Woon Kab Jung

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 11,430,723
- Issue date Aug 30, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making semiconductor devices
- Patent number 10,714,408
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 10,347,562
- Issue date Jul 9, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 10,090,230
- Issue date Oct 2, 2018
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 9,721,872
- Issue date Aug 1, 2017
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20250022784
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20220415769
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20210166992
- Publication date Jun 3, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20190371706
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20190043793
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20150084185
- Publication date Mar 26, 2015
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Woon Kab Jung

Person

Patents Grantslast 30 patents

Semiconductor device with a semiconductor die embedded between an e...

Methods and structures for increasing the allowable die size in TMV...

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor devices and methods of making semiconductor devices

Methods and structures for increasing the allowable die size in TMV...

Semiconductor device with a semiconductor die embedded between an e...

Methods and structures for increasing the allowable die size in TMV...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...