grid array connector
- Patent number 10,135,162
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector having a body with a conductive layer common to top and b...
- Patent number 10,128,593
- Issue date Nov 13, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency-domain high-speed bus signal integrity compliance model
- Patent number 9,733,305
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Frequency-domain high-speed bus signal integrity compliance model
- Patent number 9,686,053
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Frequency-domain high-speed bus signal integrity compliance model
- Patent number 9,673,941
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structurally dynamic heat sink
- Patent number 9,644,907
- Issue date May 9, 2017
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Frequency-domain high-speed bus signal integrity compliance model
- Patent number 9,638,750
- Issue date May 2, 2017
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structurally dynamic heat sink
- Patent number 9,625,220
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
DIMM connector region vias and routing
- Patent number 9,627,787
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DIMM connector region vias and routing
- Patent number 9,548,551
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DIMM connector region vias and routing
- Patent number 9,444,162
- Issue date Sep 13, 2016
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level interconnect apparatus
- Patent number 9,052,880
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for making high-speed ceramic modules with hybrid referencin...
- Patent number 8,683,413
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed ceramic modules with hybrid referencing scheme for impro...
- Patent number 8,339,803
- Issue date Dec 25, 2012
- International Business Machine Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for generating synchronization signals for syn...
- Patent number 8,295,419
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Charlie C. Hwang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Network flow based module bottom surface metal pin assignment
- Patent number 8,261,226
- Issue date Sep 4, 2012
- International Business Machines Corporation
- Wiren Dale Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-healing chip-to-chip interface
- Patent number 8,050,174
- Issue date Nov 1, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-healing chip-to-chip interface
- Patent number 8,018,837
- Issue date Sep 13, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solid vias in a printed circuit board
- Patent number 7,987,587
- Issue date Aug 2, 2011
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,985,927
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,897,879
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for generating synchronization signals for syn...
- Patent number 7,826,579
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Charlie C. Hwang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Self-healing chip-to-chip interface
- Patent number 7,813,266
- Issue date Oct 12, 2010
- International Business Machines Corporation
- Wiren Dale Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit on a printed circuit board
- Patent number 7,742,315
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,465,882
- Issue date Dec 16, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240234284
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240136270
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...
- Publication number 20210183773
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...
- Publication number 20210112655
- Publication date Apr 15, 2021
- International Business Machines Corporation
- PAVEL ROY PALADHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...
- Publication number 20210111472
- Publication date Apr 15, 2021
- International Business Machines Corporation
- JOSHUA C. MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURALLY DYNAMIC HEAT SINK
- Publication number 20170198985
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SLACK AND STRAIN CONTROL MECHANISM
- Publication number 20170146153
- Publication date May 25, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRUCTURALLY DYNAMIC HEAT SINK
- Publication number 20170131047
- Publication date May 11, 2017
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STRUCTURALLY DYNAMIC HEAT SINK
- Publication number 20170131045
- Publication date May 11, 2017
- International Business Machines Corporation
- Bjorn J. Ahbel
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIMM CONNECTOR REGION VIAS AND ROUTING
- Publication number 20170062960
- Publication date Mar 2, 2017
- International Business Machines Corporation
- Wiren D. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
- Publication number 20170053899
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL
- Publication number 20160352473
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL
- Publication number 20160349319
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Wiren D. Becker
- G01 - MEASURING TESTING
Information Patent Application
FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL
- Publication number 20160349325
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Wiren D. Becker
- G01 - MEASURING TESTING
Information Patent Application
FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL
- Publication number 20160350195
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
- Publication number 20160071822
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MESH-PLANE VIAS IN A MULTI-LAYERED PACKAGE
- Publication number 20150170996
- Publication date Jun 18, 2015
- International Business Machines Corporation
- Dulce M. Altabella Lazzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL INTERCONNECT APPARATUS
- Publication number 20130279103
- Publication date Oct 24, 2013
- International Business Machines Corporation
- Wiren D. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...
- Publication number 20130252379
- Publication date Sep 26, 2013
- Wiren D Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed Ceramic Modules with Hybrid Referencing Scheme for Impro...
- Publication number 20110132650
- Publication date Jun 9, 2011
- IBM Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Generating Synchronization Signals for Syn...
- Publication number 20110033017
- Publication date Feb 10, 2011
- International Business Machines Corporation
- Charlie C. Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Self-Healing Chip-to-Chip Interface
- Publication number 20110010482
- Publication date Jan 13, 2011
- International Business Machines Corporation
- Wiren Dale Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Healing Chip-to-Chip Interface
- Publication number 20100085872
- Publication date Apr 8, 2010
- International Business Machines Corporation
- Wiren Dale Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Solid Vias in a Printed Circuit Board
- Publication number 20090223710
- Publication date Sep 10, 2009
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090113703
- Publication date May 7, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090108465
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20080142257
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEALING CHIP-TO-CHIP INTERFACE
- Publication number 20080074998
- Publication date Mar 27, 2008
- WIREN DALE BECKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR...
- Publication number 20070224845
- Publication date Sep 27, 2007
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Wiren D. Becker

