Wolfgang Scholz

Person

Olching, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with integrated temperature protection
- Patent number 11,276,680
- Issue date Mar 15, 2022
- Infineon Technologies Austria AG
- Daniel Pedone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having die pads with exposed surfaces
- Patent number 10,373,895
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device and method for operat...
- Patent number 10,170,497
- Issue date Jan 1, 2019
- Thoralf Kautzsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic device and method for operat...
- Patent number 9,929,181
- Issue date Mar 27, 2018
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a control circuit
- Patent number 9,843,181
- Issue date Dec 12, 2017
- Infineon Technologies Austria AG
- Anton Mauder
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Insulated gate bipolar transistor comprising negative temperature c...
- Patent number 9,825,023
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, a method for manufacturing an electronic device,...
- Patent number 9,560,765
- Issue date Jan 31, 2017
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arragement with an optimized assembly capability
- Patent number 8,089,768
- Issue date Jan 3, 2012
- Infineon Technologies AG
- Anton Mauder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...
- Publication number 20240266237
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Current Sensing
- Publication number 20240170374
- Publication date May 23, 2024
- Shu Hui Goh
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
- Publication number 20240170377
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package or a Printed Circuit Board, Both Modified to...
- Publication number 20240014104
- Publication date Jan 11, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...
- Publication number 20230360929
- Publication date Nov 9, 2023
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...
- Publication number 20230282591
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
- Publication number 20230106642
- Publication date Apr 6, 2023
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...
- Publication number 20220102311
- Publication date Mar 31, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...
- Publication number 20210249334
- Publication date Aug 12, 2021
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20200013723
- Publication date Jan 9, 2020
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...
- Publication number 20180175069
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING EXPOSED OPPOSING DIE PADS
- Publication number 20180166366
- Publication date Jun 14, 2018
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...
- Publication number 20170092659
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Temperature Protection
- Publication number 20160133620
- Publication date May 12, 2016
- Infineon Technologies Austria AG
- Daniel Pedone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Gate Bipolar Transistor Comprising Negative Temperature C...
- Publication number 20160111415
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, A METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE,...
- Publication number 20150163915
- Publication date Jun 11, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf Kautzsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Including a Control Circuit
- Publication number 20150029627
- Publication date Jan 29, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP ARRANGEMENT AND CHIP PACKAGE
- Publication number 20140210061
- Publication date Jul 31, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component arragement with an optimized assembly capability
- Publication number 20090213552
- Publication date Aug 27, 2009
- INFINEON TECHNOLIGIES AG
- Anton Mauder
- G02 - OPTICS

Wolfgang Scholz

Person

Patents Grantslast 30 patents

Semiconductor device module having vertical metallic contacts and a...

Semiconductor device including an embedded semiconductor die

Silicon carbide device and method for forming a silicon carbide device

Power semiconductor device with integrated temperature protection

Semiconductor device having die pads with exposed surfaces

Method for manufacturing an electronic device and method for operat...

Method for manufacturing an electronic device and method for operat...

Semiconductor device including a control circuit

Insulated gate bipolar transistor comprising negative temperature c...

Electronic device, a method for manufacturing an electronic device,...

Component arragement with an optimized assembly capability

Patents Applicationslast 30 patents

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

Semiconductor Package with Current Sensing

Semiconductor Package Providing an Even Current Distribution and St...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

Semiconductor Package or a Printed Circuit Board, Both Modified to...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...

SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...

EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...

SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...

SEMICONDUCTOR DEVICES INCLUDING EXPOSED OPPOSING DIE PADS

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERAT...

Power Semiconductor Device with Temperature Protection

Insulated Gate Bipolar Transistor Comprising Negative Temperature C...

ELECTRONIC DEVICE, A METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE,...

Semiconductor Device Including a Control Circuit

CHIP ARRANGEMENT AND CHIP PACKAGE

Component arragement with an optimized assembly capability