Wolfgang Dietze

Person

Munich, DT

People

Patents Grantslast 30 patents

Information Patent Grant
Disc support structure
- Patent number 4,093,201
- Issue date Jun 6, 1978
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Shaped bodies and production of semiconductor material
- Patent number 4,035,460
- Issue date Jul 12, 1977
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Shaped bodies and production of semiconductor material
- Patent number 4,034,705
- Issue date Jul 12, 1977
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for the manufacture of tubular bodies of semiconductor ma...
- Patent number 4,015,922
- Issue date Apr 5, 1977
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for the manufacture of tubular bodies of semiconductor material
- Patent number 3,979,490
- Issue date Sep 7, 1976
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Heatable hollow semiconductor
- Patent number 3,962,670
- Issue date Jun 8, 1976
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Disc support structure and method of producing the same
- Patent number 3,962,391
- Issue date Jun 8, 1976
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing shaped hollow bodies
- Patent number 3,943,218
- Issue date Mar 9, 1976
- Siemens Aktiengesellschaft
- Wolfgang Dietze
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Wolfgang Dietze

Person

Patents Grantslast 30 patents

Disc support structure

Shaped bodies and production of semiconductor material

Shaped bodies and production of semiconductor material

Apparatus for the manufacture of tubular bodies of semiconductor ma...

Method for the manufacture of tubular bodies of semiconductor material

Heatable hollow semiconductor

Disc support structure and method of producing the same

Method of manufacturing shaped hollow bodies