Xaver Schloegel

Person

Sachsenkam, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor system
- Patent number 11,539,291
- Issue date Dec 27, 2022
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an SMD package with top side cooling
- Patent number 10,903,133
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing inductor modules and power semiconductor s...
- Patent number 10,833,583
- Issue date Nov 10, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
SMD package with flat contacts to prevent bottleneck
- Patent number 10,699,987
- Issue date Jun 30, 2020
- tInfineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,699,978
- Issue date Jun 30, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor systems having inductor modules, and methods of...
- Patent number 10,601,314
- Issue date Mar 24, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,566,260
- Issue date Feb 18, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier structure, chip package and method of manufacturing th...
- Patent number 9,824,958
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral element isolation device
- Patent number 9,786,584
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing with rear-side structuring
- Patent number 9,627,292
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor power device
- Patent number 9,515,060
- Issue date Dec 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 9,449,902
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement
- Patent number 9,412,626
- Issue date Aug 9, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor arrangement and package having the same
- Patent number 9,263,440
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,230,880
- Issue date Jan 5, 2016
- Infineon Technolgies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements and methods for manufacturing a chip arrangement
- Patent number 9,184,066
- Issue date Nov 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device having a heat sink
- Patent number 9,147,631
- Issue date Sep 29, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,123,526
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module, an insulation material and a method for fabricating a...
- Patent number 9,117,786
- Issue date Aug 25, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...
- Publication number 20210036610
- Publication date Feb 4, 2021
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Methods of Manufacturing Inductor Modules and Power Semiconductor S...
- Publication number 20200212798
- Publication date Jul 2, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing an SMD Package with Top Side Cooling
- Publication number 20200144150
- Publication date May 7, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190304858
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT FOR ELECTRICAL CONNECTORS
- Publication number 20190148332
- Publication date May 16, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080973
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Systems Having Inductor Modules, and Methods of...
- Publication number 20190081562
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080980
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package
- Publication number 20180301398
- Publication date Oct 18, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20170047315
- Publication date Feb 16, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Having Inner and Outer Semiconductor Compon...
- Publication number 20160111346
- Publication date Apr 21, 2016
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20160064255
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20160056092
- Publication date Feb 25, 2016
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20150294926
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270208
- Publication date Sep 24, 2015
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Fabricating an Electronic Device
- Publication number 20150214133
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20150162287
- Publication date Jun 11, 2015
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Multiple Lead Frames and Methods of F...
- Publication number 20150060878
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Power Device
- Publication number 20140284777
- Publication date Sep 25, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER STRUCTURE, CHIP PACKAGE AND METHOD OF MANUFACTURING TH...
- Publication number 20140252577
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARRANGEMENT AND A METHOD OF MANUFACTURING A PACKAGE ARRANGE...
- Publication number 20140252537
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND PACKAGE HAVING THE SAME
- Publication number 20140225124
- Publication date Aug 14, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217596
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Xaver Schloegel

Person

Patents Grantslast 30 patents

Power semiconductor system having an inductor module attached to a...

Method of manufacturing a power semiconductor system

Method of producing an SMD package with top side cooling

Semiconductor package system

Methods of manufacturing inductor modules and power semiconductor s...

SMD package with flat contacts to prevent bottleneck

SMD package with top side cooling

Reinforcement for electrical connectors

Power semiconductor systems having inductor modules, and methods of...

SMD package with top side cooling

Semiconductor chip package having a repeating footprint pattern

Semiconductor component having inner and outer semiconductor compon...

Power semiconductor device

Chip carrier structure, chip package and method of manufacturing th...

Lateral element isolation device

Semiconductor housing with rear-side structuring

Multi-chip semiconductor power device

Semiconductor packages having multiple lead frames and methods of f...

Method for manufacturing a chip arrangement

Chip arrangement, a method for manufacturing a chip arrangement, in...

Module comprising a semiconductor chip

Electronic device

Chip arrangement, a method for manufacturing a chip arrangement, in...

Power transistor arrangement and package having the same

Electronic device and method for fabricating an electronic device

Chip arrangements and methods for manufacturing a chip arrangement

Semiconductor power device having a heat sink

Package-in-packages and methods of formation thereof

Module comprising a semiconductor chip

Chip module, an insulation material and a method for fabricating a...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...

Methods of Manufacturing Inductor Modules and Power Semiconductor S...

Method of Producing an SMD Package with Top Side Cooling

Method of Manufacturing a Multi-Chip Semiconductor Power Device

SEMICONDUCTOR PACKAGE SYSTEM

REINFORCEMENT FOR ELECTRICAL CONNECTORS

SMD Package with Top Side Cooling

Power Semiconductor Systems Having Inductor Modules, and Methods of...

SMD Package with Top Side Cooling

SMD Package

Leadframe and method of manufacturing the same

Semiconductor Chip Package Having a Repeating Footprint Pattern

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Semiconductor Component Having Inner and Outer Semiconductor Compon...

METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Leadframe and method of manufacturing the same

Module Comprising a Semiconductor Chip

POWER SEMICONDUCTOR DEVICE

Electronic Device and Method for Fabricating an Electronic Device

Electronic Device

Semiconductor Packages Having Multiple Lead Frames and Methods of F...

Semiconductor Power Device Having a Heat Sink

CHIP AND CHIP ARRANGEMENT

Multi-Chip Semiconductor Power Device

CHIP CARRIER STRUCTURE, CHIP PACKAGE AND METHOD OF MANUFACTURING TH...

PACKAGE ARRANGEMENT AND A METHOD OF MANUFACTURING A PACKAGE ARRANGE...

POWER TRANSISTOR ARRANGEMENT AND PACKAGE HAVING THE SAME

POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...