Person

Patents Grantslast 30 patents

Vertically transitioning between substrate integrated waveguides (S...

PCB with substrate integrated waveguides using multi-band monopole...

Multi-chip package structure having high density chip interconnect...

Slack and strain control mechanism

Structural dynamic heat sink

Method for fabricating a hybrid land grid array connector

Connector having a body with a conductive layer common to top and b...

Frequency-domain high-speed bus signal integrity compliance model

Frequency-domain high-speed bus signal integrity compliance model

Frequency-domain high-speed bus signal integrity compliance model

Structurally dynamic heat sink

Frequency-domain high-speed bus signal integrity compliance model

Structurally dynamic heat sink

DIMM connector region vias and routing

DIMM connector region vias and routing

DIMM connector region vias and routing

Multi-level interconnect apparatus

Method for making high-speed ceramic modules with hybrid referencin...

High-speed ceramic modules with hybrid referencing scheme for impro...

Method and apparatus for generating synchronization signals for syn...

Network flow based module bottom surface metal pin assignment

Self-healing chip-to-chip interface

Self-healing chip-to-chip interface

Method of forming solid vias in a printed circuit board

Ceramic substrate grid structure for the creation of virtual coax a...

Ceramic substrate grid structure for the creation of virtual coax a...

Method and apparatus for generating synchronization signals for syn...

Self-healing chip-to-chip interface

Circuit on a printed circuit board

Ceramic substrate grid structure for the creation of virtual coax a...

Patents Applicationslast 30 patents

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

MULTI-CHIP PACKAGE STRUCTURE HAVING HIGH DENSITY CHIP INTERCONNECT...

PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...

VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...

STRUCTURALLY DYNAMIC HEAT SINK

SLACK AND STRAIN CONTROL MECHANISM

STRUCTURALLY DYNAMIC HEAT SINK

STRUCTURALLY DYNAMIC HEAT SINK

DIMM CONNECTOR REGION VIAS AND ROUTING

OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...

FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL

FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL

FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL

FREQUENCY-DOMAIN HIGH-SPEED BUS SIGNAL INTEGRITY COMPLIANCE MODEL

OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...

THROUGH-MESH-PLANE VIAS IN A MULTI-LAYERED PACKAGE

MULTI-LEVEL INTERCONNECT APPARATUS

METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...

High-Speed Ceramic Modules with Hybrid Referencing Scheme for Impro...

Method and Apparatus for Generating Synchronization Signals for Syn...

Self-Healing Chip-to-Chip Interface

Self-Healing Chip-to-Chip Interface

Method of Forming Solid Vias in a Printed Circuit Board

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

SELF-HEALING CHIP-TO-CHIP INTERFACE

ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR...