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Wonic TAE

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  • Seongnam-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Finisher including height adjustment unit
    • Patent number 12,098,044
    • Issue date Sep 24, 2024
    • Hewlett-Packard Development Company, L.P.
    • Taejin Baek
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Finisher with compact medium conveying structure
    • Patent number 11,912,525
    • Issue date Feb 27, 2024
    • Hewlett-Packard Development Company, L.P.
    • Taehong Kim
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

  • Information Patent Application

    FINISHER WITH COMPACT MEDIUM CONVEYING STRUCTURE
    • Publication number 20230219779
    • Publication date Jul 13, 2023
    • Hewlett-Packard Development Company, L.P.
    • Taehong KIM
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    FINISHER INCLUDING HEIGHT ADJUSTMENT UNIT
    • Publication number 20230211972
    • Publication date Jul 6, 2023
    • Hewlett-Packard Development Company, L.P.
    • Taejin BAEK
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL